Skip to product information
1 of 3

Mechanic SD360 MAX No Clean Flux With Injector – Transparent Low Smoke Solder Flux for Mobile Repair

Mechanic SD360 MAX No Clean Flux With Injector – Transparent Low Smoke Solder Flux for Mobile Repair

Regular price Rs.850.00 PKR
Regular price Sale price Rs.850.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

The Mechanic SD360 MAX is a no-clean soldering flux made for mobile phone PCB rework and chip-level repair. It comes with an injector applicator so you get precise, controlled flux placement directly on the board without messy spillage. The formula stays transparent after heating, produces very low smoke during soldering, and leaves no corrosive residue on the motherboard. Technicians use it for IC reballing, BGA chip resoldering, jumper work, and general dead phone repair where clean, reliable flux flow matters. It works with both leaded and lead-free solder, making it a flexible addition to any repair bench.

SKU:MST-SUIT-236

⚖️ Weight: 0.1 kg

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Every GSM technician knows a soldering job is only as good as the flux behind it, and the Mechanic SD360 MAX earns its place on the repair bench by solving the two biggest complaints technicians have with cheap flux: smoke and sticky residue. When you're doing IC change karna on a customer's board, the last thing you want is thick white smoke clouding your microscope view or a hardened residue crust that needs extra cleaning time before the phone goes back together. This flux stays transparent as it heats, so you can actually see the pads and solder joints while you work, and once the job is done there's no corrosion creeping into nearby components over time. The injector format is what sets this version apart from bottle or tube flux. Instead of dipping a brush or squeezing a wide-mouth tube, you get a fine-tip applicator that lets you place flux exactly where the joint needs it, whether that's a single BGA ball pad or a tight cluster of ICs packed close together on a modern motherboard. That precision matters most during reballing and CPU or NAND resoldering, where excess flux running onto neighboring components can cause bridging or a board that boots into a hang on logo state after reassembly. For jumper lagana work on damaged traces, the same fine control keeps flux confined to the exact wire path instead of spreading across the board and interfering with adjacent test points. On the workflow side, this flux fits comfortably into diagnostics, hardware fault repair, and general software marna sessions where the board still needs a physical touch-up before flashing. Dead phone boards that come in after liquid damage or a failed charging port often carry oxidation on the pads, and a flux like this helps the solder wet properly again without you having to over-heat the area and risk lifting more pads. Because it works with both leaded and lead-free solder, you're not locked into a single wire type across your bench, which is useful in a Pakistani repair shop where stock varies supplier to supplier. The no-clean nature also saves real time during busy hours. When you're running through ten or fifteen boards a day, stopping to scrub every joint with isopropyl alcohol adds up fast. With SD360 MAX, the residue left behind is minimal and non-conductive, so most boards can go straight to testing without a separate cleaning pass, though a light IPA wipe is still good practice on anything going back into a sealed device. It pairs naturally with a hot air station for BGA reballing, a fine-tip soldering iron for pad-level repair, and a microscope for verifying joint quality before reassembly. Whether you're handling a charging issue, a network issue tied to a loose RF shield, or a full display problem repair that needs the board reseated, having a flux that behaves predictably under heat removes one more variable from the job. For a repair shop owner stocking consumables for multiple technicians, this is the kind of item worth keeping in bulk since it gets used on nearly every board that comes through the door for chip-level work.

Key Features

Transparent flux formula that stays clear during and after heating for better joint visibility

No-clean formulation that skips heavy post-solder cleaning on most repair jobs

Low smoke output that keeps microscope work and close-up soldering comfortable

No corrosion left on motherboard components after use

Injector applicator for precise, controlled flux placement on tight BGA and IC pads

Compatible with both leaded and lead-free solder types

Suitable for chip-level rework including reballing, resoldering, and jumper repair

Minimal residue that reduces cleanup time during high-volume repair sessions

Specifications

Brand Entity Mechanic
Product Entity SD360 MAX No Clean Flux With Injector
Technology Entity No-clean, low-smoke, non-corrosive flux formulation
Compatible Device Entities Universal mobile phone motherboards (Android and iOS chipsets)
Repair Process Entity BGA reballing, IC resoldering, PCB rework, jumper repair
Industry Entity Mobile phone repair and GSM technician industry

Compatible Devices

Universal — not device-specific. Works across Android and iPhone motherboards, BGA chipsets, and general PCB assemblies regardless of brand.

Common Repair Uses

IC and BGA reballing, chip-level resoldering, jumper wire repair on damaged traces, charging port resoldering, dead phone motherboard repair, and general pad-level cleaning before reflow or flashing.

FAQ

What is the product name?
The product name is Mechanic SD360 MAX No Clean Flux With Injector.
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is SD360 MAX.
What is this product used for?
This product is used for chip-level soldering and rework on mobile phone motherboards, including reballing, IC resoldering, and jumper repair.
Which devices are compatible with this product?
This product works with any mobile phone PCB or motherboard since it is a universal, chipset-agnostic soldering flux.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this flux need cleaning after soldering?
No, it is a no-clean formula, so most boards only need a light IPA wipe rather than full cleaning.
Can this flux be used with lead-free solder?
Yes, it works with both leaded and lead-free solder, so it fits either wire type on the bench.

Ask any Query