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Mechanic TY-V866 High Quality Solder Wire 0.3mm (40g)

Mechanic TY-V866 High Quality Solder Wire 0.3mm (40g)

Regular price Rs.480.00 PKR
Regular price Sale price Rs.480.00 PKR
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Mechanic TY-V866 solder wire gives you a 0.3mm precision diameter built for motherboard-level repair work. Made from a 63% tin, 37% lead alloy with a built-in rosin flux core, it melts at 183°C and flows smoothly across fine pads, jumpers, and IC legs without spreading or bridging nearby tracks. The 40g spool sits comfortably on a crowded repair bench and lasts through dozens of dead phone and board-level jobs. Technicians use it daily for jumper lagana work, IC reballing touch-ups, and general SMD soldering where a thicker wire would just make a mess. Reliable, consistent, and priced for daily workshop use.

SKU:MST-SOLDERING-ACCESSORIES-357

⚖️ Weight: 0.1 kg

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Description

When you're working on a dead phone motherboard with tracks packed tighter than a matchbox, wire diameter decides whether the repair goes clean or turns into a bridging nightmare. The Mechanic TY-V866 solder wire comes in 0.3mm, thin enough to lay a precise bead on IC pads, connector pins, and jumper points without flooding the surrounding area with excess tin. The alloy is a standard 63% tin to 37% lead ratio, the same eutectic mix technicians have relied on for decades because it moves straight from solid to liquid at 183°C without passing through a mushy, unstable phase. That matters when you're holding a hot iron over a board for only a few seconds — you get a clean joint before heat has a chance to lift a nearby pad or cook a component that's already stressed from a previous fault. Rosin flux runs through the core of the wire itself, so you're not reaching for a separate flux pen every time you touch the iron to a pad. As the solder melts, the flux activates first, cutting through oxidation on the pad surface and letting the tin wet evenly instead of balling up. This is the difference between a shiny, mechanically sound joint and a dull, cold one that fails the moment the phone gets dropped again. The flux content sits in the 1.0% to 3.0% range, enough to clean the joint properly without leaving thick, sticky residue that needs heavy IPA cleanup afterward. On the bench, this wire earns its place doing the small jobs that add up across a working day. Jumper lagana on a board where a trace has lifted, tacking down a fresh IC after a reball, rebuilding a charging port pad that's gone black from corrosion, or just tinning a fine-pitch connector before reflow — all of these want a thin wire, not the 0.8mm or 1mm stuff meant for bulkier hobby electronics. Using thick solder on phone-level work usually means dragging excess tin across neighboring pads and then spending ten minutes with braid trying to undo it. The 0.3mm diameter keeps deposition controlled, so you place exactly what the joint needs and move to the next point. The 40g spool is a practical size for a working technician rather than a hobbyist buying once a year. It's enough wire to get through a real repair backlog — dead after flash boards, hang on logo cases needing a reflow, charging issue repairs, network issue boards with a cracked antenna pad — without running dry mid-job and having to switch to a different gauge halfway through a repair. Because Mechanic keeps a consistent alloy ratio and flux formulation across batches, you're not fighting inconsistent melting behavior every time you open a new spool, which matters when you're doing volume work in a service center rather than the occasional repair. This wire sits at the consumables layer of your repair bench, alongside your hot air station and soldering iron, rather than as a standalone tool. It pairs naturally with a fine-tip iron, a good pair of tweezers, and a flux paste for anything BGA-related, but for everyday jumper work, pad rebuilding, and general board maintenance, the TY-V866 in 0.3mm covers the bulk of what a GSM technician touches on a normal day.

Key Features

• 0.3mm fine diameter built for precise, board-level soldering work
• 63% tin, 37% lead eutectic alloy for a fast, stable melt
• Built-in rosin flux core removes the need for a separate flux pen on small jobs
• 183°C melting point keeps heat exposure on sensitive boards short
• Bright, even solder joints with low spatter on fine-pitch pads
• 40g spool sized for regular workshop use, not one-off hobby jobs
• Low residue flux formulation cuts down on post-repair IPA cleanup
• Suitable for jumper work, IC tacking, connector pins, and pad rebuilding

Specifications

Brand Entity Mechanic
Product Entity TY-V866 Rosin Core Solder Wire 0.3mm
Technology Entity Sn63/Pb37 Eutectic Soldering Alloy
Compatible Device Entities Samsung, Oppo, Vivo, Infinix, Tecno, iPhone motherboards
Repair Process Entity SMD Soldering, Jumper Repair, IC Reballing Touch-Up
Industry Entity Mobile Phone Repair, PCB Rework

Compatible Devices

Universal — not device-specific. Suitable for use across mobile phone motherboards and PCBs from any brand, including Samsung, Oppo, Vivo, Infinix, Tecno, and iPhone series boards, since it functions as a general soldering consumable rather than a device-matched part.

Common Repair Uses

IC and jumper soldering, motherboard trace and pad repair, charging port pad rebuilding, connector pin re-tinning, SMD component reflow touch-ups, and post-reball tacking work on phone PCBs.

FAQ

What is the product name?
The product name is Mechanic TY-V866 High Quality Solder Wire 0.3mm (40g).
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is TY-V866.
What is this product used for?
This product is used for soldering, jumper repair, IC tacking, and general PCB rework on mobile phone motherboards.
Which devices are compatible with this product?
This solder wire is universal and works on any mobile phone motherboard, including Samsung, Oppo, Vivo, Infinix, Tecno, and iPhone boards.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this solder wire work for IC reballing touch-ups?
Yes, the 0.3mm diameter and rosin core make it suitable for tacking ICs and cleaning up joints after reballing, though a dedicated flux paste is still recommended for full BGA reflow work.
What is the melting point of Mechanic TY-V866 solder wire?
It melts at 183°C, matching the standard eutectic point for 63/37 tin-lead solder used in mobile repair work.