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Mechanic UFO 9in1 BGA Reballing Stencil Set for iPhone 8 to 17 Pro Max

Mechanic UFO 9in1 BGA Reballing Stencil Set for iPhone 8 to 17 Pro Max

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Mechanic UFO 9in1 stencil set covers motherboard IC reballing and tin planting for the full iPhone 8 to 17 Pro Max lineup in one book-style kit. Each of the 9 individual UFO stencils is matched to a specific iPhone generation group, so you switch between models fast without hunting for the right template. Built from AAA-grade imported steel mesh with high-temperature resistance, this set holds its shape after repeated reflow sessions. A practical addition for any GSM workshop bench doing CPU, power IC, or NAND reballing on a daily basis.

SKU:MST-SOLDERING-ACCESSORIES-998

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Description

If your repair bench handles iPhones across multiple generations, carrying separate stencils for every model wastes time you don't have during a busy shift. The Mechanic UFO 9in1 set solves that by bundling 9 dedicated stencils into a single book-style case, with each sheet mapped to a specific iPhone group from the 8 series through the 17 series. You open the book, pull out the stencil for the model on your bench, and get straight to reballing without digging through loose sheets or mixing up hole patterns.
Each stencil in the set is built for a particular motherboard layout. Earlier sheets cover iPhone 8, 8 Plus, and X together, since these share compatible IC footprints, while the XR, XS, and XS Max get their own dedicated template. From there, the 11 series, 12 series, 13 series, 14 series, 15 series, 16 series, and 17 series each get an individual stencil matched to their specific CPU, power management IC, and NAND pad layout. This model-specific approach matters because a mismatched stencil leads to solder balls landing off-pad, which turns into a dead phone after reassembly instead of a clean repair.
The steel mesh itself is AAA-grade imported material, chosen for its resistance to warping under repeated heat exposure. When you're doing tin planting on a hot air station or reflow setup, cheaper stencils tend to bow or lose hole precision after a handful of uses. This set is built to survive daily use on a busy bench without needing replacement every few weeks, which keeps your per-repair tooling cost down over time.
In practical workshop terms, this stencil set fits directly into CPU reballing, power IC reballing, and NAND/eMMC reballing workflows. After you remove a faulty IC, clean the pad, and prep the board, the correct UFO stencil goes down over the footprint so you can apply solder balls or solder paste evenly across every pad. This step is what separates a technician doing controlled reballing from someone eyeballing solder placement and hoping for the best. Even seasoned GSM technicians keep a few UFO stencils close because a slightly damaged or worn stencil is often the real reason behind a "dead after flash" or boot loop issue that looked like a software fault at first.
The book-style storage design also solves a common bench problem: loose stencils get bent, scratched, or lost in a drawer full of other tools. Having all 9 sheets organized in one case means less handling damage and faster model-to-model switching, which matters when your shop is running multiple repairs in parallel.
This set pairs naturally with a hot air rework station, a soldering microscope for pad inspection, solder paste, and a PCB fixture to hold the board steady during reballing. If your workshop already runs Mechanic, RF4, or Aifen equipment, this stencil set slots into that same reballing workflow without any compatibility concerns. For technicians in Lahore, Karachi, and Islamabad handling walk-in iPhone motherboard repairs across a wide range of models, this kind of multi-generation coverage in a single kit cuts down both tool clutter and the time lost swapping between separate single-model stencils.

Key Features

  • 9 dedicated stencils covering iPhone 8 through iPhone 17 Pro Max motherboard IC groups
  • Book-style storage case keeps every stencil organized and protected from bending
  • AAA-grade imported steel mesh resists warping under repeated heat exposure
  • Model-specific hole patterns matched to each iPhone generation's IC footprint
  • Suitable for CPU, power IC, and NAND/eMMC reballing on motherboard repairs
  • High-temperature resistance for use during hot air reflow and reballing sessions
  • Compact single-kit solution replaces carrying separate stencils per model
  • Fits standard reballing workflow alongside hot air stations and PCB fixtures

Specifications

Brand Entity Mechanic
Product Entity UFO 9in1 BGA Reballing Stencil Set
Technology Entity BGA Reballing / Tin Planting Stencil
Compatible Device Entities iPhone 8 to iPhone 17 Pro Max series
Repair Process Entity Motherboard IC Reballing, CPU Reballing, NAND Reballing
Industry Entity Mobile Repair Tools, PCB Repair Equipment

FAQ

What is the product name?
The product name is Mechanic UFO 9in1 BGA Reballing Stencil Set for iPhone 8 to 17 Pro Max.
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is the UFO 9in1 Stencil Set.
What is this product used for?
This product is used for motherboard IC reballing and tin planting during iPhone board-level repair.
Which devices are compatible with this product?
This product is compatible with iPhone 8, 8 Plus, X, XR, XS, XS Max, and the 11 through 17 series including Pro Max variants.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional GSM workshop users.
Does this stencil set work for CPU and power IC reballing on the same board?
Yes, the individual UFO stencils in this set are matched to each iPhone generation's CPU and power IC pad layout for reballing.
Can this stencil set be used with a hot air rework station?
Yes, the steel mesh is high-temperature resistant and designed for use during hot air reflow and reballing sessions.