Mechanic Z10 (0.5mm) Solder Ball 10000 Pieces

When a phone lands on your bench as a dead phone, stuck on the logo, or showing a network issue after a drop, the fault often hides under a BGA chip where one or two joints have cracked, and no amount of flashing will bring it back. That is a hardware fault, and the fix starts with lifting the IC and reballing it properly. The Mechanic Z10 (0.5mm) Solder Ball 10000 Pieces bottle handles the ball side of that job. Mechanic packs 10,000 leaded balls in one bottle under its XZ10 series, and every ball follows the Sn63/Pb37 composition, meaning 63% tin and 37% lead. Technicians call this the eutectic alloy because it turns from solid to liquid at a single point, 183°C, instead of passing through a soft, pasty range. On the bench, that means the balls collapse and wet the pads together, you run your hot air station at a lower setting than lead-free work demands, and the board around the chip takes less punishment. Size matching decides whether a reball holds. You pick ball diameter by the chip and the stencil, never by guesswork: if the original balls on the IC and the stencil apertures call for 0.5mm, this bottle drops straight into your workflow. A ball that is too small leaves weak, starved joints, while a ball that is too large bridges neighbouring pads and turns a simple repair into a short. Keep the 0.5mm bottle beside your other sizes so the right diameter sits within reach whenever a chip comes off the board. The routine stays the same whatever the chip: remove the IC with hot air, clean old solder from both the chip and the board with wick and a soldering station, apply a thin, even layer of flux, lock the IC in a PCB holder or reballing platform, set the stencil on top, and pour a few balls across it. Roll them into the holes with a brush or tweezers, tip the extra back into the bottle, then heat until every ball reflows into a clean, shiny dome. Check the result under a microscope before you place the chip back, because one missing ball on a CPU or eMMC sends the phone back to you dead after flash or with random restarts. A full count of 10,000 balls matters for a busy shop. A single CPU or memory chip can take hundreds of balls, and spills happen on every bench, so a large bottle lets you pour generously, refill a stencil when the first pass goes wrong, and still have stock for the next customer. Leaded balls also forgive a technician who is still learning reballing, since the lower melting point gives more working time and reduces the risk of lifting pads on an older board that has already seen several repairs. The round, uniform shape helps the balls roll cleanly into stencil holes without jamming, which saves you minutes on every chip. After reballing, the chip goes back on the board with flux and hot air, and then the real testing starts: power the board through a DC supply, watch the current, check lines with a multimeter, and if the job involved a memory chip, confirm it on your eMMC programmer, UFS adapter, or through ISP pinout tools before you run the box to flash firmware. That sequence catches a bad joint before the phone goes back to the customer. Keep the bottle tightly closed in a dry spot, away from flux residue and dust, because moisture and dirt on the ball surface cause poor wetting. Pour out only what the current job needs and keep your fingers off the balls. If your shop already runs a reballing kit with stencils, tweezers and flux, this bottle keeps it stocked; if you are building a board-level bench from scratch, pair it with a hot air station, a temperature-controlled soldering station, a microscope and a solid PCB holder. KB GSM Store stocks the Mechanic XZ10 series 0.5mm bottle for technicians in Lahore, Karachi, Islamabad and across Pakistan, alongside the stencils, flux and rework equipment you need to finish the job right.