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Brand: MIJING

Mijing 183°C Solder Paste Liquid Soldering Welding Paste

Mijing 183°C Solder Paste Liquid Soldering Welding Paste

Regular price Rs.800.00 PKR
Regular price Sale price Rs.800.00 PKR
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Mijing 183°C Solder Paste is a Sn63/Pb37 eutectic soldering paste built for mobile repair benches where precision matters. With a sharp 183°C melting point, it flows evenly across pads, wets components fast, and leaves minimal residue behind. Technicians use it for SMD component soldering, BGA reballing, IC replacement, and general motherboard rework. The fine paste consistency makes it easy to apply on tight, densely packed boards without bridging pins. Whether you're doing a quick IC change or a full board rework, this paste gives you a stable, low-mess soldering process on your repair bench.

SKU:MST-SOLDERING-ACCESSORIES-545

⚖️ Weight: 0.03 kg

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Description

Every GSM technician knows the difference between a clean solder joint and a rushed one — it shows up later as a dead phone or a hang-on-logo callback. Mijing 183°C Solder Paste solves that problem at the source. Built on a Sn63/Pb37 eutectic alloy, it transitions from liquid to solid at a precise 183°C, so you get a sharp, uniform melt instead of a mushy, partial one. That sharp melting behavior is exactly what you want when you're doing IC change on a tightly packed motherboard, where uneven heating risks lifting neighboring components.The paste comes with an integrated flux that actively cleans oxidation off pads and component legs before the solder bonds. You don't fight dull, oxidized copper anymore — the flux strips it clean, so your joint forms fast and holds. This matters most on boards that have already been reworked once or twice, where pad oxidation is already a problem before you even start.On your repair bench, this paste fits directly into SMD soldering, BGA reballing, and general PCB rework. Apply it under the IC or BGA chip you're reballing, place your stencil, and reflow — the paste holds the balls in position while it liquefies, then locks them down cleanly as it cools. For SMD components like resistors, capacitors, or small ICs, a light layer under a hot air gun gives you fast, bridge-free joints without babysitting the process. The fine particle structure keeps the paste from clumping, so you get consistent coverage even on boards with tight component spacing.Residue is kept low by design. After reflow, you're left with a light, easy-to-wipe residue instead of a sticky mess that needs heavy IPA scrubbing. That saves cleanup time between jobs, especially when you're running multiple boards through your bench in a single day.For dead-after-flash boards, charging issue repairs, or a board that's hanging on logo because of a cracked IC joint, this paste gives you the reliability to reflow and move on without second-guessing the joint quality. Pakistani technicians running high board volumes — service centers doing 15-20 boards a day — need paste that behaves the same way every time, and that consistency is what keeps repeat customers off your bench for the same fault.Store the paste in a cool, dry spot away from direct heat, and keep the container sealed tightly after each use — exposure to air and heat dries out the flux and changes how the paste flows. Handled properly, it stays workable for extended use, which matters if you're not running it daily.Whether you're a solo technician handling walk-in repairs or running a full-service GSM shop with multiple benches, Mijing 183°C Solder Paste gives you a dependable soldering base for IC repair, BGA rework, PCB soldering, and everyday motherboard fault fixing — without unpredictable joint quality getting in the way of your turnaround time.

Key Features

  • Sn63/Pb37 eutectic alloy for a sharp, uniform 183°C melt
  • Integrated rosin flux cleans oxidation before bonding
  • Fine paste consistency for precise application on dense boards
  • Low residue finish — reduces post-repair cleanup
  • Strong wetting performance on pads and component legs
  • Suitable for hot air stations, reflow, and manual soldering irons
  • Reliable for BGA reballing and stencil work
  • Stable joint formation without bridging on tight-pitch components

Specifications

Brand Entity Mijing
Product Entity 183°C Solder Paste
Technology Entity Sn63/Pb37 Eutectic Alloy Soldering
Compatible Device Entities Mobile Phone Motherboards, PCB Assemblies
Repair Process Entity BGA Reballing, SMD Soldering, IC Repair
Industry Entity Mobile Repair Industry, GSM Repair, PCB Repair

Compatible Devices


Universal — not device-specific. Suitable for use across mobile phone motherboards, PCBs, and electronic assemblies regardless of brand (Samsung, Oppo, Vivo, Infinix, Tecno, iPhone, and other smartphone boards) wherever SMD or BGA soldering is required.

Common Repair Uses

IC removal and replacement, BGA chip reballing, SMD component soldering, motherboard rework, charging port repair, dead-after-flash board recovery, and general PCB rework on mobile repair benches.

FAQ

What is the product name?
The product name is Mijing 183°C Solder Paste – Liquid Soldering Welding Paste.
What is the brand of this product?
The brand of this product is Mijing.
What is this product used for?
This product is used for SMD soldering, BGA reballing, IC repair, and general PCB rework on mobile repair benches.
Which devices are compatible with this product?
This product works across mobile phone motherboards and PCBs from all major brands, since it is a universal soldering material rather than device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional electronics repair users.
Which alloy does this solder paste use and why does 183°C matter?
It uses a Sn63/Pb37 eutectic alloy that melts sharply at 183°C, giving a clean liquid-to-solid transition instead of a gradual, uneven melt — important for avoiding cold solder joints on IC and BGA work.
Can this paste be used for reballing dead-after-flash boards?
Yes, it's commonly used in BGA reballing and IC reflow work on boards affected by dead-after-flash or hang-on-logo faults, where a clean reflow restores a stable joint.