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MT6308P Power IC

MT6308P Power IC

Regular price Rs.350.00 PKR
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The MT6308P is a MediaTek power management IC (PMIC) built for MediaTek-based smartphones and portable devices. It handles voltage regulation, battery charging control, and load distribution on the motherboard through integrated buck converters and LDOs. Technicians use this IC to fix dead phone, no power, unstable charging, and overheating faults at chip level. Its compact WLCSP package suits slim device boards, and I2C communication keeps it in sync with the host processor. A reliable pick for your repair bench when a power fault traces back to the PMIC.

⚖️ Weight: 0.01 kg

SKU:MST-IC-221

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Description

When a phone comes into your shop dead, hangs on logo, or keeps restarting on its own, the fault often sits on the power rail before it ever reaches the CPU or baseband. The MT6308P is MediaTek's power management IC, built to regulate multiple voltage rails on a single chip and keep the rest of the board running on stable power.Inside, the MT6308P combines high-efficiency buck converters with LDOs (low-dropout regulators) to step down and clean the battery voltage before distributing it to the processor, memory, display driver, and other components on the board. This multi-rail design means one IC failure can knock out power to several subsystems at once, which is why a dead phone with no charging response often points straight back to this chip.The IC communicates with the host processor over I2C, so the system can adjust voltage output dynamically based on load. When you're chasing a board that draws current but won't power on, or one that charges without turning on, checking the I2C lines and power rails around the MT6308P is a standard diagnostic step. Its GPIO pins add flexibility for device-specific power sequencing, which is one reason different MediaTek platforms wire this IC slightly differently on the board.The MT6308P ships in a WLCSP (wafer-level chip-scale package), a compact footprint built for slim phone and wearable boards where space around the PMIC is tight. That small size does mean reballing this chip needs a steady hand, a fine-pitch stencil, and consistent hot air control — rushing the reflow on a WLCSP part is a common reason for a "dead after flash" repeat visit.On the repair bench, this IC shows up in a handful of recurring fault patterns. A phone with no power at all, one that shows charging current on the multimeter but never boots, one that overheats near the power section under load, or one that drains the battery unusually fast even when idle — all of these are worth checking against the MT6308P before you move on to CPU or baseband-level diagnosis. Since the chip also handles thermal protection functions, a board that shuts down under gaming or video load without an obvious CPU fault is another case worth checking here.Before reballing or replacing, always verify the fault isn't a jumper or track issue on the board first — swapping a PMIC when the real fault is a broken trace wastes both the IC and your time. Once you've confirmed the power rail is the problem, replacing the MT6308P follows the same workflow as other WLCSP power ICs: remove the old chip with controlled hot air, clean the pads, apply fresh solder balls if needed, and reflow with accurate temperature profiling to avoid dead-after-flash outcomes.For technicians handling MediaTek-based boards regularly, keeping genuine MT6308P stock on the bench cuts down diagnostic-to-repair time. A counterfeit or reworked chip from an unverified source is one of the most common reasons a "fixed" board comes back with the same power fault within days, so sourcing from a supplier that can confirm chip authenticity matters as much as the repair technique itself.This IC fits into the board-level repair workflow right after your power-rail diagnostics and before you move to IC-level or software-level checks — it's the first hardware suspect when a MediaTek device shows no power, unstable charging, or thermal shutdown symptoms with no other visible board damage.

Key Features

Original MediaTek MT6308P power management IC for chip-level board repair

Integrated buck converters and LDOs for multi-rail voltage regulation

I2C communication for dynamic voltage adjustment with the host processor

Compact WLCSP package suited to slim smartphone and wearable boards

Built-in thermal management support for stability under load

GPIO pins for flexible, device-specific power sequencing

Addresses dead phone, no-power, and unstable charging faults

Suitable for chip-level repair engineers, service centers, and repair shops

Specifications

Brand Entity MediaTek
Product Entity MT6308P Power Management IC
Technology Entity Buck Converter / LDO Power Regulation, I2C Communication
Compatible Device Entities MediaTek-based Smartphones and Portable Devices
Repair Process Entity Chip-Level PMIC Reballing and Replacement
Industry Entity Mobile Repair Industry, PCB Repair

Compatible Devices

MediaTek-based smartphones, tablets, and portable devices using the MT6308P power management chipset (chipset-family level compatibility; verify against the specific board's IC layout before replacement)

Common Repair Uses

Dead phone / no power repair, unstable or no-charging faults, overheating near the power section, unexpected shutdowns or restarts linked to power delivery, and chip-level PMIC reballing and replacement on MediaTek boards

FAQ

What is the product name?
The product name is MT6308P Power Management IC.
What is the brand of this product?
The brand of this product is MediaTek.
What is this product used for?
This product is used to repair dead phone, no-power, and unstable charging faults caused by a failed power management IC.
Which devices are compatible with this product?
This product is compatible with MediaTek-based smartphones and portable devices that use the MT6308P chipset.
Who should use this product?
This product is suitable for mobile repair technicians, chip-level repair engineers, service centers, and professional repair shops.
What package type does the MT6308P come in, and does that affect reballing difficulty?
The MT6308P uses a WLCSP package, which is compact and requires a fine-pitch stencil and controlled hot air reflow during reballing.
Can a faulty MT6308P cause overheating or unexpected shutdowns instead of a dead phone?
Yes, since the IC handles thermal protection and voltage regulation, a fault here can also cause overheating under load or random shutdowns without a visible power-off symptom.

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