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MT6357CRV Power IC

MT6357CRV Power IC

Regular price Rs.350.00 PKR
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The MT6357CRV is a MediaTek power management IC built for MTK-based smartphones running on Helio-series chipsets. It handles voltage regulation, battery charging control, and power distribution to the CPU, modem, camera, and display sections. Technicians use this IC to fix dead phone faults, charging issues, and hang on logo problems linked to power sequencing failure. The chip runs on 5 buck converters and 29 LDOs inside a compact VFBGA package, giving your repair bench a direct replacement part for common OPPO, Realme, Redmi, and Samsung PMIC faults without guessing on pinout or voltage rails.

⚖️ Weight: 0.01 kg

SKU:MST-IC-34

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Description

Every MTK-based smartphone depends on one chip to decide whether the board even powers on, and that chip is the MT6357CRV. Designed by MediaTek, this PMIC sits between the battery and every major subsystem on the board, controlling how voltage reaches the processor, modem, RAM, camera, and audio circuits. When a phone shows dead after flash, boot loop issue, or hang on logo with no obvious hardware fault, this IC sits at the top of your diagnostic list.Inside the chip, MediaTek packed 5 buck converters and 29 LDOs to manage separate voltage rails for different sections of the board. That separation matters on the bench: a fault on the VPROC rail behaves completely differently from a fault on the VMODEM or VCORE rail, and this IC governs all of them from a single 209-pin VFBGA package measuring 7.0 x 6.6mm. The chip communicates with the baseband through an SPI interface and uses SRCLKEN control pins to manage the buck converters, LDOs, and driver circuits, so a corrupted handshake here often shows up as a network issue or a phone that boots but never registers on the SIM.On the charging side, the MT6357CRV follows USB Battery Charging Specification BC1.2, and it carries built-in overcurrent and thermal overload protection along with programmable under-voltage lockout. This is exactly why a charging issue that survives a battery swap and a charging port repair often traces back to this chip instead. The IC also runs a watchdog reset function and a flexible hardware PMIC reset path, so software marna alone will not fix a phone stuck in a boot loop if the reset logic inside this chip has failed.Reballing this part demands precision because of the VFBGA pitch and the number of power domains packed into the package. Jumper lagana on individual rails is not a realistic fix here — the ball layout is too dense for wire bridging, and any misalignment during reflow risks shorting adjacent VSYS or ground pins. A hot air station with accurate temperature control, a stencil matched to the 209-pin layout, and a microscope for post-reflow inspection are the minimum tools for a clean IC change karna job on this chip.Field data from repair shops shows this exact PMIC installed on OPPO A1K, OPPO A5S, OPPO A12, Realme C2, Redmi 6A, and Samsung A107F boards, along with wider use across Xiaomi, Redmi, Vivo, Infinix, and Honor devices running MediaTek Helio-series platforms. Before ordering a replacement, always confirm the exact IC marking on the board against MT6357CRV, since MediaTek ships close variants like MT6357MRV and MT6357V that look identical under a microscope but carry different firmware calibration.This IC fits directly into your PCB repair workflow after board-level diagnostics rule out the charging IC and battery. Pair it with a preheated hot air station, no-clean flux, and a fine-tip soldering iron for surrounding component work, and confirm the fix with a load test before closing the board. For technicians running a high-volume repair shop, stocking this PMIC alongside its VMRV and V variants covers the majority of MediaTek dead phone and charging issue cases that come across the bench every week.

Key Features

  • 5 integrated buck converters for separate voltage rail management
  • 29 LDO regulators covering processor, modem, and peripheral power domains
  • SPI interface with SRCLKEN control pins for baseband handshake
  • USB BC1.2 compliant charging control
  • Built-in overcurrent and thermal overload protection
  • Programmable under-voltage lockout protection
  • Watchdog reset and flexible hardware PMIC reset function
  • Precision voltage, temperature, and current measurement fuel gauge

Specifications

Brand Entity MediaTek Product Entity

Compatible Devices


MediaTek Helio-series (MT67xx platform) smartphones, including verified boards on OPPO A1K, OPPO A5S, OPPO A12, Realme C2, Redmi 6A, and Samsung A107F, with broader use across Xiaomi, Redmi, Vivo, Infinix, and Honor MTK-based models. Confirm exact IC marking on the board before ordering, since MT6357MRV and MT6357V are similar-looking variants.

Common Repair Uses

Power IC replacement for dead phone faults, boot loop issue troubleshooting, hang on logo diagnosis, charging issue repair, network issue related to baseband power handshake, and board-level reballing during PCB repair on MediaTek Helio-series devices.

FAQ

What is the product name?
The product name is MT6357CRV MediaTek Power Management IC.
What is the brand of this product?
The brand of this product is MediaTek.
What is the model of this product?
The model of this product is MT6357CRV.
What is this product used for?
This IC regulates power distribution, battery charging, and voltage delivery across the CPU, modem, camera, and display sections of MediaTek-based smartphones.
Which devices are compatible with this product?
This IC is verified on OPPO A1K, OPPO A5S, OPPO A12, Realme C2, Redmi 6A, and Samsung A107F, with wider compatibility across Xiaomi, Redmi, Vivo, Infinix, and Honor devices built on MediaTek Helio-series platforms.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this IC support ISP mode or SPI-based diagnostics for dead phones?
Yes, the MT6357CRV communicates with the baseband over an SPI interface, which technicians use during board-level diagnostics on dead phone cases before deciding on IC replacement.
What package type does this IC use, and does it affect reballing difficulty?
It uses a 209-pin VFBGA package at 7.0 x 6.6mm, which requires a stencil-matched hot air reflow process rather than manual jumper work due to the dense ball pitch.

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