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MT6359VKP Power IC

MT6359VKP Power IC

Regular price Rs.350.00 PKR
Regular price Sale price Rs.350.00 PKR
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The MT6359VKP is a BGA-packaged power management IC (PMIC) used on the motherboards of Redmi Note 8, Redmi Note 8 Pro, Oppo Reno2, and Vivo Nex 3. It regulates battery charging, voltage distribution, and power sequencing across the board. Technicians reach for this IC when a phone shows dead-after-drop symptoms, no power-on, abnormal charging current, or unstable voltage rails after a liquid damage repair. Reflow and replacement require BGA soldering experience and a hot air rework station. Genuine, tested stock for your repair bench.

⚖️ Weight: 0.01 kg

SKU:MST-IC-142

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Description

Power IC failures rank among the toughest boards a technician sees on the bench. When a Redmi Note 8, Note 8 Pro, Oppo Reno2, or Vivo Nex 3 comes in completely dead, drawing zero current on the DC power supply, or charging but never powering on, the MT6359VKP power IC is one of the first suspects worth checking. This PMIC sits close to the battery connector and CPU power rails, so any physical shock, liquid exposure, or short circuit tends to hit it directly.On the workshop floor, a "dead phone" with no current draw at all usually points to a short somewhere on the power rail, and after isolating the fault with a thermal camera or short killer, the MT6359VKP often turns out to be the component absorbing the damage. You'll also see it named when a board charges normally but refuses to boot past the logo, or when the phone works fine on a bench power supply but dies the moment the original battery goes back in — both are classic power sequencing symptoms tied to this chip rather than the battery itself.Replacing it isn't a job for a soldering iron alone. This is a BGA component, so it needs a hot air rework station set to the correct profile, proper flux, and a steady hand to avoid lifting pads on a board this dense. Reballing is often necessary if the original balls get damaged during removal, and a microscope helps confirm alignment before reflow — a shifted IC on a board this size will short the very rails you're trying to fix. Preheating the board evenly before hot air work reduces the risk of board warping, especially on the Reno2 and Nex 3 boards, which pack components tightly around this area.Before ordering, confirm the fault is genuinely IC-level and not a cracked solder joint or a damaged connector pad. A lot of "power IC dead" boards on the bench turn out to be a hairline crack from a drop, and reflowing the existing chip with hot air resolves it without needing a replacement at all. Where the IC itself has failed — usually visible as physical damage, a confirmed short across a specific rail, or component-level testing showing an open circuit — swapping in a genuine MT6359VKP restores normal charging behavior, stable voltage output, and correct power-on sequencing.This listing carries new, tested stock rather than pulled or reclaimed components, which matters on a PMIC — a used power IC with hidden thermal stress is a common cause of repeat failures after reballing. Every unit ships ready for direct reflow onto the compatible boards listed above.Keep in mind this IC is device-specific to the boards it was designed for. Don't attempt a cross-board swap onto an unlisted model even if the physical footprint looks similar — PMIC firmware and rail mapping differ across MediaTek and Qualcomm platforms, and a mismatched IC can damage the board further. If you're unsure whether your board's fault is power IC-related, isolating the short first with a DC power supply and thermal camera before ordering will save you a wasted reflow cycle.

Key Features

Genuine MediaTek MT6359VKP power management IC in BGA package

New, tested stock — not pulled or reclaimed

Verified compatibility with Redmi Note 8, Note 8 Pro, Oppo Reno2, and Vivo Nex 3

Manages battery charging and voltage regulation across the motherboard

Common fix for dead-after-drop and no-power-on boards

Suitable for hot air rework and reballing workflows

Compact BGA footprint fits standard board layouts for these models

Ships ready for direct reflow onto compatible boards

Specifications

Brand Entity MediaTek
Product Entity MT6359VKP Power IC
Technology Entity PMIC (Power Management Integrated Circuit), BGA packaging
Compatible Device Entities Redmi Note 8, Redmi Note 8 Pro, Oppo Reno2, Vivo Nex 3
Repair Process Entity BGA reballing, hot air reflow, power rail diagnostics
Industry Entity Mobile phone motherboard repair, GSM technician workshop tools

Compatible Devices

Redmi Note 8, Redmi Note 8 Pro, Oppo Reno2, Vivo Nex 3

Common Repair Uses

Dead phone / no power-on repair, charging fault diagnosis, board-level short circuit repair after liquid damage, power rail reballing and reflow, hang-on-logo troubleshooting linked to power sequencing faults

FAQ

What is the product name?
The product name is the MT6359VKP Power IC.
What is the brand of this product?
The brand of this product is MediaTek.
What is the model of this product?
The model of this product is MT6359VKP.
What is this product used for?
This product is used to replace a faulty power management IC responsible for battery charging and voltage regulation on the motherboard.
Which devices are compatible with this product?
This product is compatible with Redmi Note 8, Redmi Note 8 Pro, Oppo Reno2, and Vivo Nex 3.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the MT6359VKP handle both charging and power sequencing on these boards?
Yes, this IC manages battery charging current and coordinates power-on sequencing to the CPU and other rails, which is why a fault here often shows up as either a charging issue or a dead phone with no power-on.
Can a damaged MT6359VKP be reflowed instead of replaced?
If the original IC has a cracked solder joint rather than internal chip damage, reflowing it with a hot air station can resolve the fault without needing this replacement — replacement is only needed when the chip itself has failed.

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