When you're pulling a stubborn BGA chip off a dead motherboard, the fixture holding that chip matters as much as the hot air gun heating it, and the MY IC Chip Degumming Station is built around that exact problem: keeping a chip dead still while you work glue, adhesive, or underfill away from its pads without shifting the component mid-process. The tempered glass panel sits directly over a metal base, giving you a surface that shrugs off repeated heat exposure from hot air rework without warping, discoloring, or holding onto melted adhesive between jobs, which matters if you're running back-to-back degumming sessions on a busy bench. You adjust the clamping width with a stepless knob rather than fixed notches, so you dial in the exact pressure a small memory IC needs versus a larger CPU or PMIC package, and that fine control is what keeps thin pads from cracking when the chip is already softened by heat. Two limiting thicknesses are built into the fixture itself, 0.2mm and 0.4mm, giving you a hard stop that protects chip pins and solder pads from over-clamping, which is one of the more common ways technicians damage a chip that was otherwise still reusable after a glue removal job. The dual working-station layout means you're not limited to one chip at a time; you can set up a second board or a second chip in the other station and move between them while one cools or while you wait on hot air to loosen adhesive, which cuts real time off a repair queue when you're handling several dead phones or boot loop boards in the same shift. This kind of fixture earns its place early in the repair workflow, right after diagnostics confirms an IC-level fault, whether that's a phone stuck on logo, a charging IC suspected of causing a charging issue, or a PMIC tied to a boot loop issue that needs the chip lifted for reballing or replacement. Technicians working iPhone motherboards use it constantly for CPU and NAND-adjacent glue removal before reballing, and the same fixture handles Android board work just as well, since the clamping mechanism responds to chip size rather than any single brand's board layout. Once the chip is degummed and off the board, this fixture also holds it steady if you need to inspect pads under a microscope or prep it for a programmer before it goes back on, so it earns a spot in your reballing and CPU repair workflow alongside your hot air station, tweezers, and a soldering iron rather than sitting as a one-task tool. Build quality holds up under high-frequency use too; the metal base resists the physical wear that comes from a fixture getting clamped and released dozens of times a day, and the glass surface stays flat and heat-stable instead of degrading the way plastic jigs tend to after a few months of hot air exposure. At 64x50x19mm, it takes up almost no bench space, so it sits next to your soldering station without crowding your existing PCB holders, hot air brackets, or test boxes. If your workshop deals with dead-after-flash boards, hang on logo faults, or repeated PMIC and charging IC swaps, this fixture removes the guesswork from clamping pressure and gives you a repeatable, chip-safe way to run degumming as a standard step rather than an improvised one.
