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PM886EAD POWER IC

PM886EAD POWER IC

Regular price Rs.190.00 PKR
Regular price Sale price Rs.190.00 PKR
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The PM886EAD Power IC is the core power supervisor chip on Samsung Galaxy G531 Grand Prime VE, G361F Core Prime VE, G388F Xcover 3, and J100 Galaxy J1 motherboards. When you get a dead phone, no-power fault, or boot loop issue on these models, this BGA chip is one of the first components you check on the bench. It handles voltage regulation and power sequencing from the moment the power button gets pressed. KBGSMSTORE supplies this IC in original condition, ready for reballing and direct-heating repair jobs at your workshop. Stock it for faster turnaround on dead-after-flash and hardware fault cases coming into your service center.

⚖️ Weight: 0.01 kg

SKU:MST-IC-31

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Description

The PM886EAD sits in the power management layer of the motherboard, acting as the supervisor IC that controls how voltage reaches the rest of the board. On the Samsung G531 Grand Prime VE, G361F Core Prime VE, G388F Xcover 3, and J100 Galaxy J1, this chip decides whether the phone powers on at all. If the supervisor rail doesn't come up clean, you get a dead phone that won't respond to a charger, won't show a charging LED, and won't boot past the logo — even though the battery, charging port, and display are all fine.This is why the PM886EAD comes up so often in dead-board diagnostics. A technician running current on a DC power supply will usually see either zero draw or an abnormal short when this IC has failed, which narrows the fault down fast compared to chasing individual voltage rails one by one. Boot loop issues, hang on logo faults, and phones that go dead after flash often trace back to a damaged or poorly reflowed power supervisor IC rather than a software fault — so before you spend time on a repeated software marna attempt, it's worth confirming the power rail is stable first.Since this is a BGA package, replacement is a reballing job, not a simple solder-and-go swap. You'll need a hot air rework station set to the correct profile, flux, BGA reballing stencil or paste, and a microscope or magnifier for placement accuracy. Getting the reflow temperature and dwell time right matters here — overheating the pads risks lifting traces on these smaller Samsung boards, and underheating leaves cold joints that come back as an intermittent charging issue or random restarts a few days later. Clean the pads thoroughly, check for lifted pads under the microscope before placing the new IC, and reflow with steady, even heat rather than direct blasting.Board-level technicians working ISP, eMMC, or UFS-based repair services will recognize this chip as part of the wider Qualcomm PM-series power IC family used across Samsung's Snapdragon-based J and G series lineup. Keeping a few PM886EAD units on the bench means you're not waiting on a supplier every time a dead G531 or J100 comes in — a common repair request in Pakistani service centers given how widely these models still circulate.KBGSMSTORE ships this as an original, tested unit — not a generic aftermarket clone — so what you install matches the factory power specification the board was designed around. For shops handling volume repair work on entry-level Samsung devices, this is a part worth keeping in stock rather than sourcing per-job.

Key Features

  • Original PM886EAD power supervisor IC, not a generic clone
  • Direct fit for Samsung G531, G361F, G388F, and J100 motherboards
  • BGA package designed for hot air reballing and direct-heating repair
  • Controls power-on sequencing and voltage regulation at board level
  • Common fix for dead phone, no-power, and boot loop faults
  • Helps resolve dead-after-flash symptoms tied to power rail faults
  • Compact chip footprint suited for compact Samsung J and G series boards
  • Tested unit ready for immediate installation on the repair bench

Specifications

Brand Entity Qualcomm
Product Entity PM886EAD Power Management IC
Technology Entity BGA Power Supervisor IC
Compatible Device Entities Samsung Galaxy G531, G361F, G388F, J100
Repair Process Entity BGA Reballing, Power Rail Diagnostics
Industry Entity Mobile Repair, PCB Repair, GSM Technician Workshop

FAQ

What is the product name?
The product name is PM886EAD Power IC.
What is the brand of this product?
This is a Qualcomm PM-series power management IC.
What is the model of this product?
The model is PM886EAD.
What is this product used for?
It's used to replace a faulty power supervisor IC that controls voltage regulation and power-on sequencing on the motherboard.
Which devices are compatible with this product?
It's compatible with Samsung Galaxy G531 Grand Prime VE, G361F Core Prime VE, G388F Xcover 3, and J100 Galaxy J1.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does replacing the PM886EAD require BGA reballing?
Yes, it's a BGA package, so you need a hot air rework station and a reballing stencil or paste for proper reflow.
Can a faulty PM886EAD cause a dead phone with no charging response?
Yes, since it supervises the board's power sequencing, a failed or poorly seated PM886EAD commonly causes a dead phone with no charging LED and no boot response.

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