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PM8956 Power IC

PM8956 Power IC

Regular price Rs.250.00 PKR
Regular price Sale price Rs.250.00 PKR
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The PM8956 is a Qualcomm power management IC (PMIC) in BGA package, used as a motherboard-level replacement part for phones running Snapdragon 617/650-family platforms. Technicians reach for this IC when a device shows dead phone symptoms, no power, or hang on logo after a fall, short, or liquid damage. It handles voltage regulation and power distribution across the board, so a faulty PM8956 often shows up as no charging response, no display, or a board that draws current but never boots. Genuine for board-level GSM repair work, not a retail accessory.

⚖️ Weight: 0.01 kg

SKU:MST-IC-156

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Description

Every technician who has chased a dead board knows the drill: charger connected, current draw shows on the power supply, but the phone stays lifeless. On a lot of Snapdragon 617 and 650-family devices, that symptom traces straight back to the PM8956. This IC sits at the center of the power tree, taking input from the battery and charging circuit and stepping it down into the multiple regulated rails the CPU, RAM, and peripherals depend on. When it goes bad, the board loses its ability to sequence power correctly, and the phone won't boot no matter what software fix you try.
You'll usually get called to this chip after a liquid damage case, a drop that cracked a solder joint, or a board that's been sitting with a dead short for too long. Before reaching for the hot air station, confirm you're actually dealing with a PM8956 fault and not a charging IC or battery connector issue — check for shorts on the power rails first, since replacing a good IC won't fix a shorted rail elsewhere on the board.This part ships as a bare BGA chip, so reballing is part of the job. Use a matching stencil for the PM8956 footprint, keep your preheat stage controlled to avoid lifting neighboring components, and reflow with a hot air station set for lead-free solder if that's what the donor board originally carried.A microscope helps a lot here — the ball pitch is tight enough that a misaligned placement will cost you a second reflow cycle.Boards that use the PM8956 usually pair it with the PMI8952 audio/power companion chip and, depending on model, a WCN3615 or WCN3680B Wi-Fi/Bluetooth combo IC. If your dead-board diagnosis points to a wider power issue rather than a single failed rail, check those companion ICs too before you commit to a PM8956 swap — some boards fail at the companion chip level and the PM8956 tests fine.Confirmed devices using this exact IC include the Xiaomi Mi Max, Redmi Note 3 (Snapdragon 650 variant), and Samsung Galaxy A9 Pro 2016 (A910F / SM-C9000). If you're working a different model with a Snapdragon 617 or 650 chipset and a dead-after-flash or no-power fault, cross-check the schematic before ordering — power IC part numbers vary even within the same chipset family.Store and handle this component in an anti-static bag until you're ready to reball. PMICs are sensitive to ESD damage, and a chip that tests dead on arrival is almost always the result of poor static handling rather than a manufacturing fault. Keep your workbench grounded and use a wrist strap when handling the bare IC.
For repair shops running Snapdragon-based board-level work regularly, keeping a small stock of PM8956 units on hand alongside your ISP jig and hot air station cuts turnaround time on dead-phone jobs considerably — this is one of the more frequently replaced PMICs in the mid-range Snapdragon lineup.

Key Features

  • GenuineQualcomm power management IC in BGA package
  • Handlesvoltage regulation and power rail distribution for Snapdragon617/650-family boards
  • Directreplacement for dead phone and no-power board faults
  • Lead-free,RoHS-compliant construction
  • Confirmedfit for Xiaomi Mi Max, Redmi Note 3, and SamsuA9 Pro 2016 boards
  • Pairs with PMI8952 companion IC on affected motherboards
  • Suitable for reballing with standard BGA rework equipment
  • Ships in anti-static packaging for safe handling

Specifications

Brand Entity Qualcomm
Product Entity PM8956 Power Management IC
Technology Entity Snapdragon 617/650 power management architecture
Compatible Device Entities Xiaomi Mi Max, Redmi Note 3, Samsung Galaxy A9 Pro 2016
Repair Process Entity BGA reballing, board-level IC replacement, power rail diagnostics
Industry Entity Mobile phone motherboard repair, GSM hardware repair

Compatible Devices

Xiaomi Mi Max, Xiaomi Redmi Note 3 (Snapdragon 650 variant), Samsung Galaxy A9 Pro 2016 (A910F / SM-C9000). General compatibility scope: Qualcomm Snapdragon 617/650-family boards — confirm against board schematic for other models.

Common Repair Uses

Dead phone / no power repair, board that draws current but won't boot, hang on logo after liquid damage or short circuit, power rail fault diagnosis, BGA reballing and IC replacement on Snapdragon-based motherboards.

FAQ

What is the product name?
The product name is PM8956 Power IC.
What is the brand of this product?
The brand of this product is Qualcomm.
What is the model of this product?
The model of this product is PM8956.
What is this product used for?
This product is used to replace a faulty power management IC on dead phone or no-power motherboards.
Which devices are compatible with this product?
This product is compatible with the Xiaomi Mi Max, Redmi Note 3 (Snapdragon 650 variant), and Samsung Galaxy A9 Pro 2016 (A910F).
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional GSM hardware technicians.
Does the PM8956 fault always cause a completely dead phone, or can it show partial symptoms?
A failing PM8956 can cause either a fully dead board or partial symptoms like hang on logo, no charging response, or random restarts, depending on which power rail is affected.
Is a hot air rework station enough to replace the PM8956, or do I need a BGA reballing kit too?
You need both — a hot air station for reflow and a matching BGA stencil for reballing, since the chip ships bare and requires precise ball placement before reflow.

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