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PMI632 902-00 Power IC Mobile phone IC chip

PMI632 902-00 Power IC Mobile phone IC chip

Regular price Rs.180.00 PKR
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The PMI632 902-00 is the Qualcomm power management IC (PMIC) responsible for voltage regulation and power distribution on Redmi 8, Redmi 8A, Redmi Note 8, and Redmi Note 8T boards. When a phone won't power on, stays dead after flashing, or drains the battery even while switched off, this IC is one of the first components a technician checks. It's a BGA package part meant for reflow or hot air rework on the board, not a plug-in module. Stock this one if you handle Redmi 8-series dead phone or no-power repairs regularly — it's a recurring fault on this chipset family.

⚖️ Weight: 0.01 kg

SKU:MST-IC-39

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Description

Open up a dead Redmi 8, 8A, Redmi Note 8, or Note 8T and you're looking at a board built around the Snapdragon 632 platform, and the PMI632 902-00 sits right at the center of its power tree. This chip doesn't just supply one rail — it manages multiple regulated voltages that feed the processor, memory, RF sections, and charging path simultaneously. When it degrades or shorts, you don't get one symptom, you get a cluster of them: dead phone, no power, hang on logo, or a board that draws current but never boots.You'll recognize a PMI632 fault fast if you've worked this chipset before. The phone comes in completely dead — no charging light, no vibration, nothing on the screen. Sometimes it's worse: dead after flash, where a software update or flash attempt leaves the board unresponsive because a power rail dropped mid-process and corrupted the boot sequence. Other times the board pulls current on your power supply but the screen stays black, which usually points to a short on one of the PMIC's output rails rather than the CPU itself.Before you commit to changing this IC, isolate it properly. Check the board for physical damage first — liquid marks, burnt traces, or a cracked BGA ball near the PMIC footprint. Run a current test on your bench power supply; if the board pulls unusually high current at a low voltage and heats up right around the PMI632 location, that's your signal. A thermal camera or even a finger test after a few seconds of power (carefully) will often confirm it. Don't jump straight to changing the IC on every dead board — rule out the charging IC, battery connector, and PMI632's own supporting capacitors first, since those get blamed on the power IC more often than they should.

Reballing this chip needs a proper stencil matched to the PMI632 632 footprint, decent flux, and a hot air station you can hold at a stable temperature — this isn't a part you want to rework with guesswork settings. Preheat the board evenly before you lift the old chip, clean the pads completely, and reball with fresh solder balls rather than reusing the old ones. A misaligned reball here causes a whole new set of symptoms down the line, so don't rush this step even under workshop pressure.Once the new PMI632 902-00 is seated and reflowed, always retest under load before closing the phone up. Boot it, run it through a charge cycle, and check that it doesn't restart or shut down under normal use. A phone that boots once but resets randomly afterward usually means the reball wasn't clean, not that the part itself is faulty — so don't blame the chip and burn through more stock before you've confirmed your soldering work.For a shop running steady traffic on Redmi 8-series repairs, keeping this IC on hand cuts your turnaround time significantly. Dead phone complaints on this chipset are common enough that waiting on a supplier order costs you real bench time and customer patience. This part ships as a bare BGA chip, ready for direct board-level replacement — no adapters or extra hardware required, just your rework station and steady hands.

Key Features

  • Genuine Qualcomm PMIC used across the Snapdragon 632 phone family
  • Direct board-level replacement for Redmi 8, 8A, Note 8, and Note 8T
  • BGA package suited for hot air reballing and reflow rework
  • Manages multiple regulated power rails from one chip
  • Common fix for dead phone and no-power complaints on this chipset
  • Addresses dead-after-flash and hang-on-logo faults tied to power failure
  • Compact footprint keeps board-level repair clean and precise
  • Reliable stock item for shops handling regular Redmi 8-series traffic

Specifications

Brand Entity Qualcomm
Product Entity PMI632-902-00 Power Management IC
Technology Entity Snapdragon 632 PMIC power architecture
Compatible Device Entities Xiaomi Redmi 8, Redmi 8A, Redmi Note 8, Redmi Note 8T
Repair Process Entity BGA reballing, board-level power IC replacement
Industry Entity Mobile phone repair, GSM board-level servicing

Compatible Devices

Xiaomi Redmi 8, Redmi 8A, Redmi Note 8, Redmi Note 8T (Snapdragon 632-based models)

Common Repair Uses

Dead phone / no-power repair, board-level power rail restoration, dead-after-flash recovery, hang-on-logo troubleshooting, PMIC reballing and BGA rework

FAQ

What is the product name?
The product name is PMI632 902-00 Power IC.
What is the brand of this product?
The brand of this product is Qualcomm.
What is the model of this product?
The model of this product is PMI632-902-00.
What is this product used for?
This product is used to replace a faulty power management IC on Snapdragon 632-based boards, restoring power delivery to the processor and other board components.
Which devices are compatible with this product?
This product is compatible with Xiaomi Redmi 8, Redmi 8A, Redmi Note 8, and Redmi Note 8T.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the PMI632 902-00 fix a Redmi 8 that stays dead after flashing?
In many cases yes — a dead-after-flash symptom on this chipset often traces back to a failed power rail from the PMI632, so replacing it resolves the fault once physical board damage has been ruled out.
Can the PMI632 902-00 be reworked with a standard hot air station?
Yes, it's a BGA package designed for hot air reballing, but it needs a proper stencil matched to its footprint and stable, even heat to avoid pad damage during removal.

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