Qianli Bumblebee Stencil (QS145)

Qianli Bumblebee Stencil (QS145): Reballing Stencil for Qualcomm PM and MTK MT-Power ICs The Qianli Bumblebee Stencil (QS145) earns its place on any bench that handles power IC faults on Qualcomm and MediaTek boards. Power management ICs sit behind the dead phone, charging issue, and no-power jobs that reach Pakistani repair shops every day. When you lift one of these ICs, the old solder balls leave with it, and the IC needs a fresh, even set of balls before it goes back on the PCB. This Qianli Bumblebee stencil targets the Qualcomm PM and MTK MT-Power IC group, so you reball the part with a proper stencil instead of guessing with loose solder. If you hunt for a reliable reballing stencil at a fair price in Pakistan, this one belongs on your shortlist.Where the QS145 Fits in Your Power IC Repair Workflow Every power IC job starts with diagnostics. You check current draw on the dead phone, probe the charging path with your multimeter, and decide whether the power IC causes the fault. When software marna fails to revive a phone and the power rails show no sign of life, the power IC becomes your prime suspect. Once you confirm it, you secure the board in a PCB holder, coat the IC with flux, and lift it with your hot air station. Now the stencil takes over. You clean the pads with your soldering station and wick, align the QS145 over the IC, apply solder, and heat until the balls form. You lift the stencil, inspect the result under your microscope, and refit the IC. This sequence keeps your IC change karna work repeatable, whether you reuse the original IC or fit a new one. It also saves you a second teardown when a poor ball pattern leaves the phone dead after the repair.One Stencil for Qualcomm PM and MediaTek MT-Power ICs Qualcomm PM and MediaTek MT-Power ICs show up on many Android boards, and the QS145 serves both families under a single stencil number. It targets power ICs only. For a Qualcomm or MTK CPU you need a CPU stencil, and for eMMC work you need an eMMC stencil such as the Qianli QS73 for eMMC General DDR. Qianli numbers its Bumblebee stencils by IC group, so always match the QS145 pattern to your IC footprint before you start. Do that check once on the bench and you avoid wasted solder, wasted time, and a damaged IC. Reballing a good IC often costs less than buying a replacement, and it keeps the original part on the board when local stock runs short. As you build out your reballing setup, browse our Reballing Kits, Hot Air Stations, Soldering Stations, and Microscopes categories to complete the workflow.Bench Tips for Cleaner Power IC Reballing Clean pads decide the result, so remove old solder fully and wipe away flux residue before you place the stencil. Hold the board firmly in a PCB holder and keep the stencil flat against the IC while you work. Set your hot air temperature and airflow to suit your solder type, and keep the nozzle moving instead of heating one spot. Let the stencil cool before you lift it, then clean it with flux remover so the next job starts with open holes. Work in good light, and keep spare solder and flux within reach so a failed first pass does not force you to restart from scratch. Check your finished balls under a microscope for even size and no bridges. Those habits turn the QS145 into a tool you trust on every dead phone, and they prepare you for your next step toward higher-end rework gear.