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QUICK 857 Pro 580W Digital Hot Air Rework Station (European Plug)

QUICK 857 Pro 580W Digital Hot Air Rework Station (European Plug)

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A board comes in with a dead phone CPU that won't budge under a basic heat gun, and that's exactly the gap the QUICK 857 Pro fills on a repair bench. 580W heating with airflow adjustable across 1-100 levels gives you enough thermal control to lift BGA chips without scorching the pads around them. Magnetic induction senses when you pick up the handle and switches into standby the moment you set it down, so the heater core isn't running hot between jobs. Three memory channels store your preferred temperature and airflow combinations for repeat work. This version ships with a European plug, ready to run on 220V mains without an adapter.

SKU:MST-SOLDERING-TOOLS-1323

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Description

A motherboard sitting on the bench with a
CPU that needs lifting for a hardware fault diagnosis is the kind of job that
separates a basic heat gun from a real rework station, and the QUICK 857 Pro is
built for exactly that situation. 580W of heating power drives the unit, with a
temperature range running from 100°C up to 500°C and airflow adjustable across
1-100 levels, giving you the range to work a delicate flex cable bond at low
heat or pull a stubborn power IC at the top end without switching tools.

 

The magnetic induction system is what makes
this station feel intuitive after the first few uses. Pick the handle up off
its holder and the unit switches straight into working mode; set it back down
and it drops into standby, blowing cool air automatically to protect the
heating element. You're not pressing a button to start or stop — your hand
movement does it, which matters when you're mid-repair and both hands are
occupied holding a board steady.

 

Three independent memory channels (CH1,
CH2, CH3) store separate temperature and airflow combinations, so switching
between a low-heat job and a high-heat BGA pull takes one button press instead
of resetting values from scratch. The LCD display keeps current temperature,
airflow level, and active channel visible the whole time you're working, which
gives you a clear read on what the tip is actually doing rather than guessing
based on feel.

 

Airflow control runs through an encoder
knob for stepless adjustment, rated up to 40L/min at maximum. That range covers
gentle work — softening adhesive under a back glass, reflowing a loose
connector — through to the kind of focused, higher-volume air needed to lift a
CPU or NAND chip off a multi-layer board. The station ships with three nozzle
sizes (E0005 at 5mm, E0064 at 6.4mm, and E0084 at 8.4mm), covering small SMD
components up through larger BGA packages without needing to source extra
nozzles separately.

 

Build quality leans toward daily workshop
use rather than occasional hobby soldering. The compact 110 x 180 x 151mm body
keeps the footprint small on a crowded bench, and a heat dissipation grille on
the housing keeps internal temperatures under control during long repair
sessions, protecting the heating element and electronics from the kind of heat
buildup that shortens the lifespan of cheaper hot air units. At roughly 1.6kg,
the main unit stays put on the bench without feeling like dead weight when you're
moving things around between jobs.

 

On a Pakistani repair bench, this is the
tool that comes out the moment software troubleshooting hits a wall and the
diagnosis points to a hardware fault — a dead phone that won't power on because
of a shorted power IC, a board stuck on hang on logo from a failed NAND chip,
or a charging issue traced back to a damaged charging IC that needs full
removal rather than a quick jumper fix. The 857 Pro handles the physical lift,
and the controlled airflow keeps surrounding components and plastic connectors
from taking heat damage while you work.

 

Within your overall repair workflow, this
station sits at the rework stage between diagnostics and reinstallation. Once a
multimeter or test box has pointed you to a specific IC, the 857 Pro removes it
cleanly, and you move on to reballing or fitting the replacement chip before
reflashing or reprogramming the device. It pairs naturally with a microscope
for inspecting pads before and after removal, a reballing kit for prepping the
replacement chip, and a soldering station for any jumper or trace work needed
once the new component sits in place.

 

This particular listing is the European
plug version, built to run directly on 220V AC mains without a step-down
converter or adapter — a straightforward fit if your shop's power setup matches
standard EU-style outlets. The non-AI 857 Pro variant skips the voice control
feature found on the 857 Pro AI model, keeping the unit focused on the core
heating and airflow performance technicians actually rely on day to day,
without paying for a feature that doesn't change repair outcomes on the bench.

 

For a shop handling regular BGA and SMD
rework — CPU removal, NAND replacement, connector reflow, or general
motherboard-level chip work — the QUICK 857 Pro gives you reliable heat output,
intuitive standby control, and enough airflow range to cover most jobs that
come across a mobile repair bench without reaching for a second station.

Key Features

  • 580W heating element with temperature range
    from 100°C to 500°C
  • Stepless airflow adjustment from 1-100
    levels, up to 40L/min maximum
  • Magnetic induction handle automatically
    switches between working mode and standby
  • Three memory channels (CH1, CH2, CH3) store
    separate temperature and airflow presets
  • LCD display shows real-time temperature,
    airflow level, and active channel
  • Auto-cooling sleep mode blows cold air on
    standby to extend heating element lifespan
  • Includes three nozzle sizes (5mm, 6.4mm,
    8.4mm) for SMD through BGA-scale work
  • Compact 110 x 180 x 151mm body with heat
    dissipation grille for sustained daily use

Specifications

Brand Entity QUICK
Product Entity QUICK 857 Pro Hot Air Rework Station
Technology Entity Magnetic induction start/stop, three-channel temperature and airflow memory, stepless airflow control
Compatible Device Entities Mobile phone motherboards, CPU and NAND chips, BGA and SMD components
Repair Process Entity BGA chip removal and reinstallation, SMD desoldering, board-level rework
Industry Entity Mobile repair industry, PCB repair industry, GSM technician workshops

FAQ

What is the product name?
The product name is the QUICK 857 Pro Hot Air Rework Station.
What is the brand of this product?
The brand of this product is QUICK.
What is the model of this product?
The model is 857 Pro.
What is this product used for?
Technicians use it for BGA and SMD desoldering, CPU and NAND chip removal, and general motherboard-level rework on mobile phones and PCBs.
Which devices are compatible with this product?
This station works on mobile phone motherboards, CPU and NAND chips, and BGA/SMD-level components on PCB boards.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the QUICK 857 Pro lift BGA chips like CPUs and NAND off a phone motherboard?
Yes, the station is built for BGA and CPU/IC desoldering on mobile phone motherboards, with adjustable airflow and temperature up to 500°C for controlled chip removal.
Does the QUICK 857 Pro support saving multiple temperature and airflow settings?
Yes, it has three independent memory channels (CH1, CH2, CH3) that each store a separate temperature and airflow combination for quick recall.

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