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Relife 861 Series 45° Elbow Nozzle 12mm – Hot Air Rework Station Nozzle

Relife 861 Series 45° Elbow Nozzle 12mm – Hot Air Rework Station Nozzle

Regular price Rs.700.00 PKR
Regular price Sale price Rs.700.00 PKR
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The Relife 861 Series Elbow Nozzle 12mm is a 45-degree bent hot air nozzle built for BGA rework and IC reballing on mobile phone boards. Made from stainless steel, it fits directly onto 861, 856AE, 712, 713, TR1300, and TR1 series hot air stations without needing an adapter. The angled design keeps your line of sight clear while working under a microscope, so you can heat the exact IC or component you're targeting without blocking your view. It seals tightly onto the gun barrel to stop air leakage, giving you consistent, focused airflow during IC removal and reballing work on your repair bench.

SKU:MST-SOLDERING-TOOLS-1397

⚖️ Weight: 0.02 kg

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Description

If you spend your day removing and reballing ICs under a microscope, you already know the problem with straight nozzles — they sit right in your line of sight and force you to work half-blind. The Relife 861 Series Elbow Nozzle 12mm fixes that with a 45-degree bend that angles the hot air away from your viewing path while still hitting the component dead center. This nozzle is built for technicians running 861, 856AE, 712, 713, TR1300, or TR1 series hot air rework stations. It's a direct plug-and-play fit — no adapter, no extra hardware. You pull the stock nozzle off your gun, slide this one on, and you're back to work. The one-piece design and tight seal mean no air escapes through the joint, so all your heat goes where you point it instead of leaking out around the barrel. Construction is stainless steel, which matters more than it sounds like on a repair bench. Hot air nozzles sit at working temperatures well above 300°C for hours at a stretch, and cheap material warps, discolors, or starts leaking air within weeks. Stainless steel handles that heat cycle without deforming, resists the oxidation you get from constant exposure to flux fumes, and keeps its shape even after repeated mounting and removal. For a shop running multiple boards a day, that durability is the difference between buying nozzles every month and buying them once or twice a year. The 12mm bore size puts this nozzle in the mid-to-large range of the series, which makes it useful for heating broader IC packages, larger PMICs, and board areas where you need even heat spread rather than a pinpoint jet. If your bench also does smaller chip work, this nozzle works alongside the smaller sizes in the same series (4mm, 5mm, 6mm, 8mm, 10mm) rather than replacing them — most technicians keep a full set and swap based on the job. This is the kind of accessory that solves a specific, everyday frustration on a repair bench. Anyone who's tried desoldering a PMIC or doing a board separation with a straight nozzle blocking half the microscope view knows exactly why the elbow shape matters. It's not a dramatic upgrade — it's a small fix that makes every job under the scope faster and less strained on your eyes. Whether you're doing IC change karna on a dead board, working through a charging issue that traces back to a PMIC, or handling logic board separation on iPhone X-style dual-board designs, this nozzle keeps your airflow accurate and your visibility clear. For shops in Lahore, Karachi, or Islamabad running high daily repair volumes, having the right nozzle size on hand means less time swapping tools mid-repair and more consistent results across your team. Pair it with the other sizes in the 861 series lineup to cover everything from small SMD components to larger IC packages, and you've got a nozzle set that matches the actual range of boards coming across your bench.

Key Features

  • 45-degree bent design keeps your view clear under a microscope
  • Direct plug-and-play fit on 861/856AE/712/713/TR1300/TR1 series stations
  • No adapter required for installation
  • Stainless steel build resists heat warping and oxidation
  • One-piece construction with tight seal, no air leakage at the joint
  • 12mm bore suited for larger IC packages and broader heat spread
  • Works alongside other sizes in the same nozzle series (4/5/6/8/10mm)
  • Durable enough for daily high-volume rework use

Specifications

Brand Entity Relife
Product Entity Hot Air Rework Nozzle
Technology Entity BGA Rework, Hot Air Soldering
Compatible Device Entities 861 Series Hot Air Stations, 856AE, 712, 713, TR1300, TR1
Repair Process Entity IC Removal, Reballing, Board Separation
Industry Entity Mobile Phone Repair, PCB Rework

Compatible Devices


Universal — not device-specific. Compatible with mobile phone motherboards across brands (Samsung, iPhone, Oppo, Vivo, Infinix, Tecno) wherever BGA-level IC rework is performed.

Common Repair Uses


IC removal and reballing, PMIC and charging IC replacement, board-level component desoldering, logic board separation (e.g., dual-board designs), microscope-assisted rework requiring clear line of sight.

FAQ

Q1 : What is the product name?
The product name is Relife 861 Series 45° Elbow Nozzle 12mm.
Q2 : What is the brand of this product?
The brand of this product is Relife.
Q3 : What is this product used for?
This product is used for directing hot air onto ICs and board-level components during rework, giving a clear view under a microscope while heating.
Q4 : Which hot air stations is this nozzle compatible with?
This nozzle fits 861, 856AE, 712, 713, TR1300, and TR1 series hot air rework stations without an adapter.
Q5 : Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users working on board-level IC repair.
Q6 : Does the 45-degree angle affect airflow strength compared to a straight nozzle?
No, the bend redirects airflow direction for visibility under a microscope, but the sealed one-piece design keeps airflow concentrated the same way a straight nozzle would.
Q7 : Why choose a 12mm nozzle over a smaller size like 8mm or 10mm?
The 12mm size spreads heat over a wider area, making it better suited for larger IC packages and broader board sections rather than small, isolated components.

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