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Brand: RELIFE

Relife HO1 Nano Cleaning Sponge

Relife HO1 Nano Cleaning Sponge

Regular price Rs.400.00 PKR
Regular price Sale price Rs.400.00 PKR
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The RELIFE H01 Nano Cleaning Sponge is a high-density, pre-cut cleaning sponge built for daily use on the repair bench. Pack of 500 pieces gives you a ready supply without cutting or wasting material every time you need to wipe a board. High adsorption and a no-linting, no-residue structure mean it lifts flux, dust, and grime off motherboards, connectors, and screens without leaving fibers behind. Works with alcohol, flux cleaner, or other cleaning fluids for deep board cleaning. A simple but essential item for any GSM technician's workbench, keeping boards clean before soldering, reballing, or diagnostics.

SKU:MST-SOLDERING-ACCESSORIES-583

⚖️ Weight: 0.3 kg

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Description

On a busy repair bench you clean boards dozens of times a day, and a sponge that sheds fibers or leaves residue behind on a motherboard just adds another problem to whatever fault you're already chasing. The RELIFE H01 addresses this directly with a high-density nano material structure that grips dust, flux residue, and grease without breaking apart or shedding lint onto sensitive components. You get 500 pre-cut pieces in every pack, so there's no scissor work involved and no guessing how much sponge you're using per job — pull one out, wet it with your cleaning fluid of choice, and get to work. Strong adsorption is the core selling point here: the sponge pulls in liquid and grime rather than smearing it across the board surface, which matters when you're working around ICs, connectors, and capacitors where trapped moisture or leftover flux can cause corrosion or intermittent faults later. Pakistani technicians dealing with a dead phone after flash, a board with a hardware fault, or a display problem traced back to a corroded connector often find that half the battle is just getting the board clean enough to see what you're actually looking at, and that's exactly where this sponge earns its place in the toolkit. It's built for use alongside cleaning fluids such as isopropyl alcohol or dedicated flux removers like the common "530" cleaning fluid used across repair shops — dip the sponge, wipe the board, and the nano structure carries the dissolved flux and dust away instead of pushing it around. No linting and no residue means you're not introducing new contamination while trying to remove old contamination, which is a common mistake with cheaper cellulose or foam sponges that fall apart after a few uses. The pre-cut particle format also keeps things organized on a busy bench: instead of storing a bulk roll and cutting pieces as needed, you have a fixed, easy-to-count quantity that's simple to restock and simple to ration across a shift. This makes the H01 practical not just for individual technicians but for repair shops and service centers running multiple stations, where consistent supply and predictable usage matter for keeping costs under control. Typical use cases on the bench include cleaning motherboards after IC change karna or jumper lagana, wiping down keyboards and PCB surfaces before microscope inspection, removing dust and oxidation from connectors and pads before reballing, and general board cleaning as part of routine diagnostics before software marna or box chalana. It's equally useful for LCD screen cleaning where a lint-free wipe prevents smudges or fiber marks during reassembly. Because the material is a general-purpose nano cleaning sponge rather than a device-specific accessory, it works across phone brands and board types without any compatibility concerns — the only variable is the cleaning fluid you pair it with, and it's compatible with standard alcohol-based and flux-based cleaners used throughout the mobile repair industry. For a shop processing multiple boards a day, having a reliable, non-shedding cleaning sponge on hand reduces the risk of introducing new faults during what should be a routine cleaning step, and the 500-piece pack means that reliabili

Key Features

High-density nano material structure for strong adsorption

No linting, no residue after wiping

500 pre-cut pieces per pack, ready to use

Works with alcohol, flux cleaner, and other cleaning fluids

Suitable for motherboard, PCB, connector, and keyboard cleaning

Safe for use around ICs, capacitors, and small components

Compact, easy-to-store pack for daily bench use

Reduces contamination risk during board cleaning

Specifications

Brand Entity RELIFE
Product Entity H01 Nano Cleaning Sponge
Technology Entity Nano-material high-density adsorption sponge
Compatible Device Entities Universal – all mobile phone motherboards, PCBs, connectors
Repair Process Entity PCB Cleaning, Board Cleaning, Pre-Soldering Preparation
Industry Entity Mobile Repair Industry, GSM Repair Tools

Compatible Devices

Universal — not device-specific; suitable for use on motherboards, PCBs, and components across all mobile phone brands

Common Repair Uses

PCB and motherboard cleaning, flux and dust removal before or after soldering, connector and pad cleaning before reballing, board cleaning during diagnostics, LCD screen wiping during reassembly

FAQ

What is the product name?
The product name is RELIFE H01 Nano Cleaning Sponge.
What is the brand of this product?
The brand of this product is RELIFE.
What is the model of this product?
The model of this product is H01.
What is this product used for?
This product is used for cleaning motherboards, PCBs, connectors, and other components during mobile phone repair.
Which devices are compatible with this product?
This product is compatible with all mobile phone motherboards and PCBs as a universal cleaning sponge, not tied to a specific device.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Is the RELIFE H01 sponge safe to use with alcohol or flux cleaner?
Yes, the sponge is designed for use with isopropyl alcohol and flux cleaning fluids for deep board cleaning.
How many pieces are included in one RELIFE H01 pack?
Each pack contains 500 pre-cut sponge pieces.