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Brand: RELIFE

Relife RL-044 15in1 XM1-XM15 Stencil

Relife RL-044 15in1 XM1-XM15 Stencil

Regular price Rs.8,500.00 PKR
Regular price Sale price Rs.8,500.00 PKR
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The Relife RL-044 15in1 XM1-XM15 Stencil is a 15-piece BGA reballing set built for Xiaomi and Redmi CPU repair work. Each plate measures 0.12mm and covers a different Xiaomi/Redmi Qualcomm Snapdragon chipset footprint, letting a technician move from one board series to another without buying separate single stencils. The precision-cut holes line up ball pads accurately during tin planting, cutting down bridging and cold-joint issues after reballing. Built from durable steel, the set holds its shape through repeated heat cycles on the rework station. For any GSM workshop that regularly handles Xiaomi CPU IC change work, the Relife RL-044 15in1 XM1-XM15 Stencil keeps the whole Xiaomi reballing workflow in one kit.

SKU:MST-SOLDERING-TOOLS-561

⚖️ Weight: 0.8 kg

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Description

Xiaomi and Redmi boards go through more CPU reballing jobs than most other brands on a Pakistani repair bench, and switching stencils for every model number wastes time between jobs, which is exactly the gap the Relife RL-044 15in1 XM1-XM15 Stencil fills by bundling fifteen individually numbered plates, XM1 through XM15, into a single kit that stays organized on the workshop shelf. Each stencil in the set targets a specific Xiaomi or Redmi CPU package footprint, from older Mi series boards running MSM8998-class Snapdragon chips through newer Redmi and Note series boards, so a technician pulls the matching plate instead of guessing pad spacing by eye. The 0.12mm plate thickness sits at the standard depth for consistent solder ball height, meaning the tin beads sit level across the whole IC pad grid rather than leaning to one side, which is the usual cause of intermittent boot loop issues after a rushed reballing job. The hole pattern on every plate in the Relife RL-044 15in1 XM1-XM15 Stencil is laser or precision-etched to match each chip's exact ball layout, so technicians get round, uniform solder balls that seat correctly on the first reflow pass instead of needing a second round of cleanup and IC change karna all over again. Steel construction means the plates resist warping under the hot air station's heat, which matters because a warped stencil throws off ball alignment on every job that comes after it, not just the one that caused the damage. On a typical workshop day this kit slots into CPU reballing, RAM reballing where the same BGA pad spacing applies, and general chip tabdeeli work on Xiaomi-branded boards that come in with dead-after-flash symptoms, network issues, or hang-on-logo faults traced back to a cracked CPU ball joint rather than a software fault. Because the set spans fifteen chipset variants, a shop that services a wide mix of Xiaomi and Redmi models can handle most walk-in CPU reballing requests without special-ordering a stencil mid-repair, which shortens turnaround time for the customer and keeps the bench moving. The kit also pairs naturally with a hot air rework station, a preheater, and a decent microscope or magnifier for placing solder balls precisely before reflow, forming a complete reballing workflow rather than an isolated accessory. Numbered labeling on each plate is what separates a kit like this from loose, unlabeled reballing stencils some suppliers sell, since a technician mid-repair does not want to cross-reference a chipset chart while the board is still hot on the preheater. For repair shop owners training junior technicians, having all fifteen plates in one kit also standardizes the reballing process across the team, because everyone pulls from the same numbered set instead of hunting for compatible stencils from different suppliers with inconsistent hole tolerances. Whether the job is a Redmi board sitting dead after a failed flash attempt or a Mi series unit with a hardware fault traced to the CPU, the Relife RL-044 15in1 XM1-XM15 Stencil gives a mobile repair technician the coverage needed to complete Xiaomi CPU reballing work end to end without switching tool suppliers mid-job.

Key Features

  • 15 individually numbered stencil plates (XM1 to XM15) in one organized kit
  • 0.12mm plate thickness for consistent, level solder ball height
  • Covers a wide range of Xiaomi and Redmi Qualcomm Snapdragon CPU footprints
  • Precision hole-pattern layout matched to each chip's actual ball grid
  • Durable steel build that resists warping under repeated heat exposure
  • Numbered labeling removes the need to cross-reference chipset charts mid-job
  • Compact, stackable set that keeps Xiaomi reballing tools in one place
  • Works directly with hot air rework stations and standard reballing workflow

Specifications

Brand Entity Relife
Product Entity RL-044 15in1 XM1-XM15 BGA Reballing Stencil Set
Technology Entity BGA reballing, tin planting, precision stencil cutting
Compatible Device Entities Xiaomi Mi series, Redmi series, Xiaomi Note series boards using Qualcomm Snapdragon chipsets
Repair Process Entity CPU reballing, IC reballing, chip tin planting
Industry Entity Mobile repair, GSM repair, PCB rework

Compatible Devices

  • Xiaomi Mi series boards (older Snapdragon chipsets including MSM8998-class)
  • Redmi series boards using Qualcomm Snapdragon CPUs
  • Xiaomi Note series and MIX series boards within the supported footprint range
  • Universal across XM1-XM15 chipset variants — device match depends on the specific numbered plate used

Common Repair Uses

  • CPU reballing on Xiaomi and Redmi motherboards
  • Chip tin planting after IC removal for reflow prep
  • RAM or power IC reballing where pad spacing matches the plate
  • Board-level repair on dead-after-flash, boot loop, or hang-on-logo faults traced to CPU ball joints
  • Rework bench training for standardizing reballing technique across technicians

FAQ

What is the product name?
The product name is Relife RL-044 15in1 XM1-XM15 Stencil.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model is RL-044, in the 15in1 XM1-XM15 configuration.
What is this product used for?
It is used for CPU and IC reballing on Xiaomi and Redmi boards, placing solder balls accurately before reflow.
Which devices are compatible with this product?
It covers Xiaomi Mi series, Redmi series, and Note/MIX series boards running Qualcomm Snapdragon chipsets, depending on which of the 15 numbered plates matches the board.
Who should use this product?
This kit suits mobile repair technicians, GSM repair shops, and service centers that regularly handle Xiaomi CPU reballing work.
Does this stencil set work with a standard hot air rework station?
Yes, all 15 plates are sized for use with standard hot air stations and preheaters during the tin planting and reflow stage.
Why does this kit include 15 separate plates instead of one universal stencil?
Xiaomi and Redmi CPUs use different ball-pad layouts across chipset generations, so a single universal plate cannot align solder balls correctly on every model, which is why the set is split into 15 chipset-matched stencils.

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