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Relife RL-044 12-in-1 CPU Reballing Stencil Set – iPhone 6 to iPhone 17 Pro Max

Relife RL-044 12-in-1 CPU Reballing Stencil Set – iPhone 6 to iPhone 17 Pro Max

Regular price Rs.6,000.00 PKR
Regular price Sale price Rs.6,000.00 PKR
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The Relife RL-044 is a 12-piece laser-cut steel stencil set built for CPU reballing on iPhone boards, covering everything from iPhone 6 up to iPhone 17 Pro Max in one kit. Instead of keeping a separate stencil for every model on your repair bench, this set gives you the full range in a single box, so you switch chips fast without hunting for the right template. The high-strength steel holds its shape under heat, so you don't deal with warped stencils mid-job. Square mesh holes let solder paste release cleanly, which means fewer solder bridges and a tighter reball on A-series chips. A solid pick for any technician doing CPU change or board-level repair on Apple devices.

SKU:MST-SOLDERING-ACCESSORIES-1080

⚖️ Weight: 0.4 kg

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Description

When you're doing CPU reballing on iPhone boards day in and day out, the stencil is what decides whether your solder balls line up clean or you end up reworking the same chip twice. The Relife RL-044 solves that by packing 12 precision stencils into one set, covering iPhone 6, 7, 8, X, 11, 12, 13, 14, 15, 16, and 17 Pro Max, so you're not stuck buying a fresh stencil every time a new model lands on your bench. Each plate is laser-cut from high-strength steel, the same grade used across Relife's professional stencil line, and it resists warping even after repeated exposure to hot air and reflow temperatures. That matters on a busy bench, because a stencil that bends after a few uses throws off hole alignment and ruins your ball placement on the next job. The square mesh hole design is built specifically to help solder paste release evenly during reballing, cutting down on the clogging and smudging you get with cheaper stencils, and giving you a more uniform ball height across the whole chip. Hole positioning is done with millimetric laser precision, so it lines up directly with the pad layout on A-series chips without you needing to nudge or adjust the stencil by hand. For a technician working through CPU change, dead board repair, or hardware fault diagnosis, that kind of alignment accuracy directly cuts your repair time, since you're not re-doing a reball because the balls landed off-pad. This set works well whether you're doing a straightforward IC change on an older board or reballing a newer A-series chip where the pad pitch is tighter and mistakes cost more. Because it spans over a decade of iPhone models in one kit, it also fits shops that take in mixed repair work, from older iPhone 6 and 7 boards still coming in for CPU issues, to the newest 17 Pro Max units. You get a single, updated toolkit instead of piecing together stencils from different sellers and different batches, which also keeps your reballing results consistent from one job to the next. The steel build holds up to routine handling and cleaning between jobs, so it doesn't need replacing as often as thin, low-grade stencils that deform after a handful of uses. On a busy repair counter where board work comes in daily, having all 12 stencils in one organized set also means less time digging through drawers for the right template and more time actually on the board. If your workflow includes CPU reballing as a regular service rather than an occasional job, this set is built to keep up with that pace without the accuracy dropping off over repeated use.

Key Features

12 stencils in one set, covering iPhone 6 through iPhone 17 Pro Max

Laser-cut from high-strength steel that resists warping under reflow heat

Square mesh holes for clean, even solder paste release

Millimetric hole positioning for accurate alignment on A-series chip pads

Cuts down solder bridging during CPU reballing

One updated kit instead of buying separate stencils per model

Steel build holds up to repeated cleaning and daily bench use

Suits both older iPhone boards and the latest A-series chip layouts

Specifications

Brand Entity Relife
Product Entity RL-044 CPU Reballing Stencil Set
Technology Entity Laser-cut steel stencil / SMT reballing
Compatible Device Entities Apple iPhone 6 through iPhone 17 Pro Max
Repair Process Entity CPU Reballing, IC Repair, Motherboard Rework
Industry Entity Mobile Repair / Micro-soldering / PCB Repair

Compatible Devices

Apple iPhone 6, 7, 8, X, 11, 12, 13, 14, 15, 16, and 17 Pro Max CPU boards

Common Repair Uses

CPU reballing, IC/chip replacement, motherboard rework after board-level faults, and A-series chip solder ball repair during dead board or CPU change jobs

FAQ

What is the product name?
The product name is the Relife RL-044 12-in-1 CPU Reballing Stencil Set.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model of this product is RL-044.
What is this product used for?
This product is used for CPU reballing and IC repair on iPhone motherboards.
Which devices are compatible with this product?
This product is compatible with iPhone 6 through iPhone 17 Pro Max CPU boards.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional micro-soldering technicians.
Does this stencil set work on the newer A-series chips like the one in iPhone 17 Pro Max?
Yes, the set includes a dedicated stencil laser-cut for the A-series chip pad layout used up to iPhone 17 Pro Max.
Will the steel stencil warp after repeated use with hot air during reballing?
No, the stencils are made from high-strength steel designed to hold their shape under reflow and hot-air temperatures over repeated use.