Skip to product information
1 of 4
Brand: RELIFE

Relife RL-044 SAM11 Stencil

Relife RL-044 SAM11 Stencil

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

The Relife RL-044 SAM11 Stencil gives you a dedicated Samsung-series reballing template built for precise solder ball placement on Samsung Galaxy motherboards. You get laser-cut, ultra-thin steel mesh construction that resists heat warping while you work on a dead phone board or a hardware fault case. The SAM11 position in the RL-044 Samsung lineup targets Samsung CPU and power IC pads, letting you avoid solder bridges and uneven balling during BGA reballing. Every hole sits exactly where your chip's pads sit, so your reballing job finishes faster and your solder joints hold up on the bench. It works straight into your existing hot air and reflow workflow without extra setup.

SKU:MST-SOLDERING-TOOLS-600

⚖️ Weight: 0.01 kg

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

The Relife RL-044 SAM11 Stencil sits inside the RL-044 Samsung reballing series, a numbered set (SAM1 through SAM15) that Relife built specifically for technicians who work on Samsung Galaxy motherboards every day. Build and Material — you're handling a laser-cut steel mesh stencil, the same ultra-thin, high-strength steel construction used across the RL-044 family, engineered to sit flat under thermal stress instead of warping mid-job, so your solder paste application stays consistent from the first board to the fiftieth. The hole pattern uses precision round and square perforations cut to match the SAM11 pad layout, which means you're not fighting misaligned balls or smudged paste when you seat the stencil over the chip. Fit Within Your Repair Workflow — this stencil slot lives between your diagnostic stage and your rework station: once you've confirmed a chip needs reballing rather than a straight IC change karna job, you clean the pad surface, align the RL-044 SAM11 Stencil over the footprint, apply solder paste or balls through the mesh, then move to your hot air station or reflow setup to finish the joint. Technicians handling boot loop issue boards, power IC failures, or CPU-related hang on logo faults on Samsung devices reach for this stencil because it removes the guesswork from manual ball placement, which is where most reballing failures actually happen on the workshop bench. Why the SAM Series Matters — Samsung boards don't share pad spacing with iPhone or Xiaomi motherboards, so a generic universal stencil forces you to eyeball alignment and risk bridging adjacent pads. The SAM11 position exists precisely because Relife mapped the Samsung chipset family separately from the IPZ (iPhone), HW (Huawei), XM (Xiaomi), and Android CPU series stencils in the same RL-044 line, giving your Samsung repair queue its own dedicated tool instead of a compromise. Practical Bench Use — you'll find the stencil useful whether you're running a full board-level repair shop or handling occasional Samsung hardware fault cases alongside other brands. The mesh holds its shape through repeated use, so you're not replacing it after a handful of jobs, and the flat packaging keeps the steel from bending in transit or storage, which matters if you're stocking multiple stencils from the same series on your rack. Compatibility Scope — Relife documents the RL-044 Samsung series as chipset-family compatibility rather than listing every individual Galaxy model number, so treat the SAM11 Stencil as scoped to the Samsung CPU and power IC footprint it was cut for, and confirm pad spacing against your specific board before running a job if you're working on a less common Galaxy variant. Pakistan Workshop Fit — for service centers and repair shops across Pakistan running high volumes of Samsung software marna and hardware repair tickets, having the correct SAM-series stencil on hand cuts the time technicians spend improvising alignment, which directly affects how many boards move through the bench in a working day. Pair it with a temperature-controlled hot air station and a decent microscope for pad inspection, and the RL-044 SAM11 Stencil becomes a repeatable part of your reballing routine rather than a one-off fix.

Key Features

  • Dedicated SAM11 position within the Relife RL-044 Samsung reballing stencil series
  • Laser-cut precision holes matched to Samsung CPU/power IC pad spacing
  • Ultra-thin, high-strength steel construction resistant to heat warping
  • Round and square hole design for smooth solder ball release
  • Reusable across repeated reballing jobs without losing shape
  • Flat, protective packaging that prevents bending during storage or transit
  • Works directly with standard hot air stations and reflow workflows
  • Reduces solder bridging risk compared to freehand or universal stencils

Specifications

Brand Entity Relife
Product Entity RL-044 SAM11 Reballing Stencil
Technology Entity BGA Reballing, Laser-Cut Steel Mesh
Compatible Device Entities Samsung Galaxy Motherboards (Samsung Chipset Family)
Repair Process Entity CPU/IC Reballing, Solder Paste Application, Motherboard Repair
Industry Entity Mobile Phone Repair, PCB Repair, GSM Technician Tools

Compatible Devices

  • Samsung Galaxy motherboards within the RL-044 SAM-series chipset footprint
  • Samsung CPU and power IC pad layouts matched to the SAM11 position
  • Universal — not confirmed for individual Galaxy model numbers; verify pad spacing against your board before use

Common Repair Uses

  • CPU and power IC reballing on Samsung motherboards
  • Solder paste application ahead of hot air reflow
  • Recovering boards affected by boot loop issue or hang on logo faults
  • Fixing dead after flash boards traced to a CPU or power IC hardware fault
  • Rework following IC change karna jobs on Samsung boards

FAQ

What is the product name?
The product name is Relife RL-044 SAM11 Stencil.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model of this product is RL-044 SAM11.
What is this product used for?
This product is used for BGA reballing and solder paste application on Samsung motherboard CPU and power IC pads.
Which devices are compatible with this product?
This product is compatible with Samsung Galaxy motherboards within the RL-044 SAM-series chipset footprint; confirm exact pad alignment on less common models before use.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the RL-044 SAM11 Stencil work with any hot air rework station?
Yes, it fits into standard hot air and reflow workflows without needing extra equipment.
Can the RL-044 SAM11 Stencil be reused across multiple reballing jobs?
Yes, the steel mesh holds its hole shape through repeated use, so a single stencil serves many reballing jobs before replacement is needed.

Ask any Query