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Brand: RELIFE

Relife RL-044 SAM15 Stencil

Relife RL-044 SAM15 Stencil

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
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The Relife RL-044 SAM15 Stencil is a 0.12mm laser-cut reballing mesh built specifically for the Samsung Galaxy S21, S21+, S21 Ultra (G998U/G996U), Z Flip3, Z Fold3 and W22 boards running the Exynos 2100 or Snapdragon 888 SM8350 platform. Its rounded-square apertures line up precisely over the CPU, PMIC and RF IC pads so solder balls land even and full, without bridging. Made from thin, heat-resistant steel that resists warping under repeated hot-air cycles, technicians reach for this stencil during IC change, dead-after-flash recovery, and boot loop repair whenever the CPU or power IC on this chipset needs to come off and go back on clean.

SKU:MST-SOLDERING-TOOLS-597

⚖️ Weight: 0.01 kg

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Description

The Relife RL-044 SAM15 Stencil sits in the RL-044 Samsung series lineup, purpose-built for one specific board generation rather than trying to cover every Samsung release with a single net, which is exactly why technicians treat SAM-numbered stencils as consumables they keep stocked by model rather than buying once and forgetting. Design and Build — the mesh is cut from ultra-thin 0.12mm steel using a laser process that gives clean, rounded-square hole edges instead of rough punched ones; that geometry matters on the bench because it lets solder paste release evenly during tinning and keeps the balls round rather than teardrop-shaped, which is the difference between a reball that boots first try and one that comes back with a dead board two days later; the steel itself resists metal fatigue, so repeated bending while aligning it over a board or lifting it off after paste application does not warp the hole pattern the way cheaper mesh does after a dozen uses. Compatibility — this specific SAM15 layout is checked against the Exynos 2100 and Snapdragon 888 SM8350 platform used across the Galaxy S21, S21+, S21 Ultra (G998U/G996U), Z Flip3, Z Fold3 and W22 boards, with hole positions matched to the CPU, PMIC and supporting RF/power IC footprints on those specific PCBs — it is not a generic universal mesh, it is board-specific, so using SAM15 on a different Samsung generation will not line up correctly and wastes paste and time. Where It Fits in the Repair Workflow — a technician reaches for this stencil after diagnosing a CPU, PMIC, or power-management fault on an S21-series board: the faulty IC gets removed with hot air, the board pads get cleaned, the stencil is aligned over the footprint, solder paste or solder balls go on through the mesh, and the IC is reflowed back onto the board before functional testing; it is equally useful in reworking a dead-after-flash phone where the CPU itself is suspected, or a boot-loop case that traces back to a cracked or shifted power IC rather than a software fault. Why Technicians Choose the SAM15 — buying a full universal kit is not always practical for a shop that mainly services one or two Samsung generations, so stocking the exact SAM15 mesh for S21-series jobs keeps reballing accurate without paying for 14 other stencils that rarely get used; the round-square hole pattern also means less time spent scraping and realigning paste manually, which speeds up bench turnaround on a repair that customers usually want same-day. Handling and Care — because the mesh is thin by design, it should be stored flat rather than folded, cleaned of leftover flux and paste residue after each use with isopropyl alcohol, and kept away from sharp tools that could deform the hole pattern; treated this way, a single Relife RL-044 SAM15 Stencil holds its shape through dozens of reballing jobs before the holes show enough wear to affect paste transfer. For a Pakistani repair bench where dead phone, hardware fault, and IC change karna jobs come through daily on Samsung flagships, this stencil earns its place in the toolbox specifically for S21-series board work rather than as a catch-all solution.

Key Features

  • 0.12mm ultra-thin stainless steel construction
  • Laser-cut rounded-square hole design for even solder ball formation
  • Matched to Exynos 2100 / Snapdragon 888 SM8350 board layout
  • Resists heat deformation across repeated hot-air cycles
  • Hole pattern checked against original S21-series board drawings
  • Reusable across multiple reballing jobs with proper care
  • Compatible with standard preheating and hot-air rework stations
  • Compact, board-specific mesh built for focused bench use

Specifications

Brand Entity Relife
Product Entity RL-044 SAM15 BGA Reballing Stencil
Technology Entity Laser-cut 0.12mm stainless steel reballing mesh
Compatible Device Entities Samsung Galaxy S21 series, Z Flip3, Z Fold3, W22
Repair Process Entity CPU/PMIC reballing, IC reflow and rework
Industry Entity Mobile phone hardware repair / GSM technician industry

Compatible Devices

  • Samsung Galaxy S21 (G991)
  • Samsung Galaxy S21+ (G996U)
  • Samsung Galaxy S21 Ultra (G998U)
  • Samsung Galaxy Z Flip3
  • Samsung Galaxy Z Fold3
  • Samsung W22
  • Chipset scope: Exynos 2100 / Qualcomm Snapdragon 888 SM8350 boards

Common Repair Uses

  • CPU and PMIC reballing on S21-series boards
  • Dead-after-flash board recovery
  • Boot loop repair traced to power IC or CPU
  • Power management IC replacement
  • Board-level IC removal and remount during rework

FAQ

What is the product name?
The product name is Relife RL-044 SAM15 Stencil.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model of this product is RL-044 SAM15.
What is this product used for?
This product is used for reballing the CPU, PMIC, and related BGA ICs on Samsung S21-series boards.
Which devices are compatible with this product?
This product is compatible with the Samsung Galaxy S21, S21+, S21 Ultra, Z Flip3, Z Fold3, and W22, built around the Exynos 2100 / Snapdragon 888 SM8350 platform.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the SAM15 stencil work on other Samsung Galaxy generations?
No, the hole pattern is matched specifically to the S21-series board layout, so it will not align correctly on other Samsung generations.
What hole thickness does this stencil use for solder ball formation?
It uses a 0.12mm ultra-thin laser-cut mesh with rounded-square holes for even paste and ball placement.

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