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Brand: RELIFE

Relife RL-044 XM15 Stencil

Relife RL-044 XM15 Stencil

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
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The Relife RL-044 XM15 Stencil gives you a laser-cut, high-precision template built for BGA chip reballing on mobile phone motherboards. Made from thin, flexible stainless steel, it holds its shape under hot air rework heat instead of warping mid-job, so your solder balls land evenly every time. You place it directly over the IC pad area, apply solder paste or balls, and lift it clean without smearing — cutting rework time on your bench. It's a straightforward addition to any reballing station setup, built for technicians who reball chips regularly and need a tool that survives daily workshop use, not a one-job disposable.

SKU:MST-SOLDERING-TOOLS-559

⚖️ Weight: 0.01 kg

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Description

When you're doing chip-level repair on a dead board or a board stuck on logo after a failed flash, the reballing step is where most of your accuracy gets won or lost, and the Relife RL-044 XM15 Stencil is built to take that variable out of your hands — it's a laser-cut stainless steel template designed to sit flat against the board or a reballing station platform, holding its hole pattern exactly in place while you spread solder paste or drop solder balls across the IC footprint, and because the steel is thin but resistant to heat-induced bending, it doesn't warp or bow after repeated hot air exposure the way cheaper stencils do after a few jobs; that matters on a busy repair bench where the same stencil gets used across dozens of boards a week, and any drift in hole alignment turns into bridged pads, cold joints, or a chip that won't boot after reballing even though your IC itself was fine. You get a tool that fits naturally into the reballing workflow: clean the pad area first, tack the stencil down, run your solder paste or mesh across it, heat with your hot air station at the appropriate profile, then lift the stencil away for uniform, evenly spaced solder balls ready for chip placement. For a workshop running ISP-based dead-phone recovery, eMMC or UFS chip swaps, or general PCB rework, having a stencil that survives repeated heat cycles without degrading means fewer wasted boards from misaligned reballing and less time spent re-doing a job because the template shifted or deformed under the gun. The build keeps things simple on purpose — no fragile plastic frame, no coating that flakes off after a few uses — just a durable steel template you can wipe down, store flat, and pull out the next time a similar reballing job comes across your bench. Technicians dealing with "dead after flash," hardware fault after IC change, or board hang issues traced back to a chip that needs a full reball will find the Relife RL-044 XM15 Stencil a dependable fit alongside your existing hot air station, multimeter, and PCB holder setup, rounding out a reballing station that doesn't leave alignment to guesswork.

Key Features

  • Laser-cut stainless steel construction for accurate hole alignment
  • Thin, flexible steel that resists warping under hot air heat
  • Reusable across multiple reballing jobs without losing shape
  • Designed for even solder paste or solder ball distribution
  • Compatible with standard hot air rework and preheating stations
  • Supports chip-level reballing as part of dead-board recovery work
  • Wipeable, durable surface suited to daily workshop handling
  • Compact size fits easily into a technician's tool kit

Specifications

Brand Entity Relife
Product Entity RL-044 XM15 BGA Reballing Stencil
Technology Entity Laser-cut stainless steel stencil technology
Compatible Device Entities Universal chip-level reballing use
Repair Process Entity BGA Reballing / IC Repair / Motherboard Rework
Industry Entity Mobile Phone Repair / GSM Technician Industry

Compatible Devices

Universal — not device-specific (chip-level BGA reballing application)

Common Repair Uses

  • IC reballing after chip removal
  • Dead board recovery following hardware fault diagnosis
  • Boot loop or hang-on-logo repair tied to a faulty IC
  • Solder ball placement ahead of chip re-soldering
  • PCB pad preparation before reballing on the rework station

FAQ

What is the product name?
The product name is Relife RL-044 XM15 Stencil.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model of this product is RL-044 XM15.
What is this product used for?
This product is used for BGA chip reballing and IC repair on mobile phone motherboards.
Which devices are compatible with this product?
This product is a universal chip-level reballing tool and is not tied to a specific phone model.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can this stencil be reused for multiple reballing jobs?
Yes, the stainless steel build is made for repeated use across many boards without losing its shape.
Does the stencil hold up under repeated hot air exposure?
Yes, the steel resists heat-induced warping, keeping hole alignment consistent job after job.
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A
Adnan Sheikh
Excellent Experience

The item is original and works perfectly. Seller communication was also excellent.

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