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Brand: RELIFE

Relife RL-044 XM16 Stencil

Relife RL-044 XM16 Stencil

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
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The Relife RL-044 XM16 Stencil gives you a precision-cut template for CPU and IC reballing work on mobile motherboards. Built from laser-cut steel, it lines up cleanly over BGA pads so your solder balls sit even and round instead of smudged or bridged. You place it directly over the chip footprint, run your paste, lift it off, and move straight into reflow without wasting time re-aligning by eye. Technicians running dead-board and boot loop repairs keep the Relife RL-044 XM16 Stencil on the bench specifically because it cuts reballing time on repeat jobs. It works well alongside a fixed clamp or magnetic base so the board stays still while you work the paste in.

SKU:MST-SOLDERING-TOOLS-560

⚖️ Weight: 0.01 kg

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Description

The Relife RL-044 XM16 Stencil is built for technicians who reball CPUs and ICs on mobile motherboards every day and need a template that lines up right the first time instead of forcing manual guesswork under the microscope. You lay the stencil flat over the chip footprint on the board, and the laser-cut holes guide your solder paste into place so every ball comes out round and consistent rather than smeared across neighboring pads. This matters most on dead-after-flash boards and CPU hang-on-logo cases, where a single bridged pad means redoing the whole reballing pass and burning more heat into a board that's already fragile. Because the hole pattern is cut rather than stamped, the edges stay sharp through repeated use, so paste release stays clean instead of dragging or leaving trailing solder. You get a tool that fits directly into your existing reballing workflow: clean the pads, seat the stencil, apply paste, lift, reflow, and inspect under the scope. Pair it with a magnetic fixture or clamp base and the stencil holds still while you work, which cuts the small alignment shifts that cause shorted balls or missed pads on a second attempt. Technicians running high volumes of board-level repair use tools in this RL-044 line because it lets them standardize the reballing step instead of relying on freehand paste application, and that consistency shows up directly in first-pass yield — fewer boards going back on the bench for a redo. It sits in the same repair sequence as your IC removal, pad cleaning, and reflow stations, and it's the piece that turns a rough reballing job into a repeatable one. For a repair shop juggling several boards a day, that repeatability is the actual value: less time per board, fewer wasted ICs, and less rework sent back from customers. If your bench already runs other stencils from the RL-044 family for different chip footprints, the Relife RL-044 XM16 Stencil slots into the same handling routine — same care in storage, same cleaning after use, same pairing with a stable fixture — so your team doesn't need a separate process just for this one tool. Keep it flat, keep it clean between uses, and it holds its precision across a long service life on the bench.

Key Features

  • Laser-cut hole pattern for precise, repeatable solder ball placement
  • Designed for direct use in CPU/IC reballing workflows
  • Works with standard reballing paste application methods
  • Pairs well with magnetic or clamp-style motherboard fixtures
  • Sharp-edged holes support clean paste release without smudging
  • Reusable across multiple reballing jobs when handled and stored properly
  • Fits into standard bench routines alongside pad cleaning and reflow steps
  • Part of the wider Relife RL-044 stencil line used in professional repair shops

Specifications

Brand Entity Relife
Product Entity RL-044 XM16 Stencil
Technology Entity Laser-cut BGA reballing stencil
Compatible Device Entities Mobile phone motherboards (CPU/IC package level)
Repair Process Entity CPU/IC reballing, BGA rework
Industry Entity Mobile repair and micro-soldering

Compatible Devices

  • Mobile phone motherboards requiring CPU/IC-level reballing
  • Chipset-family/BGA footprint scope — universal at the package level rather than tied to one confirmed device list
  • Exact device-model compatibility should be confirmed against the chip package before use on a specific board

Common Repair Uses

  • CPU/IC reballing after chip removal
  • Dead-after-flash and boot loop board recovery work
  • Reworking boards with cracked or lifted solder balls
  • Standardizing paste application before reflow on repeated repair jobs

FAQ

What is the product name?
The product name is Relife RL-044 XM16 Stencil.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model of this product is RL-044 XM16.
What is this product used for?
This product is used for CPU and IC reballing on mobile phone motherboards.
Which devices are compatible with this product?
This stencil is scoped for CPU/IC package-level reballing; confirm the exact chip footprint on your board before use.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this stencil work with a magnetic reballing base?
Yes, it pairs with magnetic or clamp-style fixtures that hold the board steady during paste application.
Can this stencil be reused on multiple boards?
Yes, with proper cleaning and flat storage between jobs, it holds its cut precision across repeated reballing work.

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