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Brand: RELIFE

Relife RL-044 XM9 Stencil

Relife RL-044 XM9 Stencil

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
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The Relife RL-044 XM9 Stencil is a precision 0.12mm reballing plate built for technicians working on Xiaomi 8, Xiaomi 8 SE, and MIX 2S boards powered by the Qualcomm SDM845/710 chipset. You get an ultra-thin stainless steel mesh with round-square hole geometry that lines up cleanly over the CPU pads, so solder balls sit even and consistent during tin planting. On a busy repair bench, that kind of accuracy cuts rework time and reduces the risk of bridging or missed joints. The Relife RL-044 XM9 Stencil holds its shape after repeated use, so it stays flat instead of warping under heat from the hot air station, which keeps your reballing results repeatable job after job.

SKU:MST-SOLDERING-TOOLS-554

⚖️ Weight: 0.01 kg

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Description

When a Xiaomi 8, 8 SE, or MIX 2S comes into your workshop dead after a CPU-related fault, the Relife RL-044 XM9 Stencil is the tool that gets the chip back to a proper working state before you reflow it onto the board, and this stencil is cut specifically for the SDM845/710 package footprint rather than sold as a generic universal mesh, which is why the hole spacing matches the real pad layout instead of forcing you to eyeball alignment under the microscope; the plate itself is a 0.12mm stainless steel sheet, thin enough that solder paste passes through cleanly during tin planting but rigid enough to survive dozens of heat cycles without curling at the edges, a common failure point on cheaper stencils that warp after two or three uses and start producing uneven ball height across the die; technicians dealing with a phone that hangs on logo, shows a boot loop, or reads dead after flash often trace the fault back to the CPU IC itself, and reworking that chip means removing it, cleaning the pads, reballing with fresh solder, and reflowing it back down, a sequence where the stencil quality decides whether you get uniform balls on the first pass or spend extra time touching up shorts and missed pads afterward; the round and square hole pattern on the Relife RL-044 XM9 Stencil is designed to hold solder paste in place during the planting stage so the balls form with consistent volume, which matters directly for reflow quality since uneven balls are one of the more common causes of a board coming back dead after IC change; because it targets the SDM845/710 platform specifically, this stencil fits into a Qualcomm-focused reballing workflow alongside your hot air station, preheater, and flux, and pairs naturally with ISP tools and test boxes when you need to confirm the board is reading correctly again after the rework; the stencil ships as a single ready-to-use plate, so there's no assembly step between unboxing it and placing it over the IC on your rework jig, and its stainless build means it can go through repeat heat exposure on the bench without the tin planting accuracy dropping off over time, which is the main thing a technician actually needs from a stencil used daily rather than occasionally.

Key Features

Exact-fit stencil design for the Qualcomm SDM845/710 CPU footprint

Ultra-thin 0.12mm stainless steel construction

Round and square precise hole positioning for even ball formation

Resists deformation under repeated hot air exposure

Improves solder paste application consistency during tin planting

Reusable design suited for daily workshop use

Compact, single-plate format with no assembly required

Built specifically for Xiaomi 8 series board-level repair

Specifications

Brand Entity Relife
Product Entity RL-044 XM9 BGA Reballing Stencil
Technology Entity Tin planting / CPU reballing stencil technology
Compatible Device Entities Xiaomi 8, Xiaomi 8 SE, Xiaomi Mi MIX 2S
Repair Process Entity CPU IC reballing and reflow process
Industry Entity Mobile phone repair and PCB rework industry

Compatible Devices

Xiaomi 8

Xiaomi 8 SE

Xiaomi Mi MIX 2S

Qualcomm Snapdragon 845 (SDM845) chipset boards

Qualcomm Snapdragon 710 chipset boards

Common Repair Uses

CPU IC reballing after chip removal

Tin planting for SDM845/710 chip repair

Board-level rework on dead-after-flash or boot loop faults

Solder ball application before IC reflow

CPU replacement workflows on Xiaomi 8 series devices

FAQ

What is the product name?
The product name is Relife RL-044 XM9 Stencil.
What is the brand of this product?
The brand of this product is Relife.
What is the model of this product?
The model of this product is RL-044 XM9.
What is this product used for?
This product is used for reballing and tin planting on the Qualcomm SDM845/710 CPU during board-level repair.
Which devices are compatible with this product?
This product is compatible with Xiaomi 8, Xiaomi 8 SE, and Xiaomi Mi MIX 2S boards using the SDM845/710 chipset.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this stencil work for both SDM845 and SDM710 boards?
Yes, the Relife RL-044 XM9 Stencil is cut for the SDM845/710 footprint, so it covers both chipset variants used in Xiaomi 8 series boards.
Can this stencil be reused across multiple reballing jobs?
Yes, its 0.12mm stainless steel build resists heat-related warping, so it holds its shape and hole accuracy across repeated reballing sessions.

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