Relife RL-093C 0.5mm Chip Heat Sink Copper Sheet

Every technician who has pulled a CPU off a mainboard knows the risk that comes right after — heat travels, nearby components get cooked, and what started as a simple IC reflow turns into a board with a fresh dead after flash issue. The Relife RL-093C 0.5mm Chip Heat Sink Copper Sheet exists to stop that chain reaction before it starts. Made from high thermal conductivity copper, this sheet sits on top of the chip you're working on and spreads heat evenly across its surface instead of letting it pool in one spot, which is exactly what causes solder joints on adjacent components to weaken or melt during hot air rework. At 12.3mm x 14mm and 0.5mm thick, it's the thickest variant in the RL-093 series (alongside the 0.1mm RL-093A and 0.3mm RL-093B), giving you more thermal mass for chips that throw off more heat, like CPU and GPU packages on modern mainboards. You place it over the target chip before you start your hot air work, and it acts as a buffer — pulling heat off the die and dissipating it outward instead of letting it radiate straight down onto the board and cook the ICs sitting a few millimeters away. This is the kind of small accessory that separates a clean board repair from a board that comes back with a new hardware fault three days later. The copper used here is corrosion-resistant, so it doesn't oxidize or degrade after repeated exposure to flux fumes and heat cycles, which matters if you're reusing sheets across multiple jobs in a busy workshop. The surface is smooth with no sharp edges or burrs, so it sits flat against the chip without scratching the board finish or leaving marks on surrounding components — something cheaper stamped copper sheets often fail at. On your repair bench, this sheet earns its place during CPU reballing, GPU reflow, power IC replacement, and any job where you're running hot air near densely packed components. If you've ever had a phone come back with a charging issue or a display problem right after you replaced an unrelated chip, there's a decent chance heat bleed during that repair damaged something it shouldn't have — a heat sink sheet like this is cheap insurance against exactly that outcome. It's not device-specific; because it works at the chip level rather than the phone model level, it applies across Samsung, Oppo, Vivo, Infinix, Tecno, and iPhone mainboards, and really any board where you're doing chip-level rework with a hot air station. The 50pcs pack format means you're not stopping mid-repair to cut or reshape a sheet — grab one, place it, work, and move to the next job. For shops running iPhone board repair or Android motherboard reballing at volume, this becomes a consumable you keep stocked the same way you keep flux and solder wire stocked. It pairs naturally with your hot air rework station, BGA reballing stencils, and reballing kits, filling the protective role in your workflow that stencils and preheaters don't cover on their own.