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Brand: RELIFE

Relife RL-1515 Desoldering Wick Wire

Relife RL-1515 Desoldering Wick Wire

Regular price Rs.300.00 PKR
Regular price Sale price Rs.300.00 PKR
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The RELIFE RL-1515 Desoldering Wick Wire is a 1.5mm wide, 1.5-meter long solder braid built from pure oxygen-free copper wire for clean, controlled solder removal on mobile phone PCBs. Its low-residue, no-clean flux coating pulls excess solder away from pins, pads, and small components without leaving harmful residue behind, reducing the risk of short circuits after IC removal or board-level repair. The fine 1.5mm width makes it suitable for tight, hard-to-reach areas such as BGA pads and closely spaced pins, where a wider braid would risk bridging nearby components. Technicians use it during IC change, jumper work, and general board cleaning to prepare pads for reballing or fresh soldering. A dependable, budget-friendly consumable for any mobile repair workbench.

SKU:MST-SOLDERING-ACCESSORIES-21

⚖️ Weight: 0.01 kg

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Description

Excess solder on a phone motherboard is one of the most common reasons a repair goes wrong. Leftover tin on pads can cause bridging, short circuits, or a bad connection after reflow, and cleaning it up properly is often the difference between a board that boots and one that stays dead. The RELIFE RL-1515 Desoldering Wick Wire exists for exactly this job. It is a 1.5mm wide, 1.5-meter long solder braid designed to lift molten solder off pins, pads, and connectors quickly and cleanly, giving technicians a controlled way to prepare a board for the next step in the repair process. The wick is made from pure oxygen-free copper wire, which matters more than it sounds. Oxygen-free copper resists oxidation better than standard copper, so the braid stays effective and doesn't degrade in storage the way lower-grade wicks can. The strands are woven tightly enough to create strong capillary action, which pulls molten solder up into the braid the moment heat is applied, rather than just pushing it around the board. This means less time spent reheating the same joint and less thermal stress on nearby components, which is critical when working near sensitive ICs, PMICs, or camera modules that don't tolerate repeated heat cycles well. A key feature of this wick is its no-clean flux coating. Many older or lower-quality solder wicks leave a sticky, corrosive flux residue behind that has to be scrubbed off with isopropyl alcohol before the board can be reflowed or tested. The RL-1515's low-residue design cuts that step out of the workflow. After use, the pad is left clean enough to move directly into IC placement, reballing, or continuity testing, saving time on high-volume repair days. The 1.5mm width is a deliberate choice, not just a default size. It's narrow enough to work precisely around single pins, small SMD components, and BGA pads without accidentally soaking up solder from neighboring points, but wide enough to remove tin efficiently from IC pads and connector legs. This makes it a good middle ground for technicians who don't want to carry multiple wick widths for every job. For dead phone diagnosis where a suspect PMIC or CPU IC needs to come off for testing, or for board cleaning before a full reball, this width handles the majority of real repair scenarios on a typical bench. Beyond IC removal, this wick is a staple for general PCB repair work. It's used to clean thermal bonding pads before installing a new IC, to remove old or damaged solder from a charging port or connector before replacement, and to tidy up joints after a failed repair attempt from another technician. Because it doesn't require aggressive scrubbing afterward, it also speeds up jumper wire work, where a clean, flat pad makes a much more reliable connection than one covered in leftover flux and solder blobs. For a repair shop running through dozens of boards a week, a wick like the RL-1515 is a low-cost, high-frequency consumable that directly affects repair quality. A clean pad reduces the chance of a comeback repair from a short circuit or a bad reflow, which matters as much for shop reputation as it does for the individual job. Paired with a decent soldering iron or hot air station, it forms part of the basic toolkit every board-level technician keeps within reach.

Key Features

  • 1.5mm width suited for tight pads, BGA areas, and closely spaced pins
  • 1.5m length for extended use across multiple repair jobs
  • Pure oxygen-free copper wire for strong, consistent capillary action
  • Low-residue, no-clean flux coating removes need for post-cleaning
  • Reduces risk of short circuits from leftover solder on pads
  • Useful for IC removal, reballing prep, and connector desoldering
  • Compact size fits easily in a repair kit or tool drawer
  • Affordable, high-frequency consumable for daily bench work

Specifications

Brand Entity RELIFE
Product Entity Desoldering Wick / Solder Wick
Technology Entity Oxygen-free copper braid, no-clean flux
Compatible Device Entities Universal mobile phone and PCB repair
Repair Process Entity IC removal, desoldering, board cleaning, reballing prep
Industry Entity Mobile repair, PCB repair, GSM technician tools

Compatible Devices


Universal — not device-specific; suitable for any mobile phone, tablet, or PCB requiring solder removal, regardless of brand or chipset.

Common Repair Uses


IC removal and IC change, PMIC and CPU IC desoldering, cleaning thermal bonding pads before reballing, charging port and connector desoldering, board-level cleanup after failed repairs, and pad preparation for jumper wire work.

FAQ

What is the product name?
The product name is RELIFE RL-1515 Desoldering Wick Wire.
What is the brand of this product?
The brand of this product is RELIFE.
What is the model of this product?
The model of this product is RL-1515.
What is this product used for?
This product is used for removing excess solder from PCB pads, pins, and connectors during IC removal, board cleaning, and repair work.
Which devices are compatible with this product?
This product is universal and works on any mobile phone, tablet, or PCB where solder removal is needed, regardless of brand or chipset.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this wick require cleaning after use?
No, the low-residue, no-clean flux coating means pads stay clean enough to move directly into reflow or IC placement without extra scrubbing.
What width should I use for BGA pad cleaning?
The 1.5mm width is well suited for BGA pads and closely spaced pins where a wider wick could bridge nearby points.