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Brand: RELIFE

Relife RL-2030 Desoldering Wick Wire

Relife RL-2030 Desoldering Wick Wire

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The Relife RL-2030 desoldering wick gives you a 2.0mm wide, 3-meter copper braid built for clean, fast tin removal on mobile mainboards and PCBs. Made from refined pure copper with a special chemical formula, it resists oxidation and corrosion while pulling solder off pads quickly. Fast heat conduction means less time with your iron sitting on the board, so you cut the risk of lifting pads or damaging nearby components. It's a straightforward bench consumable every GSM technician keeps within reach — for IC removal, board cleaning, and general rework where you need the joint clean before you move to the next step.

SKU:MST-SOLDERING-ACCESSORIES-300

⚖️ Weight: 0.01 kg

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Description

When you're pulling an IC off a mobile mainboard or cleaning up a pad before reballing, the wick you use decides how much time you spend on the board and how much risk you take with the copper traces around it. The RL-2030 is built from refined pure copper woven into a fine braid, treated with a chemical formula that resists oxidation and corrosion so the wire keeps absorbing tin efficiently even after sitting on your bench for months. On the workshop floor this matters because a wick that oxidizes fast stops pulling solder cleanly and starts dragging heat across the pad instead of lifting the tin, and that's exactly what causes lifted pads or a "dead after flash" board when a technician gets impatient with a weak wick and pushes the iron down harder than needed. At 2.0mm width and 3 meters in length, the RL-2030 sits in the middle range — narrow enough for tight pad clusters and IC footprints on modern boards, and long enough that you're not reaching for a fresh piece every few joints during a busy repair day. You lay the wick flat against the solder joint, bring your iron tip down on top of it, and let the fast heat conduction pull the melted tin up into the braid through capillary action. That speed is the real value here: less dwell time on the board means less chance of lifting a pad, cracking a nearby component, or overheating a BGA chip you're trying to save. Whether you're doing an IC change karna job on a network IC, cleaning a board before reballing a CPU, prepping a pad for a new charging port, or just tidying up solder bridges after a hardware fault repair, this wick handles the tin removal step cleanly without leaving a mess behind that needs extra cleanup before you solder the new part in. It works the same way across chipset families and board types since it's not tied to any specific device — Qualcomm, MediaTek, Samsung Exynos boards, tablets, or general PCB rework all use the same technique, so one wick covers your whole bench rather than needing different consumables for different brands. For a repair shop running through boot loop issues, dead phone diagnostics, or hang on logo cases where the fault traces back to a cracked solder joint or a faulty IC, having a reliable wick on hand cuts the diagnostic-to-repair time down noticeably. The 3-meter length also means fewer reorders for shops doing volume work, which matters when you're running through several boards a day and don't want your desoldering consumable running out mid-repair. Store it away from moisture and excess humidity to keep the copper from oxidizing early, and you'll get consistent absorption from the first use to the last few centimeters of the spool. For technicians who value a clean bench workflow — pull the tin, clean the pad, solder the new part, test — the RL-2030 fits that exact sequence without adding extra steps or requiring a separate flux cleanup pass afterward.

Key Features

• 2.0mm width braid, sized for IC pads and tight component footprints
• 3-meter length for extended bench use before replacement
• Refined pure copper construction for consistent tin absorption
• Special chemical treatment resists oxidation and corrosion over time
• Fast heat conduction shortens iron dwell time on the board
• Reduces risk of thermal damage to pads and nearby components
• Works across chipset families and device brands — one wick for the whole bench
• Simple lay-and-heat application with no extra cleanup step required

Specifications

Brand Entity RELIFE
Product Entity RL-2030 Desoldering Wick Wire
Technology Entity Pure copper braid, oxidation-resistant chemical treatment
Compatible Device Entities Universal mobile mainboards, PCBs, tablets
Repair Process Entity Desoldering, IC removal, board cleaning, rework
Industry Entity Mobile Repair Industry, PCB Repair

Compatible Devices

Universal — not device-specific. Works on any mobile phone, tablet, or general PCB mainboard where solder removal is needed, regardless of chipset or brand.

Common Repair Uses

IC removal and replacement, pad cleaning before reballing, clearing solder bridges, board cleaning during hardware fault repair, prepping charging port and connector pads, general PCB rework and rework station bench work.

FAQ

What is the product name?
The product name is Relife RL-2030 Desoldering Wick Wire.
What is the brand of this product?
The brand of this product is RELIFE.
What is the model of this product?
The model of this product is RL-2030.
What is this product used for?
This product is used for removing excess solder from PCB pads and mobile mainboards during IC removal, board cleaning, and general rework.
Which devices are compatible with this product?
This product is universal and works on any mobile phone, tablet, or PCB mainboard — it's not tied to a specific brand or chipset.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What is the wire width and length of the RL-2030 desoldering wick?
The RL-2030 has a 2.0mm width braid and comes on a 3-meter length spool.
Is the RL-2030 suitable for IC removal on mobile mainboards?
Yes, the 2.0mm width fits IC pad clusters and general mainboard footprints, and the fast heat conduction keeps iron dwell time low to protect the board.