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RELIFE RL-20C 1515 Soldering Wick 1.5mm Desoldering Braid for Mobile PCB Repair

RELIFE RL-20C 1515 Soldering Wick 1.5mm Desoldering Braid for Mobile PCB Repair

Regular price Rs.300.00 PKR
Regular price Sale price Rs.300.00 PKR
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The RELIFE RL-20C 1515 is a 1.5mm desoldering wick built from pure oxygen-free copper braid, designed for technicians who work on mobile phone motherboards, ICs, and BGA components daily. Its no-clean formula pulls molten solder off pads fast while leaving low, non-corrosive residue behind, so you skip extra cleanup steps on your repair bench. The narrow 1.5mm width gives you precise control around tightly packed pins, making it a reliable pick for IC removal, pad cleaning, and dead phone board work. At 1.5m in length, one spool covers repeated desoldering jobs across multiple boards before you need a replacement.

SKU:MST-SOLDERING-ACCESSORIES-1077

⚖️ Weight: 0.2 kg

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Description

Every repair technician reaches a point on the bench where a stubborn solder joint refuses to let go of a pad, and that is exactly where the RELIFE RL-20C 1515 earns its place in your toolkit. Built from oxygen-free pure copper strands woven into a tight braid, this desoldering wick draws molten solder up through capillary action the moment your soldering iron touches it, clearing pads on mobile motherboards without dragging or lifting copper traces underneath. The 1.5mm width sits at the narrow end of the RL-20C series, which also comes in 2.0mm, 2.5mm, 3.0mm, and 3.5mm variants, and this specific width suits fine-pitch work where space around ICs, connectors, and small components is tight. You get 1.5 meters of wick on a single spool, enough to work through several boards before rewinding to a fresh section becomes necessary. A no-clean flux coating runs through the braid, so the residue left on the pad after desoldering stays low and non-conductive, meaning you do not have to scrub the board with isopropyl alcohol every single time you lift solder. This matters most when you are working under time pressure in a busy repair shop, where every extra cleaning step adds up across dozens of daily jobs. The copper strands resist oxidation, which keeps the wick absorbing solder efficiently even after sitting on your bench for weeks rather than degrading and losing suction power. When you are removing a dead PMIC, lifting a faulty charging IC, or clearing old solder before reballing a chip, this wick sits right alongside your hot air station and flux as a core consumable rather than an optional extra. Technicians handling boot loop issues, charging problems, or board-level shorts often trace the fault back to a component that needs replacing, and clean pad preparation with a reliable wick directly affects whether the new part solders down properly on the first attempt. Poor desoldering technique with a weak or oxidized wick tends to leave solder bridges or lifted pads behind, both of which turn a straightforward IC swap into a much longer repair. The RL-20C 1515 avoids that outcome by combining strong capillary pull with a width narrow enough to work between closely spaced pins on modern smartphone boards, where component density keeps increasing with every new chipset generation. This wick fits naturally into ISP flashing prep work too, since board-level access to test points sometimes requires clearing old solder from pads before probing or wiring in a test jig. Reballing stations, hot air rework benches, and manual soldering setups all use this type of wick as a standard consumable, and stocking the correct width for the job in front of you saves time compared to reaching for a wick that is too wide for the pad spacing you are working with. For a repair shop running multiple technicians across different bench stations, keeping a stock of RL-20C wicks across the common width range means nobody stalls a repair searching for the right tool. The RL-20C 1515 specifically covers the finer end of that range, making it the wick you reach for on smaller ICs, connector pads, and tightly spaced BGA footprints where a wider braid would risk touching neighboring components. Paired with a temperature-controlled soldering iron and a quality flux, this wick becomes part of a workflow that keeps board damage low and turnaround time fast, which is exactly what a professional repair bench needs from a consumable this small.

Key Features

  • Pure oxygen-free copper braid for strong, consistent solder absorption
  • No-clean flux coating leaves low, non-conductive residue on pads
  • 1.5mm width suited to fine-pitch pads, connectors, and small ICs
  • 1.5m spool length covers multiple repair jobs before replacement
  • Anti-oxidation copper construction maintains absorption power over time
  • Fine braid weave supports steady capillary action for clean solder pickup
  • Compact spool fits easily into a repair bench toolkit or tool roll
  • Compatible with standard soldering irons used in mobile and PCB repair

Specifications

Brand Entity RELIFE
Product Entity RL-20C 1515 Soldering Wick (Desoldering Braid)
Technology Entity Oxygen-free pure copper braid, no-clean flux desoldering technology
Compatible Device Entities Universal — PCB and motherboard repair across Qualcomm, MediaTek, Samsung Exynos, and Apple chipset boards
Repair Process Entity Desoldering, IC removal, BGA rework, solder pad cleaning
Industry Entity Mobile phone repair and PCB repair industry

Compatible Devices


Universal — not device-specific. Works across mobile phone motherboards and PCB assemblies built on Qualcomm, MediaTek, Samsung Exynos, and Apple chipset families, as well as general electronics boards requiring solder removal.

Common Repair Uses


IC and PMIC removal, BGA chip rework and reballing prep, charging IC and audio IC replacement, solder pad cleaning before component reflow, board-level fault repair on dead or boot-looping phones, and pad preparation for ISP test point access.

FAQ

What is the product name?
The product name is the RELIFE RL-20C 1515 Soldering Wick.
What is the brand of this product?
The brand of this product is RELIFE.
What is the model of this product?
The model of this product is RL-20C 1515.
What is this product used for?
This product is used for removing excess solder from mobile phone motherboards and PCBs during IC repair, BGA rework, and general desoldering tasks.
Which devices are compatible with this product?
This product works universally across mobile phone motherboards and PCB assemblies, including boards built on Qualcomm, MediaTek, Samsung Exynos, and Apple chipsets.
Who should use this product?
This product suits mobile repair technicians, PCB repair specialists, repair shop owners, service centers, and professional electronics repair teams.
Does this wick leave residue that needs cleaning after use?
The no-clean flux design leaves low, non-conductive residue that does not require additional cleaning in most repair scenarios.
What width and length does the RL-20C 1515 wick come in?
This variant measures 1.5mm in width and 1.5m in length, sized for fine-pitch pads and small IC work.