RELIFE RL-601T 22 in 1 Middle Layer Tin Planting Platform – iPhone X to 15 Pro Max BGA Reballing Stencil Kit

When a motherboard comes in with a dead CPU, a failed PMIC, or an IC that needs reballing after a board repair, the quality of your tin planting fixture decides whether the chip mounts cleanly or you end up chasing cold joints later. The RELIFE RL-601T middle tinning platform set solves this at the source with a 22-in-1 configuration covering iPhone X, XS, XS Max, 11 series, 12 series, 13 series, 14 series, and the full 15 series up to 15 Pro Max. Each of the 17 steel stencils in the kit carries a precision hole-spacing design, so the round and square holes stay accurate under repeated use, and the tin balls come out rounder and more consistent instead of getting stuck or deformed inside the mesh. For a technician running multiple boards a day, that consistency directly cuts down on rework and failed boot-ups after reassembly. The base itself uses a high-temperature resistant synthetic stone material, which handles direct heat exposure during the tin planting process without warping, cracking, or holding onto flux residue — you wipe it clean and move to the next board. Five module clamps hold the stencils and the motherboard segment firmly in position, so the alignment does not shift while you apply heat, which matters most on tightly packed boards like the 14 Pro Max and 15 Pro Max where component spacing leaves little room for error. Anti-slip rubber feet keep the whole platform planted on the workbench, even during faster-paced reballing sessions where a stencil is coming on and off in quick succession. This kind of fixture sits right in the middle of your PCB repair workflow: after you diagnose a dead phone or a board stuck on hang on logo and trace the fault to a chip-level issue, you remove the faulty IC, clean the pads, and use the RL-601T to plant fresh tin before reflowing the replacement chip. It works equally well for CPU reballing after water damage, PMIC replacement on a board with charging issues, or general chip-level rework where the original solder balls got damaged during removal. Because the stencils are model-specific rather than universal, you get a tighter fit against the actual pad layout of each iPhone generation covered in the set, which reduces bridging and short-circuit risk compared to a generic mesh. For a repair shop or service center handling a steady volume of iPhone board work, having device-specific stencils on hand means less guesswork and fewer redo jobs, particularly on boards where the tin planting has to be right the first time because the chip itself is expensive or hard to source. The kit ships as a complete set — base, clamps, and stencils — so there's no need to separately source a compatible stencil holder or worry about mismatched hole spacing between the fixture and a third-party stencil. Whether you're running a dedicated BGA rework bench or handling tin planting as one step in a broader board repair job, the RL-601T gives you a stable, repeatable setup that holds up across daily use in a busy mobile repair workshop.