RELIFE RL-601T 31-in-1 iPhone Middle Layer BGA Reballing Platform Set — IPX to iPhone 17 Series

Middle layer reballing is one of the most technically demanding jobs on your repair bench. When you're dealing with a dead iPhone that came in after a failed board swap, a botched CPU reball, or a power IC replacement gone wrong, the quality of your tin-planting fixture decides whether the job succeeds or fails. Loose fixtures cause solder ball drift. Imprecise stencil alignment creates bridging. Low-grade steel produces irregular balls that collapse under reflow heat. The RELIFE RL-601T 31-in-1 IPX-17 Middle Layer Fixture Set is engineered to eliminate every one of those failure points.

This set covers iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Mini, 12 Pro, 12 Pro Max, 13, 13 Mini, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, 14 Pro Max, 15, 15 Plus, 15 Pro, 15 Pro Max, 16, 16 Plus, 16 Pro, 16 Pro Max, and iPhone 17 Series — giving your workshop full coverage from older flagship repairs right through to the latest models. When a customer walks in with a phone that won't boot after IC change karna, you reach for this fixture and get straight to work.

The foundation of the RL-601T system is its universal expandable base. Three built-in high-temperature strong magnets create a firm magnetic lock between the base plate and each model-specific stencil module. There is no physical clamping or manual tightening required. The motherboard sits in precise position automatically — no offset, no shift during flux application or solder ball placement. This magnetic force holds even under the heat of your hot air station or infrared rework platform.

Steel stencil quality directly affects ball shape. The RL-601T uses high-grade steel with both round and square precise hole geometry. Round holes produce fully spherical solder balls. Square-edged positioning prevents the mesh from jamming during ball placement. The anti-drum design keeps each ball contained within its channel so you get a clean, consistent array across every pad row. When you're reballing the CPU layer on an iPhone 13 Pro Max after a hang-on-logo fault, that ball consistency is critical — uneven balls under a CPU chip cause the same boot loop you were trying to fix.

The base is designed for unlimited expansion. As RELIFE releases stencil modules for new iPhone models, they stack directly onto the same universal base you already own. You buy the base once and simply add new modules as your repair workload grows. This is practical for Pakistani repair workshops that deal with a constantly evolving device mix — today it's iPhone 14 Pro network issues, next month it's iPhone 17 Series display problems, and your fixture system stays current without additional capital investment.

Stencil thickness on the RL-601T measures 0.12mm. This thin-profile design allows precise flux penetration and controlled solder ball seating across the middle layer pad array. Combined with the built-in alignment system that matches hole positions to the board's pad layout, you spend less time adjusting and more time completing repairs. Technicians running high-volume workshop environments — processing multiple board-level jobs per day — will find the consistent setup speed of this fixture directly reduces per-job time.

For reballing kits, PCB holders, hot air stations, and microscopes to support your complete BGA rework workflow, explore the relevant categories at KB GSM Store. The RL-601T integrates cleanly into any professional iPhone motherboard repair setup.