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Relife TB-07 Tail Plug Test Board For iPhone Android

Relife TB-07 Tail Plug Test Board For iPhone Android

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The 2UUL DW11 SolderAway Desoldering Wick gives you a fluorine-free braided copper wire built for fast, low-residue tin removal on mobile phone PCBs. Each box packs 10 rolls at 2.0mm width and 1.5m length, so your repair bench stays stocked for BGA rework, IC removal, and general motherboard cleaning jobs. The soft-woven copper strands lift excess solder quickly while resisting oxidation, keeping pads clean for re-soldering. You get consistent absorption without leaving behind sticky flux residue, which means less board cleaning afterward and faster turnaround on every job. Built for technicians who handle dead phone boards, IC change work, and jumper repairs daily, this wick pairs well with any soldering iron used on modern smartphone motherboards.

SKU:MST-SOLDERING-ACCESSORIES-284

⚖️ Weight: 0.05 kg

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Description

The 2UUL DW11 SolderAway Desoldering Wick 2015 is a fluorine-free desoldering braid designed specifically for mobile phone PCB repair, where clean pads and minimal residue directly affect the success of your next soldering step. At 2.0mm width and 1.5m length per roll, with 10 rolls included in every box, this wick gives you enough working length to handle multiple IC removals, connector desoldering jobs, and general board cleaning tasks without constantly cutting fresh sections. The braid uses fine, tightly woven copper strands that wick molten solder away from pads through capillary action, letting you clear tin buildup around chipsets, charging ports, and small SMD components without dragging or lifting copper traces. Because the wire is fluorine-free, it leaves noticeably less sticky residue on the board compared to older flux-heavy wicks, so you spend less time on isopropyl alcohol cleanup before you flux and reflow again. On your repair bench, this shows up in real workflow gains: when you're pulling a burnt PMIC off a dead phone board, chasing a charging IC that's shorting, or clearing old solder before dropping in a new audio IC, the wick absorbs tin fast and evenly instead of leaving uneven blobs that force you to reheat the same spot twice. Technicians working on boot loop issues, dead-after-flash boards, or hardware fault diagnosis often need to remove and re-test ICs several times in one session, and a wick that clears pads cleanly on the first pass saves real bench time across a busy day. The soft weave structure also matters for delicate work — thin traces near display connectors or network IC pads can lift if a wick is too stiff or grabs too aggressively, and the DW11's flexible copper strands are gentle enough for that kind of close-quarters cleanup while still pulling enough tin to matter on larger BGA pads during reballing prep. Anti-oxidation treatment on the copper keeps the wick performing consistently from the first roll to the last, so you're not fighting a wire that's gone dull or stopped absorbing properly halfway through the box — a common complaint with cheaper uncoated braids that oxidize in humid workshop conditions common across Pakistani repair markets. For workshops running high volumes of network issue, display problem, or hang-on-logo repairs where board-level diagnosis is routine, having a reliable wick on hand reduces the guesswork in solder removal and keeps your rework station running efficiently between jobs. The 10-roll box format also makes sense for shop owners managing consumable stock across multiple technicians, since each roll is compact enough to keep at individual workstations without constant restocking trips. Pair the DW11 with your existing hot air station or soldering iron setup, and it fits naturally into ISP mode dead-phone recovery work, eMMC chip swaps, and general PCB repair process steps where tin removal precedes re-tinning or new component placement. Whether you're running a solo repair bench or managing a full service center, this wick is a straightforward, dependable consumable that supports the tin-removal step in nearly every board-level repair you'll handle, from a simple charging issue to a full IC change on a badly damaged motherboard.

Key Features

  • Fluorine-free formula leaves minimal sticky residue on PCB pads
  • 2.0mm width suits both fine SMD work and larger BGA pad cleanup
  • 1.5m length per roll gives extended working length before replacement
  • 10 rolls per box keeps your repair bench stocked for high-volume work
  • Anti-oxidation copper strands maintain consistent absorption roll after roll
  • Soft-woven design reduces risk of lifting delicate PCB traces
  • Fast tin absorption speeds up IC removal and rework turnaround
  • Compatible with standard soldering irons used across mobile repair benches

Specifications

Brand Entity 2UUL
Product Entity DW11 SolderAway Desoldering Wick 2015
Technology Entity Fluorine-free braided copper desoldering wire
Compatible Device Entities Universal — mobile phone PCBs and motherboards
Repair Process Entity Desoldering, tin removal, BGA and IC rework
Industry Entity Mobile Repair Industry, PCB Repair Industry

Compatible Devices


Universal — not device-specific. Suitable for use on mobile phone motherboards and PCBs across Samsung, Oppo, Vivo, Infinix, Tecno, iPhone, and other smartphone brands, since the wick works on solder joints and pads rather than specific device models.

Common Repair Uses


IC removal and reballing prep, charging port and connector desoldering, PCB pad cleaning before reflow, BGA chip tin removal, audio IC and PMIC replacement cleanup, and general motherboard rework where old solder needs clearing before a new component goes in.

FAQ

What is the product name?
The product name is 2UUL DW11 SolderAway Desoldering Wick 2015.
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is DW11.
What is this product used for?
This product is used for removing excess solder from mobile phone PCBs during IC change, rework, and general board cleaning.
Which devices are compatible with this product?
This product is universal and works on mobile phone motherboards across brands rather than being device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB rework users.
Is this desoldering wick suitable for BGA reballing prep work?
Yes, the 2.0mm width and fluorine-free formula make it suitable for clearing tin from BGA pads before reballing.
Does this wick work with a standard soldering iron or does it require special equipment?
It works with any standard soldering iron; no special equipment is needed to use the wick effectively.