Skip to product information
1 of 4

Relife TF1 Motherboard Glass Fixture

Relife TF1 Motherboard Glass Fixture

Regular price Rs.1.00 PKR
Regular price Sale price Rs.1.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

The Relife TF1 Mini is a compact, heat-insulating glass fixture built for holding mobile phone and tablet motherboards steady during chip removal and soldering work. Its tempered glass panel resists temperatures above 500°C, so you can desolder ICs without worrying about the panel warping or cracking on your repair bench. The inward bevel clamping design suspends the board in the air, cutting down heat conduction loss and protecting nearby components while you work. Lightweight and portable, this fixture fits easily into any GSM workshop setup and works well for IC change, chip degumming, and general motherboard repair tasks where you need a firm, stable hold.

SKU:MST-SOLDERING-ACCESSORIES-445

⚖️ Weight: 0.25 kg

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

Every technician who has tried to hold a motherboard steady with one hand while running a hot air gun with the other knows how much a proper fixture changes your workflow. The RELIFE TF1 Mini solves exactly that problem. It clamps the board along its inward bevel edges and lifts it clear of the work surface, so heat from your soldering iron or hot air station stays concentrated on the chip you're working on instead of bleeding into the bench or the board's other components. This matters most during IC removal, BGA chip degumming, and reballing jobs, where uneven heat transfer can damage nearby components or leave residual adhesive that's hard to clean. The fixture's glass panel is made from high-strength tempered glass rated to withstand over 500°C without deforming, so you can run repeated high-heat cycles on it without losing shape or clarity, and cleanup stays simple since solder flux and adhesive residue don't bond to glass the way they do to plastic or painted metal — a quick wipe gets it back to a clean working state between jobs. Clamping flexibility is where the two-way sliding rail earns its place on the bench, since motherboards from different phone and tablet models vary in length and width, and the TF1 Mini's rail lets you adjust the clamp span to match the board in front of you rather than forcing you to own multiple fixtures for different device sizes, holding small mid-range Android boards or slightly larger tablet motherboards just as securely without slipping mid-job, which is the exact moment you don't want the board to move. For Pakistani repair shops handling dead phone diagnosis, IC change karna jobs, and board-level faults, this fixture sits at the diagnostic and repair stage rather than the flashing or software stage, since it's the tool you reach for before running your box or programmer, when the actual hardware fault — a cracked IC, a lifted pad, a component that needs reballing — has to be isolated and reworked physically, and holding the board rigid during this stage reduces the risk of new dry joints or hairline cracks forming from hand movement, a common cause of boards coming back with a fresh fault after a repair that should have fixed the original one. The build itself stays practical for shop use, compact enough to sit on a crowded workbench without taking up the space a full rework station would need, light enough to move between stations if more than one technician needs it during a shift, with no wiring, no power draw, and no calibration required — you place the board, adjust the rail, and start working. This fixture fits naturally alongside your existing ISP pinout tools, UFS adapters, and eMMC programmers as part of a complete hardware repair workflow: diagnose the fault, stabilize the board on the TF1 Mini, rework the affected IC or component, then move to flashing or programming once the hardware side is confirmed sound, making it a low-cost addition for any shop doing regular board-level repair that removes one of the most common points of failure in manual rework — an unstable board.

Key Features

Inward bevel clamping design holds motherboards firmly without slipping

Suspends the board in the air to reduce heat loss through conduction

Tempered glass panel resists temperatures above 500°C without warping

Two-way sliding rail adjusts clamp width for different board sizes

Corrosion-resistant glass surface wipes clean of flux and adhesive residue

Compact, lightweight build that saves bench space

No power source or calibration required

Fits directly into IC, BGA, and reballing repair workflows

Specifications

Brand Entity RELIFE
Product Entity TF1 Mini Insulated Tempered Glass Fixture
Technology Entity Inward Bevel Clamping, Tempered Glass Heat Insulation
Compatible Device Entities Mobile Phones, Tablets, iPad Motherboards
Repair Process Entity IC Removal, BGA Reballing, Motherboard Rework
Industry Entity Mobile Repair Tools, PCB Repair Equipment

Compatible Devices

Universal — not device-specific. Suitable for most mobile phone, tablet, and iPad motherboards within the fixture's adjustable clamping range.

Common Repair Uses

BGA chip and CPU removal, IC degumming, motherboard reballing, chip-level soldering and desoldering, PCB stabilization during rework.

FAQ

What is the product name?
The product name is RELIFE TF1 Mini Insulated Tempered Glass Motherboard Fixture.
What is the brand of this product?
The brand of this product is RELIFE.
What is the model of this product?
The model is TF1 Mini.
What is this product used for?
This product is used for holding motherboards steady during chip removal, reballing, and soldering repairs.
Which devices are compatible with this product?
This fixture works with most mobile phone, tablet, and iPad motherboards within its adjustable clamping range.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can this fixture handle high-temperature soldering without damage?
Yes, the tempered glass panel withstands temperatures above 500°C without deforming, so it holds up under repeated hot air and soldering iron use.
Does the TF1 Mini fit different motherboard sizes?
Yes, its two-way sliding rail adjusts the clamp width, letting it hold different phone and tablet motherboard sizes securely.