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RF4 R1515 1.5M Desoldering Wick (1Pcs Each) – Low-Residue Copper Braid for PCB & BGA Solder Removal

RF4 R1515 1.5M Desoldering Wick (1Pcs Each) – Low-Residue Copper Braid for PCB & BGA Solder Removal

Rs.350.00 PKR
Rs.350.00 PKR
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The RF4 R1515 1.5M Desoldering Wick (1Pcs Each) gives repair technicians a fast, low-residue solution for lifting excess solder off motherboards without lifting pads or damaging nearby components. Woven from high-purity oxygen-free copper, this 1.5mm wide braid pulls solder through capillary action the moment your iron touches it, so you clear IC pads, BGA sites, and QFP legs in seconds instead of scraping and reheating. The anti-oxidation, micro-passivation treatment keeps the braid clean-absorbing without extra flux, cutting your post-repair cleanup time. Every repair bench handling mobile boards, chip removal, or 0201 precision work needs this wick within reach.

MST-SOLDERING-TOOLS-1469

⚖️ Weight: 0.02 kg

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Description

  • Every technician who has fought a stubborn solder joint on a mobile motherboard knows the risk: too much heat lifts the pad, too little leaves bridged tin behind, and the RF4 R1515 1.5M Desoldering Wick (1Pcs Each) solves that balance by pulling solder away the instant your iron tip meets the braid. Built from high-purity pure copper strands precision-braided at 1.5mm width, the wick conducts heat fast enough to liquefy solder on contact while limiting the thermal load that reaches the PCB pad underneath, so you protect fragile board traces during IC replacement, BGA reballing, and QFP leg cleanup. You feed the wick along the joint, hold your iron against it for a second or two, and watch the mesh soak up the molten tin through capillary adsorption, leaving a flat, tinned pad ready for the next component. RF4 treats this braid with a low-residue chemical formula, which means you skip the extra flux most generic wicks demand and still get clean absorption without hardened white residue clinging to the board after the job. That matters on a busy bench where every extra cleaning pass eats into your turnaround time on a dead phone, a boot loop board, or a charging IC swap. The anti-oxidation and micro-passivation treatment on the copper keeps the braid from tarnishing in storage, so the wick you pull out today performs the same as the one you bought last month, without dull, oxidized strands that soak up solder poorly. This 1.5mm width sits in the sweet spot for mobile repair work: fine enough to clear tin from tight 0201 components and BGA ball sites without smothering neighboring pads, yet substantial enough to lift larger solder pools off connector legs, shield frames, and power IC pins during a full board rework. You get 1.5 meters of usable braid per pack, enough length to work through several repair jobs before you need a fresh section, and the woven structure resists fraying as you feed it forward, so you are not fighting a splitting braid mid-repair. Whether you run a CPU reball, clear old solder before installing a new PMIC, or prep a pad for microscope-level QFP rework, this wick handles the tin removal step that every one of those workflows depends on. Pakistani repair shops handling network issue boards, hang-on-logo cases, or hardware fault diagnostics rely on a wick that will not leave gummy residue behind, because that residue interferes with continuity testing and clean reflow later in the process. The RF4 R1515 1.5M Desoldering Wick (1Pcs Each) fits directly into that diagnostic-to-repair chain: you isolate the fault, remove the failed IC or connector, wick away the leftover solder, clean the pad, and move straight to reballing or component replacement without an intermediate cleaning stage. Pair it with your existing hot air station and soldering iron setup, and it becomes the connective tool between removing a bad chip and prepping the board for a working one. For technicians running high-volume repair queues, a braid that absorbs solder efficiently on the first pass, rather than requiring repeated drags across the same joint, translates directly into more boards cleared per shift and fewer pads damaged from repeated reheating.

Key Features

  • High-purity pure copper braided construction for fast heat transfer
  • 1.5mm width suited for fine-pitch mobile PCB work
  • Low-residue chemical treatment removes solder without extra flux
  • Anti-oxidation and micro-passivation coating extends shelf performance
  • Strong capillary adsorption lifts solder in a single pass
  • 1.5 meters of usable braid per pack
  • Fray-resistant weave for smooth, controlled feeding
  • Compatible with standard soldering irons on repair benches

Specifications

Brand Entity RF4
Product Entity R1515 Desoldering Wick
Technology Entity low-residue copper braided desoldering technology
Compatible Device Entities mobile phone motherboards, PCB boards, BGA and QFP components
Repair Process Entity solder removal, BGA reballing, IC removal, PCB rework
Industry Entity mobile phone repair industry, GSM repair industry

Compatible Devices

  • Universal — not device-specific, works across mobile phone motherboards from all major brands
  • Suitable for BGA, QFP, and 0201-scale precision PCB components

Common Repair Uses

  • Solder removal from motherboard pads before IC replacement
  • BGA and CPU reballing preparation
  • Charging port and connector desoldering
  • PCB pad cleaning after component removal
  • QFP and fine-pitch chip rework

FAQ

What is the product name?
The product name is RF4 R1515 1.5M Desoldering Wick (1Pcs Each).
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is R1515.
What is this product used for?
This product is used for removing excess solder from PCB pads, BGA sites, and component legs during mobile phone motherboard repair.
Which devices are compatible with this product?
This product works on mobile phone motherboards and PCBs across all major brands, making it universal rather than device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this desoldering wick require extra flux to absorb solder cleanly?
No, the low-residue chemical treatment on the RF4 R1515 lets it absorb solder cleanly without needing additional flux.
Is the RF4 R1515 wick suitable for BGA and 0201 precision component work?
Yes, its 1.5mm width and fast capillary absorption make it suitable for BGA reballing, QFP legs, and 0201-scale precision PCB work.

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