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RF4 R1515 1.5M Desoldering Wick (10Pcs Each) – Low-Residue Copper Solder Braid for Mobile PCB & BGA IC Repair

RF4 R1515 1.5M Desoldering Wick (10Pcs Each) – Low-Residue Copper Solder Braid for Mobile PCB & BGA IC Repair

Regular price Rs.3,000.00 PKR
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The RF4 R1515 1.5M Desoldering Wick (10Pcs Each) gives your repair bench a fast, low-residue copper braid built for mobile motherboard rework. Each strand measures 1.5mm wide and 1.5 meters long, letting you lift excess solder from BGA pads, charging port connectors, and QFP legs without dragging pads or lifting traces. The high-purity copper weave pulls heat quickly, so you spend less time on each joint and reduce thermal stress on 0201-class components. A low-residue chemical treatment means you skip extra flux and cleaning steps after desoldering. Ten pieces per pack keep your bench stocked for back-to-back dead phone and board-level jobs.

SKU:MST-SOLDERING-TOOLS-1467

⚖️ Weight: 0.25 kg

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Description

When you're chasing a dead phone or a board that hangs on logo after a failed IC swap, the tool that decides whether your rework looks clean or damages pads is the wick you pull solder with, and the RF4 R1515 1.5M Desoldering Wick (10Pcs Each) is built exactly for that moment on a technician's bench. This braid uses high-purity pure copper strands woven tightly enough to pull solder fast through capillary action, which means you spend fewer seconds heating a pad and lower the risk of lifting a trace or cooking a nearby component during IC change karna work. At 1.5mm width and 1.5 meters of usable length per strand, it sits comfortably between fine 0201-precision jobs and standard board-level pad clearing, so you're not switching wick sizes constantly between a charging port repair and a BGA IC removal. The low-residue chemical coating on this batch cuts out a step most technicians dread — you don't need to load extra flux before every pass, and there's far less sticky residue left behind for you to scrub off before reflow or reballing. That matters on a busy repair shop bench where board cleaning between jobs eats into billable hours, and it matters even more on 0201 precision PCBs and tightly packed motherboard sections where leftover flux residue can trigger a hardware fault down the line if it isn't fully removed. Anti-oxidation and micro-passivation treatment on the copper keeps the braid performing consistently from the first pull to the last, so pack freshness isn't a concern when you're working through backlog on a slow week and picking the wick back up after storage. In a typical repair workflow, this wick slots in right after you've identified a shorted or damaged IC on a phone motherboard — you lay the braid over the solder joint, apply heat with your soldering iron or hot air station, and let the copper mesh absorb the molten solder cleanly away from the pad, leaving a flat, residue-light surface ready for reballing or direct IC placement. It's just as useful earlier in a diagnostic chain, when a charging issue or display problem traces back to a bridged connector or a flooded solder joint that needs clearing before you can even test continuity. Technicians working ISP and eMMC recovery cases also reach for a wick like this when prepping a chip for direct read after a jumper lagana fix, since clean pads make direct-connection probing far more reliable than pads still coated in old solder. Because the braid pulls solder without dragging metal across the board, it protects fine-pitch connectors on modern devices where a slipped iron tip or an aggressive pump can crack a pad clean off. Ten pieces per pack means you're not rationing wick on a high-volume week, and the sealed strand length keeps each piece usable across multiple jobs before you need a fresh one. Pair it with your ISP pinout tools, eMMC programmer, or UFS adapter workflow, and it becomes the quiet, unglamorous step that keeps every board-level repair — from a simple charging port swap to a full CPU reball — clean enough to actually hold under warranty. If you run a service center or repair shop moving through multiple boards daily, stocking this alongside your hot air station, microscope, and PCB holders keeps your rework quality consistent instead of depending on whichever half-used wick happens to still be usable that day.

Key Features

  • 1.5mm width, 1.5-meter usable braid length per strand
  • High-purity pure copper weave for fast thermal conductivity
  • Low-residue chemical treatment reduces post-desoldering cleanup
  • Anti-oxidation and micro-passivation coating for consistent performance
  • Strong capillary solder absorption for quick, clean removal
  • Safe for 0201 precision components and fine-pitch pads
  • Suitable for BGA, QFP, and general motherboard rework
  • Pack of 10 pieces for extended workshop use

Specifications

Brand Entity RF4
Product Entity Desoldering Wick / Solder Braid
Technology Entity Pure Copper Braided Desoldering Technology
Compatible Device Entities Mobile Phone Motherboards, BGA/QFP Boards
Repair Process Entity Solder Removal, BGA IC Removal, PCB Cleaning
Industry Entity Mobile Repair Industry, PCB Rework Industry

Compatible Devices

  • Universal — not device-specific; works across mobile phone motherboards regardless of brand
  • Suitable for BGA and QFP package boards found in smartphones and tablets
  • Compatible with 0201 precision PCB components

Common Repair Uses

  • BGA IC removal and pad cleaning before reballing
  • Charging port and connector desoldering
  • Solder pad cleanup after a failed IC swap or jumper lagana fix
  • Motherboard cleaning during dead phone diagnostics
  • Preparing eMMC/UFS chip pads for direct-read or ISP recovery work
  • General board-level rework and component desoldering

FAQ

What is the product name?
The product name is RF4 R1515 1.5M Desoldering Wick (10Pcs Each).
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is R1515.
What is this product used for?
This product is used for removing excess solder from mobile phone motherboards, BGA pads, and PCB connectors during repair and rework.
Which devices are compatible with this product?
This wick works universally across mobile phone motherboards, BGA, and QFP boards regardless of brand or chipset.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB rework users.
Does this wick leave residue that needs extra cleaning?
No, it uses a low-residue chemical treatment, so most jobs skip additional flux cleaning after desoldering.
Is this wick safe for fine-pitch 0201 components?
Yes, the 1.5mm width and controlled capillary action make it suitable for 0201 precision PCB work without damaging nearby pads.

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