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RF4 R2015 1.5M Desoldering Wick (10Pcs Each) – Low-Residue Copper Solder Braid for PCB & BGA Repair

RF4 R2015 1.5M Desoldering Wick (10Pcs Each) – Low-Residue Copper Solder Braid for PCB & BGA Repair

Regular price Rs.3,000.00 PKR
Regular price Sale price Rs.3,000.00 PKR
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The RF4 R2015 1.5M Desoldering Wick (10Pcs Each) gives your repair bench a reliable low-residue solder braid built from pure oxygen-free copper for fast, clean solder removal on mobile phone motherboards. Each strand measures 2.0mm in width and 1.5 meters in length, letting you pull excess solder away from BGA pads, QFP legs, and 0201 precision components without damaging surrounding traces. The anti-oxidation coating and micro-passivation treatment keep the braid performing consistently through repeated desoldering passes, while the no-clean formula skips extra flux application during most repair jobs. This 10-piece pack suits technicians and service centers running high daily repair volumes.

SKU:MST-SOLDERING-TOOLS-1468

⚖️ Weight: 0.25 kg

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Description

Working through a stack of dead phone boards on your bench, you need a desoldering wick that pulls solder cleanly without leaving behind a mess that slows down the next step, and the RF4 R2015 1.5M Desoldering Wick (10Pcs Each) is built for exactly that kind of repeated, high-pressure repair work. Constructed from pure oxygen-free copper, the braid conducts heat quickly from your soldering iron tip straight into the joint, so molten solder wicks upward into the mesh through capillary action rather than sitting on the pad and overheating it. At 2.0mm in width and 1.5 meters in length, each strand gives you enough working length to handle several BGA removals or an entire row of QFP legs before you need to trim off a used section, which matters when you are working through a queue of boards during a busy shift. RF4 finishes this wick with a low-residue, no-clean flux coating, so you skip the extra step of applying liquid flux before most desoldering passes and avoid the sticky cleanup that comes with older wick formulas, cutting down the time you spend prepping the board and rinsing it afterward. The anti-oxidation treatment and micro-passivation process protect the copper strands from degrading during storage and repeated heat cycles, keeping the wick absorbing solder at full capacity instead of losing effectiveness after a few uses like uncoated braid does. On the workshop floor, this translates directly into safer pad protection: pulling solder off a 0201 resistor or a tightly packed IC footprint without lifting the copper pad or scorching a neighboring trace depends on how fast the wick draws heat and solder away, and the R2015's construction is tuned for that precision-level removal rather than bulkier through-hole work. You reach for this wick during IC removal ahead of a reball, during BGA rework when a chip needs to come off cleanly for reflow, and during general board cleaning after a failed repair attempt where old solder blobs need clearing before a fresh component goes down. It fits naturally into the diagnostics-to-rework pipeline that most GSM technicians run: isolate the fault, desolder the suspect IC or connector, clean the pad with the R2015 wick, then move into reballing or replacement without fighting leftover solder that throws off your alignment. Charging port repairs, camera module reflows, and audio IC replacements all lean on the same core skill, and having a wick that performs consistently across all of them saves you from switching brands mid-job or guessing whether a cheaper braid will hold up on a delicate pad. Because this listing covers the 10-piece pack, a repair shop or service center running multiple technicians can stock enough wick to last through weeks of daily board work without reordering constantly, which keeps your bench supplied during peak repair season when phones come in faster than usual. The R2015 pairs naturally with your existing hot air station, soldering iron, and flux paste, slotting into the same rework routine you already run for BGA and QFP work, and it complements ISP tools and eMMC programmers further down your workflow once the hardware-level fault is cleared and the board needs testing again. Whether you run a single repair counter or manage a full-service mobile repair shop, keeping a stocked supply of RF4 R2015 wick on hand means you are never stuck mid-repair waiting on solder removal, and the consistent copper quality means your soldering results stay professional across every job that crosses your bench.

Key Features

  • 2.0mm width, 1.5 meter length pure oxygen-free copper braid
  • Low-residue, no-clean flux coating reduces post-repair cleanup
  • Anti-oxidation treatment preserves solder-absorption performance
  • Micro-passivation process protects PCB pads from thermal damage
  • Fast capillary action pulls solder off joints in one pass
  • Rated for BGA, QFP, and 0201 precision component removal
  • Compact spool fits directly into a repair bench toolkit
  • Sold as a 10-piece pack for high-volume workshop use

Specifications

Brand Entity RF4
Product Entity R2015 Desoldering Wick (Solder Braid)
Technology Entity Low-residue no-clean flux coating, anti-oxidation and micro-passivation treatment
Compatible Device Entities Universal — mobile phone motherboards, BGA, QFP, and 0201 precision PCBs
Repair Process Entity Desoldering, IC removal, BGA rework, board-level solder cleaning
Industry Entity Mobile phone repair, PCB rework, GSM service center operations

Compatible Devices

  • Universal — not device-specific
  • All mobile phone motherboards requiring solder removal
  • BGA-packaged ICs across Android and iOS repair workflows
  • QFP-packaged components and 0201 precision passives

Common Repair Uses

  • IC removal ahead of reballing
  • BGA chip desoldering for reflow or replacement
  • Motherboard pad cleaning after failed repair attempts
  • Charging port and connector solder removal
  • Camera module and audio IC desoldering
  • General excess-solder cleanup during board-level rework

FAQ

What is the product name?
The product name is RF4 R2015 1.5M Desoldering Wick (10Pcs Each).
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is R2015.
What is this product used for?
This product is used for removing excess solder from mobile phone motherboards, BGA pads, and QFP components during PCB rework.
Which devices are compatible with this product?
This product is universal and works across mobile phone motherboards, BGA-packaged ICs, and QFP/0201 precision components rather than being tied to a specific phone model.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What width and length does the RF4 R2015 desoldering wick come in?
It comes in a 2.0mm width and 1.5 meter length per strand.
Does the RF4 R2015 wick require additional flux for solder removal?
No, its low-residue, no-clean formula absorbs solder cleanly in most repair jobs without extra flux application.

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