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RF4 RF-FT09 Trackless Planar CPU IC Repair Fixture for BGA De-Gumming

RF4 RF-FT09 Trackless Planar CPU IC Repair Fixture for BGA De-Gumming

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The RF4 RF-FT09 is a trackless planar repair fixture built for technicians who work daily on dead phone motherboards and BGA chip removal. It replaces the old screw-type clamp with a press-and-release mechanism, so you open it with one hand and lock it instantly. CNC precision molding keeps the clamping force even across CPU, IC, and small PCB sections, supporting a maximum clamping size of 21mm x 46mm. Use it on your repair bench for glue removal, pin straightening, and soldering prep without the chip shifting mid-task. At just 0.30 kg, it sits comfortably under a microscope or hot air station setup in any GSM workshop.

SKU:MST-SUIT-17

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Every technician who has tried removing glue from a CPU or IC with a loose, sliding board knows how a single shift can turn a clean job into a damaged pad. The RF4 RF-FT09 fixes that problem at the source. Instead of the rail-and-screw system found in older PCB holders, this fixture uses a trackless planar structure that lets you position the clamping arm freely across the surface, then lock it down with one press. You skip the slow screw-turning that older fixtures force on you, and you get a tighter, more even grip on delicate chip areas.

On a busy repair bench, speed matters as much as precision. The RF-FT09 is built around a press-to-open, release-to-lock action. You press the lever, slide the board or chip into position, and let go — the clamp engages instantly. This one-hand operation means your other hand stays free for the heat gun, tweezers, or scalpel you're using for de-gumming. Whether you're stripping old thermal glue off a CPU before reballing, or holding a small IC steady while straightening bent pins, the fixture keeps the component locked without crushing or marking the surface.

CNC precision integrated molding gives the RF-FT09 its durability. The body is machined as a single unit rather than assembled from separate stamped parts, so there's no play or wobble at the clamp joint over months of daily use. This matters in a Pakistani repair shop where the same fixture might clamp dozens of boards a day — from a dead phone motherboard waiting on jumper work to a UFS/eMMC chip prepped for reballing. The maximum clamping size is 21mm x 46mm, which covers the CPU and mid-size IC footprints you'll find on most smartphone and tablet motherboards.

Where this fixture fits in your workflow is straightforward: it sits between disassembly and the actual repair action. After you pull the board out for a hang on logo case, a charging issue diagnosis, or a network issue repair, you place it in the RF-FT09 before reaching for hot air or your soldering iron. For CPU re-tinning, the fixture holds the chip flat so solder flows evenly. For IC change karna jobs, it stops the new chip from drifting while you align pads under the microscope. Pair it with a microscope stand and hot air station, and you've got a stable de-gumming and BGA rework station that doesn't rely on tape or manual hand-holding.

Because it's compact and lightweight at 0.30 kg, it doesn't take up much bench space, and you can move it between your soldering station and your microscope workstation without hassle. It also pairs naturally with reballing kits and PCB holders already on your bench — many shops keep an RF-FT09 alongside a larger RF4 glass fixture, using the smaller unit for chip-level work and the larger one for full motherboard clamping.

For shops scaling up from basic tools to a full BGA repair setup, the RF-FT09 is usually one of the first upgrades after a hot air station and microscope. It's not a flashing tool or a programmer — it's the mechanical support that keeps your other tools effective. A soldering station only works as well as the board stays still underneath it, and that's exactly the gap this fixture closes.

Key Features

  • Trackless planar structure for free, rail-free clamping
  • Press-to-open, release-to-lock one-hand operation
  • CNC precision integrated molding for long-term durability
  • Maximum clamping size of 21mm x 46mm for CPU and IC work
  • Stable platform for BGA glue removal and de-gumming
  • Suitable for pin repair and straightening on small components
  • Compact, lightweight build for easy bench and microscope use
  • Compatible with soldering and hot air rework workflows

Specifications

Product Entity RF-FT09 Trackless Planar Repair Fixture
Technology Entity CNC Precision Molded Clamping Mechanism
Compatible Device Entities Smartphone, tablet, and laptop motherboards with CPU/BGA/IC components
Repair Process Entity De-gumming, BGA reballing, CPU IC repair, pin straightening
Industry Entity Mobile Phone Repair and PCB Rework Industry

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