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RF4 RF-H5Pro 800W Hot Air Gun BGA Rework Station

RF4 RF-H5Pro 800W Hot Air Gun BGA Rework Station

Regular price Rs.25,000.00 PKR
Regular price Sale price Rs.25,000.00 PKR
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The RF4 RF-H5Pro is an 800W intelligent hot air rework station built for BGA desoldering, IC reflow, and PCB-level repair work on mobile phones and other electronic boards. It runs on a high-speed brushless turbine fan rated at 13000rpm, giving technicians fast heat recovery when working on multi-layer boards. Temperature control ranges from 100°C to 500°C with ±2°C precision, so IC removal stays consistent across long repair sessions. The handle-mounted controls let you adjust airflow and temperature single-handed without stepping away from the board, which matters when you are running a busy repair bench in Lahore, Karachi, or Islamabad.

SKU:MST-REWORK-STATION-70

⚖️ Weight: 4.0 kg

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Description

Any technician who has fought with a cheap
heat gun on a stubborn PMIC or charging IC knows the frustration of temperature
drift mid-job. The RF4 RF-H5Pro exists to remove that problem from your
workflow. Built as an intelligent BGA rework station, it pairs an 800W heating
core with a high-speed brushless turbine fan spinning at 13000rpm, so the unit
recovers heat fast even during back-to-back desoldering jobs on a busy service
center bench.

The temperature range runs from 100°C to
500°C, wide enough to cover everything from light-touch flex cable rework to
full IC removal on multi-layer PCBs. Constant temperature accuracy sits at
±2°C, which is the difference between a clean IC lift and a scorched pad on
modern densely-packed mainboards. Air volume adjusts from 1% to 100%, giving
you the control to work gently around sensitive components or push full power
when you need to break solder fast on a stubborn board.

For technicians dealing with dead phone
repairs, boot loop issues, or a board that shows hang on logo after a bad
flash, board-level diagnosis often comes down to reflowing or replacing an IC.
The RF-H5Pro handles that IC change karna work with a steady, repeatable heat
profile instead of the inconsistent output you get from budget hot air guns
bought off random suppliers. The handle-mounted control layout means you keep
your eyes and hands on the board while adjusting temperature and airflow, which
speeds up jumper lagana and rework tasks where every second of extra heat
exposure risks damaging nearby components.

Display comes through an LCD segment code
screen, showing real-time set temperature and airflow so you always know
exactly what the gun is outputting rather than guessing based on a dial
position. This matters heavily on Samsung, Oppo, Vivo, Infinix, and Tecno
boards where component density has increased and the margin for heat error has
shrunk. A charging issue on a modern Oppo or Vivo board, for example, often
traces back to a charging IC that needs precise reflow temperature, not a blast
of uncontrolled heat that lifts three components at once.

Body weight comes in at 2.16KG, keeping the
main unit manageable on a repair bench without eating up your workspace. The
handle cable runs 800mm, long enough to give you comfortable reach across a
full mainboard or a larger tablet chassis without the station itself needing to
sit right at the edge of your desk. That handle length also reduces strain on
your wrist during longer rework sessions, something technicians doing volume
repair work across a full day will notice by the end of a shift.

Fit within your repair workflow is
straightforward. The RF-H5Pro slots in as your primary desoldering and reflow
tool alongside a soldering station for fine pin work, a microscope for visual
inspection before and after rework, and a set of pry tools for board removal.
For shops running eMMC or UFS-level repair alongside board repair, this hot air
station handles the physical IC removal and reinstallation step that comes
before or after software marna work on the programmer side. It also pairs
naturally with flux paste and low-temperature solder paste for cleaner BGA
reballing jobs, since consistent heat output reduces the chance of solder ball
bridging during reflow.

Software marna and box chalana operations
depend on hardware being intact first. A board that keeps failing programming
or shows a hardware fault under diagnostic tools usually needs physical rework
before any software-side fix works. The RF-H5Pro covers that physical repair
step reliably, whether you are removing a damaged charging IC, reflowing a
loose CPU connection, or reballing a NAND chip before reinstalling it.

For a repair shop weighing between a basic hot
air gun and a proper rework station, the RF-H5Pro sits in the middle ground:
intelligent temperature control and a strong fan without the price jump of a
full multi-channel BGA station. It suits shop owners who run daily board-level
repair alongside standard screen and battery replacement work, and it holds up
under the volume that a busy service center in Pakistan's mobile repair market
puts through a hot air station week after week.



Key Features

  • 800W heating power for fast, consistent BGA desoldering and IC
    reflow
  • Temperature range of 100°C–500°C covers light rework to full IC
    removal
  • ±2°C constant temperature precision for repeatable results on
    dense PCBs
  • High-speed brushless turbine fan at 13000rpm for quick heat
    recovery
  • Adjustable air volume from 1% to 100% for controlled or
    full-power airflow
  • Handle-mounted controls for single-handed temperature and
    airflow adjustment
  • LCD segment code display showing real-time temperature and
    airflow settings
  • 800mm handle cable length for comfortable reach across larger
    boards

Specifications

Brand Entity RF4
Product Entity RF-H5Pro Hot Air Rework Station
Technology Entity Brushless Turbine Fan Heating System
Compatible Device Entities Samsung, Oppo, Vivo, Infinix, Tecno mainboards
Repair Process Entity BGA Desoldering, IC Reflow, PCB Rework
Industry Entity Mobile Repair Equipment, GSM Repair Tools

FAQ

What is the product name?
The product name is RF4 RF-H5Pro 800W Digital Hot Air Rework Station.
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is RF-H5Pro.
What is this product used for?
This product is used for BGA desoldering, IC reflow, and board-level rework on mobile phone and electronic PCBs.
Which devices are compatible with this product?
This tool works on mainboards from Samsung, Oppo, Vivo, Infinix, Tecno, and other mobile devices requiring hot air rework.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB repair users.
What is the maximum temperature this hot air gun can reach?
The RF-H5Pro reaches a maximum temperature of 500°C, with a working range starting from 100°C.
Does this station maintain stable temperature during long rework sessions?
Yes, the constant temperature precision of ±2°C keeps heat output stable during extended desoldering and reflow work.

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