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S2MPU04 Power IC

S2MPU04 Power IC

Regular price Rs.350.00 PKR
Regular price Sale price Rs.350.00 PKR
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The S2MPU04 is a genuine Samsung power management IC used on Galaxy J2 (2016), J7 (2016), J4 (2018), and A7 (2016) motherboards. When this chip fails, you get dead phone symptoms, no charging, or a board that won't power on at all. It comes in a 144-pin BGA package that matches the original footprint, so you drop it straight onto the same pads without reworking the layout. GSM technicians use this IC for board-level power rail repair, and it's a direct swap when the original PMIC gets damaged from a short, moisture, or a bad charging cycle. Built for bench-level reballing and hot air rework.

⚖️ Weight: 0.01 kg

SKU:MST-IC-106

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Description

Power IC failure is one of the most common reasons a Samsung J-series phone goes completely dead on your bench. The S2MPU04 handles voltage regulation across the motherboard, and when it fails or shorts, you'll see a phone that won't power on, won't charge, or drains the battery even when off. This chip is the exact replacement Samsung used on the Galaxy J2 (2016) / J200, Galaxy J7 (2016), Galaxy J4 (2018), and Galaxy A7 (2016) / A7100 boards, so you're not guessing about fitment — it's the OEM part number for that board family.On the repair bench, this IC comes into play during dead-after-flash cases too. Sometimes a board flashes fine in the software, but the phone still won't boot because the power IC itself is the fault, not the firmware. If you've already ruled out software issues — reflashed, checked the boot chain, and the phone still shows a dead board or hangs before the logo — the power IC is next on your checklist. A quick diode-mode check on the power rails against a known-good board will usually confirm whether the S2MPU04 is shorting or not holding voltage.Installation is straightforward for anyone running a proper hot air station or BGA rework setup, but it's not a beginner part. You're pulling a 144-pin BGA chip off a dense multi-layer board, so preheating the board correctly matters — rush the heat profile and you risk lifting pads or damaging neighboring components. Clean the pads fully after removal, reball if your existing balls look uneven, and reflow with a controlled hot air profile rather than eyeballing it. A microscope helps a lot here for pad inspection before you drop the new chip on.Some suppliers list the S2MPU04 as interchangeable with the S2MPU03A on the same board family — worth checking against the specific motherboard revision you're working on before you commit to a soldering job, since board revisions do shift IC options across production runs.This chip earns its place on the bench because power rail failures are common enough on this Samsung series that having the exact IC on hand saves you a diagnosis-to-repair cycle you'd otherwise lose waiting on parts. For a shop running regular Samsung J-series and A7 traffic, it's a stock item, not a one-off order.
Pair it with your existing ISP or eMMC tools if the board also needs a software-side check after the hardware fix — a dead board can have both a power IC fault and a corrupted eMMC sitting underneath it, so confirm the power rail is stable before you move to the software diagnosis.

Key Features

  • Genuine Samsung PMIC part number matching OEM board specification
  • 144-pin BGA package fits the original motherboard footprint
  • Direct board-level replacement for power rail failures
  • Used for dead phone, no-charging, and no-power-on repair cases
  • Fits Galaxy J2 (2016), J7 (2016), J4 (2018), and A7 (2016) board family
  • Some board revisions accept S2MPU03A as an interchangeable option — verify before soldering
  • Requires hot air BGA rework equipment for installation
  • Supports fault isolation on power circuit repairs before software diagnosis

Specifications

Brand Entity Samsung
Product Entity S2MPU04 Power Management IC
Technology Entity Power Management IC (PMIC), BGA packaging
Compatible Device Entities Galaxy J2 (2016), Galaxy J7 (2016), Galaxy J4 (2018), Galaxy A7 (2016)
Repair Process Entity BGA reballing, hot air rework, power rail diagnosis
Industry Entity Mobile Repair Industry, PCB Repair, GSM Technician Tools

Compatible Devices

Samsung Galaxy J2 (2016) / J200, Galaxy J7 (2016), Galaxy J4 (2018), Galaxy A7 (2016) / A7100 — board-level compatibility, verified per motherboard revision before installation.

Common Repair Uses

Dead phone/no power-on repair, no-charging fault isolation, board short-circuit troubleshooting on the power rail, dead-after-flash diagnosis, BGA reballing and IC replacement on Samsung J-series and A7 motherboards.

FAQ

What is the product name?
The product name is S2MPU04 Power Management IC.
What is the brand of this product?
The brand of this product is Samsung.
What is the model of this product?
The model of this product is S2MPU04.
What is this product used for?
This product is used for board-level power management repair on dead phone, no-charging, and no-power-on faults.
Which devices are compatible with this product?
This product is compatible with Samsung Galaxy J2 (2016), Galaxy J7 (2016), Galaxy J4 (2018), and Galaxy A7 (2016) motherboards.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional GSM technicians.
Is the S2MPU04 interchangeable with the S2MPU03A on the same board?
On some board revisions of the J-series and A7 family, suppliers list the S2MPU03A as an alternate option, but you should confirm against your specific motherboard revision before soldering.
What tools do I need to replace the S2MPU04 power IC?
You need a hot air BGA rework station, flux, a microscope for pad inspection, and reballing materials if the pads need reconditioning after removal.

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