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S2MPU06 Power Management IC (PMIC) for Samsung Galaxy J7 J710 / J710F – Power Supply Chip

S2MPU06 Power Management IC (PMIC) for Samsung Galaxy J7 J710 / J710F – Power Supply Chip

Regular price Rs.250.00 PKR
Regular price Sale price Rs.250.00 PKR
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The S2MPU06 power control IC is the exact replacement chip used to fix charging, dead phone, and power management faults on the Samsung Galaxy J7 (2016) J710/J710F board. This BGA-packaged IC regulates battery charging current, prevents overcharging, and protects surrounding motherboard components from voltage surge damage. It also fits Galaxy J5 Prime G570F/DS, Galaxy J3 (2017) J330F, and Galaxy J7 Pro (2017) boards sharing the same power architecture. Built for reballing and hot air rework, it gives GSM technicians a reliable IC-level solution for dead-after-charge, no-charging, and overheating-related motherboard faults common in repair shops across Lahore, Karachi, and Islamabad.

⚖️ Weight: 0.01 kg

SKU:MST-IC-18

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Description

When a Galaxy J710F comes into your workshop showing no charging response, sudden shutdown while on charger, or a battery that swells from overcharging, the fault almost always traces back to the power control IC on the motherboard. The S2MPU06 sits directly in the charging path, managing how current flows from the charging circuit into the battery cell. Once this chip degrades from moisture exposure, a bad drop, or a previous unprofessional repair attempt, the phone either stops accepting charge completely or charges without ever cutting off, damaging the battery over time. You get a direct like-for-like replacement here, not a generic substitute. The S2MPU06 comes in BGA package form, so you need a hot air station and reballing stencil on your bench to remove the damaged chip and mount the new one with proper solder balls. Supply voltage on this IC runs 1.0–6V, and dissipation power sits around 0.6W, matching the tight power budget of a J-series board where thermal management already runs close to the edge. Getting the reflow temperature and preheat stage right during rework matters more here than on larger ICs, since the board pad density around this location is high and neighboring components can shift if the hot air nozzle runs too wide. This chip is not exclusive to the J710. Samsung reused the same power management block across the G570F/DS Galaxy J5 Prime, J330F Galaxy J3 (2017), and Galaxy J7 Pro (2017), so if your bench sees a mix of J-series and mid-range Galaxy boards, stocking the S2MPU06 covers several charging-fault repair jobs at once instead of ordering a different IC per model. In your repair workflow, this part fits at the IC-level power diagnostics stage — after you have already ruled out the charging port, flex cable, and battery itself as the fault. A quick check with your multimeter across the power rail near this IC, or a thermal camera check for a hot spot during charging, usually confirms the chip is the actual failure point before you commit to reballing. Technicians handling dead-after-flash boards or hang-on-logo cases sometimes find the same IC implicated when the board draws no current at all on the power supply test, since this chip also plays a role in the initial power-on sequence. Order handling matters with a part this small. Store it in an anti-static bag until you're ready to reball, and keep your tweezers and workstation grounded, since these ICs are static-sensitive. If you're running a busy service center working through multiple J-series boards a week, keeping a small stock of this IC on hand saves you the wait time of ordering per-repair and keeps your turnaround time competitive for customers who need same-day phone repair. For KB GSM Store customers across Pakistan, this part ships ready for direct use on your reballing station — no additional pre-tinning needed, letting you move straight into the reflow and testing stage of the repair.

Key Features

• Direct replacement for Samsung J710/J710F power management faults
• BGA package compatible with standard reballing stencils
• Regulates battery charging current and cutoff
• Protects motherboard from voltage surge damage
• Cross-compatible with G570F/DS, J330F, and J7 Pro 2017 boards
• Suitable for dead-after-charge and no-charging repair cases
• Static-sensitive part, anti-static handling required
• Ready for direct reflow without pre-tinning

Specifications

Brand Entity Samsung
Product Entity S2MPU06 Power Control IC
Technology Entity BGA Power Management IC
Compatible Device Entities Galaxy J710/J710F, Galaxy J5 Prime G570F/DS, Galaxy J3 2017 J330F, Galaxy J7 Pro 2017
Repair Process Entity IC Reballing and Motherboard Power Repair
Industry Entity Mobile Repair Industry Pakistan

FAQ

What is the product name?
The product name is S2MPU06 Power Control IC for Samsung J710/J710F.
What is the brand of this product?
This is a Samsung-compatible replacement power control IC.
What is the model of this product?
The model is S2MPU06.
What is this product used for?
This IC is used to repair charging faults, no-power issues, and battery overcharge protection on compatible Samsung motherboards.
Which devices are compatible with this product?
This IC is compatible with Galaxy J710/J710F, Galaxy J5 Prime G570F/DS, Galaxy J3 2017 J330F, and Galaxy J7 Pro 2017.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this IC come pre-tinned for reballing?
Yes, this IC ships ready for direct reflow without additional pre-tinning.
What package type is this IC, and does it need special rework tools?
This IC uses BGA packaging and requires a hot air rework station with a matching reballing stencil for removal and remounting.

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