Skip to product information
1 of 5

S535 Power IC

S535 Power IC

Regular price Rs.450.00 PKR
Regular price Sale price Rs.450.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

The S535 Power Management IC is the big power supply chip used on Samsung Galaxy S7 Edge (G935F/G935FD) motherboards. This BGA-packaged PMIC controls voltage regulation and power distribution across the board, and it's the go-to replacement when a Galaxy S7 Edge shows dead phone symptoms, no power, or fails to boot after a liquid or short-circuit fault. Technicians reballing or direct-heating this chip use it to restore board-level power delivery without needing a full motherboard swap, making it a standard bench stock item for any Samsung repair workshop.

⚖️ Weight: 0.01 kg

SKU:

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

When a Samsung Galaxy S7 Edge comes into your workshop completely dead — no charging light, no logo, no response to a battery or charging port swap — the power management IC is usually the first suspect after you rule out the battery and charging circuit. The S535 is the big power IC on the G935F/G935FD board, sitting alongside its smaller counterpart and handling the core voltage rails that every other component on the board depends on. If this chip develops a dry joint, cracks internally, or gets damaged from a short circuit or liquid exposure, the phone won't power on at all, and no amount of software marna or flashing will bring it back until the hardware fault is fixed.This is a board-level component, not a plug-and-play part, so the replacement work happens under a microscope or magnifier with a hot air rework station or infrared preheater. The typical workflow starts with diagnosing the fault properly — checking for a short on the power rail with a bench power supply or multimeter before assuming the IC itself is bad. Once you've confirmed the S535 is the actual failure point, the board gets masked with heat-resistant tape, flux is applied around the chip, and hot air is used to lift it off the pads without disturbing neighboring components. Pakistani technicians handling Galaxy S7 Edge boards know this step well: too much heat and you risk lifting pads or damaging nearby ICs, too little and the chip won't budge cleanly.
After removal, the board pads get cleaned with soldering wick and fresh flux, then the new S535 IC change karna happens — reballing the chip if you're using a bare die, or placing a pre-balled replacement directly using a jig or stencil matched to its 192-pin BGA footprint. Precise alignment matters here since the pad pitch is tight, and even a slight shift during reflow can cause a bridge or an open connection, both of which bring you right back to a dead phone. Once reflowed and cooled, a continuity check and a power-on test confirm whether the board is drawing current correctly again.This IC is commonly needed alongside other power-related faults on the G935F board, including hang on logo issues, boot loop problems after a failed software update, and phones that show charging issue symptoms without actually charging. Many workshops keep both the S515 and S535 in stock together since they're both used in the same power management cluster on Galaxy S7 and S7 Edge boards, and a tech won't always know which one has failed until the board is under the scope. For a Lahore, Karachi, or Islamabad repair shop handling steady Galaxy S7 Edge traffic, having this part on hand cuts turnaround time significantly compared to sourcing a full donor motherboard.
Reliability at this level of repair comes down to two things: correct diagnosis and clean soldering technique. A misdiagnosed IC replacement wastes both the part and the customer's time, so confirming the fault with proper testing before reaching for the hot air station saves rework later. This S535 IC is manufactured to match the original chip's pinout and footprint, giving you a direct swap without needing to modify the board or run jumper wires, so long as the surrounding circuit is otherwise healthy.

Key Features

Direct pin-to-pin replacement for the original Galaxy S7 Edge power IC

192-pin BGA package matching factory footprint

Restores core voltage rail delivery across the motherboard

Suitable for hot air rework and reballing workflows

Works alongside S515/S555 IC options for full power cluster diagnosis

Eliminates need for full motherboard replacement on power faults

Compact chip size fits standard microscope-assisted rework

Stocked commonly with other Galaxy S7 Edge board-level ICs

Specifications

Brand Entity Samsung
Product Entity S535 Power Management IC
Technology Entity BGA Power Management IC / PMIC
Compatible Device Entities Samsung Galaxy S7 Edge, G935F, G935FD
Repair Process Entity IC Reballing, Hot Air Rework, Board-Level Power Repair
Industry Entity Mobile Phone Motherboard Repair, GSM Repair Industry

Compatible Devices

Samsung Galaxy S7 Edge (SM-G935F, SM-G935FD) — this is the "big" power IC used specifically on the S7 Edge power management cluster alongside the S515 and S555 variants.

Common Repair Uses

Dead phone/no power repair, board-level power rail restoration, IC reballing and replacement after short-circuit or liquid damage, hang-on-logo and boot loop troubleshooting tied to power delivery faults.

FAQ

What is the product name?
The product name is Samsung S535 Power Management IC for Galaxy S7 Edge.
What is the brand of this product?
This is a compatible replacement power IC manufactured to match Samsung's original S535 chip specifications.
What is the model of this product?
The model is S535.
What is this product used for?
This product is used to replace a faulty power management IC on Samsung Galaxy S7 Edge motherboards, typically for dead phone or no-power faults.
Which devices are compatible with this product?
This product is compatible with the Samsung Galaxy S7 Edge, model numbers G935F and G935FD.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional GSM repair businesses.
Is the S535 the same as the S515 or S555 IC?
No, the S535 is the "big" power management IC on the Galaxy S7 Edge board, while the S515 and S555 are separate ICs in the same power cluster with different roles.
What package type does the S535 IC use, and does it need reballing?
The S535 uses a 192-pin BGA package, so it needs to be reballed or replaced using a pre-balled chip matched to that footprint during hot air rework.

Ask any Query