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S560 Power IC

S560 Power IC

Regular price Rs.400.00 PKR
Regular price Sale price Rs.400.00 PKR
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The S560 Power IC is the power management chip fitted on Samsung Galaxy S9 and S9 Plus motherboards (G960F, G965F). When a Galaxy S9 goes completely dead or won't power on after a drop, water damage, or a bad flash, this IC is usually the first suspect. Replacing it means desoldering the faulty chip and reballing a new S560 onto the board — not a plug-and-play part. Stock this for your bench if you handle Samsung dead-phone cases regularly, since power IC failure is one of the most common reasons an S9 won't boot.

⚖️ Weight: 0.01 kg

SKU:MST-IC-93

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Description

If an S9 or S9 Plus comes into your shop completely dead — no logo, no vibration, no charging response — check the S560 before you start swapping other components. This chip handles power distribution and regulation on the Galaxy S9 motherboard, and it's a known failure point on both the G960F and G965F variants. A cracked board, a liquid damage case, or even a rough flash session can take it out.Replacing the S560 isn't a job you hand to a beginner. You're desoldering a BGA chip off a densely packed board, cleaning the pads, and reballing a new IC in its exact position without lifting a trace or cooking a neighboring component. Get the temperature profile wrong on your hot air station and you risk turning a power IC repair into a full board replacement job. This is precision rework — the kind of task that separates a board-level technician from someone who just swaps screens and batteries.On the diagnostic side, a dead-after-drop or dead-after-flash S9 doesn't automatically mean the S560 is bad. Run your usual checks first — short circuit test with a DC power supply, current draw reading, thermal camera pass if you have one — before committing to a chip swap. If the board pulls abnormal current or heats up at the power IC location under a bench supply, that's your confirmation. Skipping this step and reballing blind wastes both your time and the customer's money if the actual fault sits elsewhere on the board.Stocking genuine S560 chips matters more than it seems. A counterfeit or mismarked IC might get the phone to power on in your test, then fail again within days — and that comes back to your shop as a redo, not a paid job. For a shop running steady Samsung traffic, keeping verified S560 stock on the bench cuts your turnaround time significantly instead of waiting on a supplier mid-repair.This chip fits into the broader S9 motherboard repair workflow — after power IC replacement, you'll typically want to re-test the board on a test fixture or jig before reassembly, confirm charging behavior, and check the phone holds a charge under load. If your workshop also handles CPU reballing or NAND/eMMC work on Samsung boards, the S560 swap uses the same hot air and BGA rework skill set, so it's a natural extension of that service line rather than a separate specialty.Buy this if you're running a repair shop or service center that regularly sees Samsung Galaxy S9 dead-phone cases and you want a genuine, tested power IC on hand rather than sourcing one after diagnosis.

Key Features

Genuine S560 power management IC for Galaxy S9 and S9 Plus

Direct fit for G960F and G965F motherboard variants

Addresses dead phone and no-power boot issues

Suited for BGA reballing and hot air rework

Tested unit for board-level repair work

Fits into standard Samsung dead-phone diagnostic workflow

Useful stock item for shops handling regular Samsung repair volume

Compatible with standard reballing stencils used for this chip

Specifications

Brand Entity Samsung
Product Entity S560 Power Management IC
Technology Entity BGA / Power Management Integrated Circuit
Compatible Device Entities Samsung Galaxy S9, Samsung Galaxy S9 Plus, G960F, G965F
Repair Process Entity Board-level rework, IC reballing, dead phone diagnostics
Industry Entity Mobile Repair Industry, PCB Repair

Compatible Devices


Samsung Galaxy S9 (G960F) and Galaxy S9 Plus (G965F) — Samsung Exynos-variant boards using this power IC.

Common Repair Uses


Dead phone repair (no power/no boot), board-level power management fault diagnosis, BGA reballing and IC replacement on Galaxy S9 motherboards.

FAQ

What is the product name?
The product name is S560 Power IC.
What is the brand of this product?
The brand of this product is Samsung (OEM-compatible power management IC).
What is the model of this product?
The model is S560.
What is this product used for?
This IC is used to repair dead-phone and no-power issues on Samsung Galaxy S9 and S9 Plus motherboards.
Which devices are compatible with this product?
This product is compatible with Samsung Galaxy S9 (G960F) and Galaxy S9 Plus (G965F).
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional board-level repair businesses.
Does replacing the S560 require soldering?
Yes, the S560 is a BGA chip and needs desoldering of the faulty IC and reballing of the new one directly on the motherboard.
How do I confirm the S560 is actually faulty before replacing it?
Run a short circuit and current draw test on the power rail with a DC bench power supply; abnormal current draw or heating at the IC location confirms the fault before you commit to reballing.

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