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SC2723E Power IC

SC2723E Power IC

Regular price Rs.350.00 PKR
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The SC2723E Power IC is a BGA-packaged power management chip pulled and tested for use in Samsung repair work. Technicians reach for this IC when a board shows dead phone symptoms, charging issue complaints, or hang on logo after a bad flash. It handles the supply rail duties on affected Samsung boards, so a faulty unit often shows up as no power, no charging response, or a board that boots partway and stops. Rated for a 1.0V–6V supply range with 0.6W dissipation, it drops into the same BGA footprint as the original chip on supported boards, making reballing and direct replacement straightforward on the bench.

⚖️ Weight: 0.01 kg

SKU:MST-IC-53

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Description


Power IC failures sit near the top of the list when a Samsung board comes in dead. The SC2723E is the chip technicians pull out for exactly that situation — a BGA power management IC that controls voltage delivery to key sections of the board on supported Samsung models. When this chip goes bad, the phone typically won't power on at all, won't take a charge, or boots to the logo and hangs there no matter how many times you reflash it.

You get a chip rated for a 1.0V to 6V supply voltage window with a 0.6W dissipation power rating, matching the electrical profile of the original part on the boards it supports. That matters on the bench: swap in a chip with the wrong voltage tolerance and you risk repeat failures or a board that never fully stabilizes. This one is built to the same electrical spec, so once it's reballed and seated correctly, the power rail behaves the way it should.The BGA package means this isn't a drop-in-with-tweezers job — you need a hot air station set to the right profile, fresh solder balls sized for the pad pitch, and a steady hand under the microscope. Reflow too hot and you risk lifting neighboring components or damaging the substrate; reflow too cool and you get cold joints that pass a visual check but fail under load a week later. Preheat the board evenly, keep your air pressure controlled, and clean the pads thoroughly before reballing — that's where most first-attempt failures on power IC swaps actually come from, not the chip itself.On the diagnostic side, a failing SC2723E rarely announces itself cleanly. You'll see a phone that's completely dead with no current draw on the bench power supply, or one that pulls current but never boots — sometimes with a mA reading that stays flat where a healthy board would show a boot spike. Some units come in after a customer tried a software fix at home: dead after flash is the classic symptom when someone flashes firmware on a board that already had a marginal power section, and the flash pushes it over the edge. Isolate the power rail with your multimeter before you commit to a reball; confirming continuity and checking for shorts on the supply lines first saves you from pulling a chip that wasn't actually the fault.This IC is a hardware fault fix, not a software one — don't waste bench time trying box chalana or software marna on a board where the power section itself is dead. If your diagnostics point to the PMU section and the board matches the compatible model list, IC change karna with a verified replacement like this one is the direct path back to a working charging port and a phone that powers on normally.Stock condition on these chips is tested before listing, and each unit ships ready for reballing straight out of the tray — no extra prep needed beyond your normal reballing workflow. Keep a few in your parts drawer alongside your other Samsung PMU stock; power IC failures on these model families are common enough on the repair bench that having verified replacements on hand cuts your turnaround time significantly.

Key Features

BGA power management IC matched to supported Samsung board footprints

Rated 1.0V–6V supply voltage for accurate rail compatibility

0.6W dissipation power matching original chip electrical profile

Tested chip condition before it leaves the bench

Direct fit for reballing without pad modification on supported boards

Fixes dead phone, no-charging, and hang-on-logo symptoms tied to PMU failure

Suited for board-level rework on J100H, I9060, G360H, G355H, J210F

Compact BGA footprint keeps rework time low on the microscope station

Specifications

Brand Entity Not manufacturer-branded — sourced as a genuine pulled/tested BGA power IC Product Entity

Compatible Devices


Samsung Galaxy J100H (Galaxy J1), I9060 (Galaxy S Duos 2 / Trend 3), G360H (Galaxy Core Prime), G355H (Galaxy Core 2), J210F — verified against repair-market chip listings for these board families.

Common Repair Uses


Dead phone power section repair, charging issue and no-charging-response repair, hang on logo / boot loop repair traced to the PMU rail, board-level power IC replacement via BGA reballing and rework.

FAQ

What is the product name?
The product name is SC2723E Power IC. What is the model of this product?
What is this product used for?
This product is used for repairing dead phone and no-charging faults on Samsung boards by replacing the failed power management (PMU) chip.
Which devices are compatible with this product?
This product is compatible with Samsung J100H, I9060, G360H, G355H, and J210F boards.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What package does the SC2723E come in and does it need reballing before installation?
The SC2723E ships in BGA package form and needs fresh solder balls applied through your standard reballing process before reflow onto the board.
Can the SC2723E fix a hang on logo issue after flashing?
Yes, when the hang on logo issue traces back to a faulty power rail rather than corrupted firmware, replacing the SC2723E restores normal boot behavior on supported boards.

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