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SC2723S Power IC

SC2723S Power IC

Regular price Rs.250.00 PKR
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The SC2723S is a power management IC (PMIC) used on the motherboards of several Spreadtrum-chipset Samsung Galaxy devices, including the Galaxy J1, J1 Mini, Galaxy J2, Core Prime, and Core 2. When a phone shows no power, dead after flash, or random restart symptoms, this chip is one of the first suspects on the repair bench. This listing gives Pakistani GSM technicians a verified, board-level replacement to bring dead Samsung boards back to a working state without hunting for a working donor chip.

⚖️ Weight: 0.01 kg

SKU:MST-IC-149

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Description

If a Samsung Galaxy J1, J2, Core Prime, or Core 2 comes into your shop completely dead, not charging, or stuck at a black screen with no current draw on the power supply, the SC2723S power IC is one of the components you check before condemning the board. This PMIC sits on Spreadtrum-based Samsung boards and handles the core power distribution that every other component on the board depends on. Without a working power IC, the CPU never gets a clean power sequence, and the phone stays dead no matter what software you flash.Technicians working on these older Galaxy models know the pattern. A phone that was dropped, exposed to moisture, or came in after a failed charging attempt often shows a short on the battery connector or the power rail. You isolate the short with a bench power supply, and if the short traces back to the power IC footprint, reballing or replacing the chip is usually the fix. This is exactly where the SC2723S comes in as a direct board-level replacement.On your repair bench, this chip is relevant across a specific set of boards. It shows up on the Samsung Galaxy J1 (SM-J100H), Galaxy J1 Mini and J1 Nxt (SM-J105x series), Galaxy Core Prime (SM-G360H), Galaxy Core 2 (SM-G355H), and Galaxy J2 (SM-J210F). These boards share the same Spreadtrum power architecture, which is why the same PMIC part number turns up across what looks like unrelated Galaxy models on paper. Before you commit to a chip change, always cross-check the exact board revision against a working donor or a verified schematic, since board revisions inside the same model number can differ.Removing and installing this IC needs a proper hot air rework station with accurate temperature control, since these boards use lead-free solder and the surrounding components are heat-sensitive. Preheat the board evenly, use the correct nozzle size to keep hot air localized on the IC footprint, and clean the pads thoroughly before reballing. A fresh stencil for the SC2723S footprint keeps ball placement accurate and cuts down on rework. Technicians who skip the preheat step or run air temperature too high often end up lifting nearby pads, which turns a straightforward IC change into a much bigger board repair.Before ordering, confirm the fault is genuinely IC-related and not a cracked solder joint, a bent connector pin, or a liquid-damage corrosion issue elsewhere on the board. A quick continuity check on the power rail and a visual inspection under a microscope will save you from an unnecessary chip change. Once you've isolated the fault to the power IC itself, this chip gives you a direct path to bring a dead board back online without waiting on a full motherboard swap.For shops in Lahore, Karachi, and Islamabad running high volumes of Samsung board repairs, keeping the SC2723S in stock alongside your reballing stencils and flux means you're not stuck waiting on a donor board every time a low-cost Samsung comes in dead. It's a small, inexpensive part that solves a repair that would otherwise mean replacing the entire motherboard.

Key Features

Direct board-level replacement PMIC for supported Samsung Spreadtrum boards

Restores power sequencing on dead-board repairs

Compatible with multiple Galaxy J-series and Core-series models sharing the same power architecture

Suitable for reballing with standard BGA equipment and a matching stencil

Useful for isolating and resolving short-circuit faults on the power rail

Small footprint fits standard hot air rework workflows

Practical stock item for shops handling high volumes of Samsung repairs

Helps avoid full motherboard replacement on dead-phone cases

Specifications

Brand Entity Samsung
Product Entity SC2723S Power IC / PMIC
Technology Entity Spreadtrum SC27xx power management architecture
Compatible Device Entities Galaxy J1, Galaxy J1 Mini, Galaxy Core Prime, Galaxy Core 2, Galaxy J2
Repair Process Entity BGA reballing, IC replacement, dead board repair
Industry Entity Mobile phone repair, GSM technician tools, PCB repair

Compatible Devices

Samsung Galaxy J1 (SM-J100H), Galaxy J1 Mini/Nxt (SM-J105x), Galaxy Core Prime (SM-G360H), Galaxy Core 2 (SM-G355H), Galaxy J2 (SM-J210F) — verify exact board revision against a working sample before installation, since revisions can differ within the same model number.

Common Repair Uses

Dead board repair, no power/no display faults, short-circuit and current-draw troubleshooting on the power rail, reballing after moisture or liquid damage, board-level power IC replacement following a failed charging or drop incident.

FAQ

What is the product name?
The product name is SC2723S Power IC.
What is the brand of this product?
This power IC is used on Samsung Galaxy boards built on the Spreadtrum SC27xx platform.
What is the model of this product?
The model is SC2723S.
What is this product used for?
It is used to repair dead-board and no-power faults by replacing the faulty power management IC.
Which devices are compatible with this product?
It is compatible with the Samsung Galaxy J1 (SM-J100H), Galaxy J1 Mini/Nxt (SM-J105x), Galaxy Core Prime (SM-G360H), Galaxy Core 2 (SM-G355H), and Galaxy J2 (SM-J210F).
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the SC2723S fix a phone that shows no power at all?
If the no-power fault traces back to a short or failure on the power IC footprint, replacing the SC2723S can restore power sequencing and bring the board back on.
Does replacing the SC2723S require reballing equipment?
Yes, a hot air rework station and a matching BGA stencil are needed to remove the old chip and reball the replacement accurately.

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