Skip to product information
1 of 5

SM8150 503-AC CPU iC

SM8150 503-AC CPU iC

Regular price Rs.5,200.00 PKR
Regular price Sale price Rs.5,200.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

The SM8150 503-AC CPU IC is the Qualcomm Snapdragon 855 processor chip found on boards like Mi9, Mi9T Pro, POCO X3 Pro, and Blackshark 2. You reach for this IC when a board comes in dead after flash, stuck on logo, or showing no power at all and diagnosis points straight to the CPU. Techs use it for direct IC replacement or reballing on Xiaomi, Realme, Oppo, and Vivo boards that share the SM8150 platform. Original, tested stock — no shortcuts, no guesswork on your bench.

⚖️ Weight: 0.01 kg

SKU:MST-IC-341

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

When a Snapdragon 855 board lands on your bench dead after flash, or hangs on logo no matter what software you throw at it, the SM8150 503-AC CPU IC is usually the part you end up chasing. This chip is the main processor for devices like the Mi9, Mi9T Pro, POCO X3 Pro, and Blackshark 2 — boards you probably see often if you work Xiaomi and sub-brand repairs.Before you commit to a CPU change, rule out the easier stuff first. Check the power rails, inspect for shorts, and confirm the PMIC and RAM aren't the actual culprit — CPU reballing is expensive time on your iron, and you don't want to redo a board twice. Once you've isolated the fault to the processor itself, this IC gives you a clean original replacement instead of a pulled or reworked chip that carries its own risk.Hardware fault on the CPU shows up in a few recognizable ways: dead phone with zero current draw, boot loop that never clears after multiple flash attempts, or a board that powers the charging IC but never boots the OS. If your current draw test and jumper checks point to the SoC instead of the eMMC or power management IC, this is the part you order.Handling this chip needs the same discipline as any BGA rework — preheat the board properly, use flux generously, and don't rush the reflow. A hot air station with steady temperature control and a decent microscope for post-reballing inspection make the difference between a working board and a repeat visit. If you're not confident on manual reballing yet, pair this IC with a reballing stencil made for the SM8150 package to keep your ball pattern consistent.This chip is original and tested stock, not a scavenged pull with unknown cycle history. For a shop doing volume Xiaomi and POCO repairs, that consistency matters — a bad reball costs you the customer's phone and your reputation on top of it.Keep in mind this IC is specific to the SM8150 (Snapdragon 855) platform. Don't cross it with SM8150-AB or SM8250 variants even though the part numbers look similar on a shelf — pin mapping and firmware calibration differ, and a mismatched chip won't boot even after a clean reball.Stock this alongside your other ISP and UFS workflow tools since a CPU-dead board often needs EDL mode access afterward to confirm the flash and recheck IMEI and baseband. Pair it with your existing hot air station, PCB holder, and multimeter setup, and you've got a complete path from diagnosis to a working board handed back to the customer.

Key Features

Original Qualcomm SM8150 CPU IC, not a recycled pull

Tested stock — verified before it ships to your bench

Direct fit for Mi9, Mi9T Pro, POCO X3 Pro, and Blackshark 2 boards

Suitable for both direct IC swap and full reballing workflow

Matches the Snapdragon 855 pin configuration for SM8150 boards

Useful reference point for isolating CPU-side hardware faults

Fits standard BGA rework process with hot air stations

Compact chip footprint keeps stock manageable on a busy bench

Specifications

Brand Entity Qualcomm
Product Entity SM8150 503-AC CPU IC
Technology Entity Snapdragon 855 SoC, BGA Packaging
Compatible Device Entities Xiaomi Mi9, Mi9T Pro, POCO X3 Pro, Black Shark 2
Repair Process Entity CPU IC Replacement, BGA Reballing, Hardware Fault Diagnosis
Industry Entity Mobile Phone Repair, PCB Repair, GSM Technician Workshops

Compatible Devices

Xiaomi Mi9, Mi9T Pro, POCO X3 Pro, Black Shark 2, and other Xiaomi/Redmi/POCO series boards built on the Qualcomm SM8150 (Snapdragon 855) platform

Common Repair Uses

CPU IC replacement and reballing for dead-after-flash boards, boot loop issues, no-power faults, and hang-on-logo cases traced to the processor on SM8150-based devices

FAQ

What is the product name?
The product name is SM8150 503-AC CPU IC.
What is the brand of this product?
This is a Qualcomm SM8150 series CPU IC.
What is the model of this product?
The model is SM8150 503-AC.
What is this product used for?
It's used for CPU IC replacement and reballing on boards with a dead-after-flash, boot loop, or no-power fault traced to the processor.
Which devices are compatible with this product?
It's compatible with Mi9, Mi9T Pro, POCO X3 Pro, Black Shark 2, and other boards built on the Qualcomm SM8150 (Snapdragon 855) platform.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Is SM8150 503-AC the same as SM8150 103-AC or 103-AB variants?
No. These are different revision codes on the same SM8150 platform, and mixing them can cause boot failure even after a proper reball, so match the exact code on the faulty board before ordering.
Does this CPU IC need reballing or can it be soldered directly?
It's a BGA chip, so it needs proper reballing with matching solder balls and a hot air station — direct soldering without reballing won't give reliable joints on this package.

Ask any Query