TAS2-SA Audio IC

Open up a Huawei or Honor board with a dead speaker complaint and you'll usually find the TAS2-SA marking sitting close to the speaker connector. This is the printed marking for Texas Instruments' TAS2562YFPT, a mono Class-D smart amplifier built specifically for phone-grade audio output. It doesn't just drive the speaker — it monitors voltage and current in real time through its I/V sense feature, which protects the speaker coil from overdrive and lets the phone push louder output without blowing the driver. The integrated 11V Class-H boost circuit is what gives these small phones enough headroom to hit decent volume from a 3.7V–4.2V battery rail, stepping the supply up internally instead of relying on a separate boost converter on the board.On the repair bench, this chip shows up in a handful of recurring fault patterns. A phone that boots fine, connects to network, and charges normally but has no sound from the loudspeaker or a crackling, distorted output is the classic symptom. Sometimes it's paired with a dead earpiece too if the same IC routes both outputs. Liquid damage is one of the most common causes since this IC sits close to the speaker mesh and charging port, both entry points for moisture. A short on the VSUP rail from a liquid-damaged board can also take this IC down along with adjacent components, so always check the board for corrosion and do a proper ultrasonic clean before reballing.Diagnosing before you commit to an IC change matters here. Check the speaker connector and flex cable first — those fail more often than the IC itself and cost nothing to rule out. Measure the VSUP rail with a multimeter to confirm the supply reaching the chip is within 1.65V to 1.95V; if it's missing or shorted, look upstream at the PMIC or power rail before blaming this IC. If voltage checks out and the speaker itself tests good on continuity, the audio IC becomes the prime suspect. A thermal camera or diode mode check across the IC's ground pins can help spot a shorted chip before you commit to removal.For the actual repair, this is a fine-pitch 36-ball DSBGA package at 0.4mm pitch, so it needs a hot air station with tight temperature control, flux, and a matching stencil for reballing — freehand soldering on pads this small isn't realistic. Preheat the board properly before hot air work to avoid stressing neighboring components, and reball with fresh solder balls rather than reusing old ones, since ball height consistency affects whether the chip sits flat during reflow. After placement, a continuity check on the speaker output pins before closing the board saves a second disassembly if something didn't seat right.This part is commonly sourced by technicians working on Huawei Honor 20, Mate 30 Pro, Nova 5i, Nova 4e boards, and select Xiaomi and Redmi models where the same TAS2-SA marking appears near the speaker circuit. Always confirm the marking visually against the board you're repairing before ordering, since board layouts and IC placement vary by model year even when the same chip is used.