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UFI EMMCeMCP Socket 221-FBGA

UFI EMMCeMCP Socket 221-FBGA

Regular price Rs.4,500.00 PKR
Regular price Sale price Rs.4,500.00 PKR
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The UFI EMMC/eMCP Socket 221-FBGA adapter is a dedicated BGA221 test socket built for use with the UFI-Box eMMC service tool. It lets technicians mount a BGA221 eMMC or eMCP chip directly for reading, repairing, and reprogramming without soldering it onto the board first. This adapter supports eMMC ICs from brands like Samsung, SK Hynix, Toshiba, Kingston, and Micron, making it a practical addition for any GSM repair bench dealing with dead phone, boot loop, or software marna cases where the eMMC needs direct chip-level access.

SKU:MST-SOCKET-22

⚖️ Weight: 0.1 kg

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Description

If you run a GSM repair bench and deal with dead-after-flash phones, hang on logo issues, or boards where the eMMC chip needs to come off, this UFI 221-FBGA socket saves you a lot of rework time. Instead of reballing the IC back onto a donor board just to test it, you drop the chip straight into this BGA221 socket and connect it to your UFI-Box. The socket is designed specifically around the 221-FBGA pinout, which covers a large share of eMMC and eMCP chips used in Android phones across Samsung, SK Hynix, Toshiba, Kingston, and Micron families. When a customer brings in a dead phone with a suspected eMMC fault — corrupted firmware, bad blocks, or a chip that survived a bad flash — you can pull the IC, seat it in this socket, and let UFI-Box read the user data, repair partitions, resize, format, or rewrite firmware without touching a hot air station again. This is chip-off work, so it fits naturally into your eMMC repair workflow: remove the IC from the board, clean the pads, place the chip in the socket with correct orientation, and run your UFI-Box software from there. Technicians handling FRP lock removal, pattern unlock, or boot loop issue cases where software-level fixes on the board have failed often rely on exactly this kind of direct-to-chip approach, since it bypasses whatever is broken on the phone's own board and interfaces with the eMMC directly. Build quality matters here because BGA221 pitch is tight, and a socket with weak or misaligned pins gives you false reads or connection drops mid-operation. This adapter is made to seat the chip securely and hold contact through a full read/write cycle, which matters when you are running a firmware rewrite that takes several minutes and can't afford a disconnect halfway through. For a repair shop juggling multiple device brands, having a BGA221 socket on the bench means you are not limited to one chipset family. Since eMMC storage in this package size shows up across a wide spread of Android devices, this adapter becomes a general-purpose tool for your eMMC/UFS repair station rather than something you use for one specific model. Pair this with your existing ISP pinout tools and eMMC programmer setup, and you cover both in-circuit and chip-off eMMC work. If your bench already runs UFI-Box for ISP-mode repairs on dead phones, this socket extends that same tool into chip-off territory, giving you one workflow across two repair methods instead of needing separate boxes. Handle the chip with anti-static precautions when placing it in the socket, and always confirm chip orientation against the socket markings before running any write operation, since a wrong pin alignment on a live write can damage the IC permanently.

Key Features

Dedicated BGA221 (221-FBGA) socket built for UFI-Box

Supports major eMMC/eMCP chip brands: Samsung, SK Hynix, Toshiba, Kingston, Micron

Enables chip-off testing without reballing onto a donor board

Secure pin contact for stable read/write during firmware operations

Works alongside ISP-mode UFI-Box repairs for a combined workflow

Reusable across multiple repair jobs on the same bench

Compact design fits standard GSM repair workstations

Supports read, repair, resize, format, and firmware update operations on eMMC

Specifications

Brand Entity UFI
Product Entity eMMC/eMCP Socket 221-FBGA (BGA221 Test Adapter)
Technology Entity eMMC, eMCP, BGA221 packaging
Compatible Device Entities Samsung, SK Hynix, Toshiba, Kingston, Micron eMMC chips
Repair Process Entity Chip-off eMMC repair, firmware rewriting, data recovery
Industry Entity GSM mobile repair, PCB-level repair

Compatible Devices

eMMC/eMCP chips in the 221-FBGA (BGA221) package from Samsung, SK Hynix, Toshiba, Kingston, and Micron — chipset/package-family compatibility, not tied to a specific phone model.

Common Repair Uses

Chip-off eMMC reading and repair, eMMC firmware rewriting and formatting, dead-after-flash recovery, boot loop issue troubleshooting, and FRP/pattern lock removal cases requiring direct eMMC access.

FAQ

What is the product name?
The product name is UFI EMMC/eMCP Socket 221-FBGA Test Adapter.
What is the brand of this product?
The brand of this product is UFI.
What is this product used for?
This product is used for chip-off testing, reading, and repairing eMMC/eMCP chips using UFI-Box.
Which devices are compatible with this product?
This adapter is compatible with eMMC/eMCP chips in the BGA221 (221-FBGA) package from brands like Samsung, SK Hynix, Toshiba, Kingston, and Micron.
Who should use this product?
This product is suitable for mobile repair technicians, GSM software technicians, repair shops, and service centers doing eMMC chip-off work.
Does this socket support ISP mode for dead phones?
This socket is built for chip-off (off-board) eMMC work; ISP-mode repairs on dead phones use a separate UFI-Box ISP pinout tool, not this socket.
Can this adapter be used with any eMMC programmer box other than UFI-Box?
No, this socket is built specifically for compatibility with UFI-Box and is not confirmed to work with other eMMC programmer boxes.

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