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UMP510G Power IC

UMP510G Power IC

Regular price Rs.250.00 PKR
Regular price Sale price Rs.250.00 PKR
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The UMP510G Power IC is a replacement power management chip built for Huawei motherboard repair work. When a board comes in dead, stuck on logo, or drawing no current at all, this IC is often the part sitting behind the fault. It handles power sequencing and voltage delivery to the board's core components, so a damaged or corroded UMP510G can take the whole phone down with it. Technicians reach for this chip during dead-after-flash cases, no-power diagnostics, and board-level rework where the original IC shows heat damage, corrosion, or a failed continuity test. Soldered directly to the motherboard using standard BGA rework equipment.

⚖️ Weight: 0.01 kg

SKU:MST-IC-271

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Description

A dead Huawei board rarely announces its cause of death clearly. No display, no charging LED, no current draw on the power supply — and the fault tree usually leads straight to the power IC. The UMP510G sits at the center of that fault tree. It manages voltage sequencing and power delivery to the board's core circuits, which means a single failed pin or a corroded ball on this chip can take out charging, boot, and display response all at once.You'll usually meet this IC in one of three situations on your bench: a phone that's completely dead with zero current draw, a board that went dead after a failed flash attempt, or a unit that's been through liquid damage and now shows corrosion around the power section. In each case, the diagnostic path is the same — isolate the power rail, check continuity against a known-good board or schematic, and confirm the fault sits at the IC before you commit to reballing or replacing it.Replacing a power IC isn't a job for a rushed bench session. Preheat the board evenly to avoid stressing nearby components, use a fume extractor since the flux and old solder release fumes you don't want to breathe over a full shift, and confirm your hot air station's temperature profile matches the IC's package before you touch it. A cracked pad or lifted trace at this stage turns a simple IC swap into a much longer board-repair job.This UMP510G is a brand-new compatible unit, not a pulled or refurbished chip — which matters more than it sounds for power ICs specifically, since a used unit with hidden thermal stress can fail again within days of reballing. It's manufactured to match the original footprint and pinout, so it drops into place on a Huawei board without modifying pads or routing new jumpers.For your workflow, this chip fits directly into the power-diagnosis stage: multimeter continuity check, thermal camera or thermal imaging to spot the hot component under load, then IC removal and replacement once you've confirmed the fault isn't upstream at the battery connector or charging port. Pair it with a proper BGA rework station and a stencil sized for this footprint, and reflow it under a microscope if your bench setup allows — power ICs have enough pins packed tightly that a visual solder-joint check afterward is worth the extra two minutes.Keep in mind this is a bare IC, not a full board or module — you're doing a component-level repair here, not a board swap. If a technician on your team is newer to power-IC rework, this is a good chip to practice reballing technique on before moving to denser, more expensive ICs where a mistake costs more.Stock this one alongside your other Huawei power-section parts and BGA rework consumables — dead phone and no-power cases involving this platform come through often enough that having it on the shelf saves a same-day turnaround more often than not.

Key Features

Brand-new compatible IC, not a pulled or refurbished unit

Matches original footprint and pinout for direct board fitment

Built for Huawei motherboard power-section replacement

Suited for dead phone and no-power fault diagnosis

Useful in dead-after-flash board recovery work

Fits standard BGA rework and reballing workflows

Precision manufacturing for accurate pad alignment

Supports liquid-damage board repair on affected units

Specifications

Brand Entity Compatible / Aftermarket Replacement IC
Product Entity UMP510G Power IC
Technology Entity Power Management IC (PMIC)
Compatible Device Entities Huawei Smartphones
Repair Process Entity BGA Rework, IC Reballing, Power-Section Diagnosis
Industry Entity Mobile Phone Repair, PCB Repair

Compatible Devices

Huawei smartphones using this power IC in the board's power management section. Exact model-level fitment is not published by suppliers — confirm against the original IC marking or board schematic before ordering for a specific model.

Common Repair Uses

Dead phone / no power diagnosis, dead-after-flash board recovery, liquid-damage board repair where the power section shows corrosion, and power IC reballing or replacement during motherboard-level rework.

FAQ

What is the product name?
The product name is UMP510G Power IC.
What is the brand of this product?
This is a brand-new compatible replacement IC, not an OEM-branded part.
What is the model of this product?
The model is UMP510G.
What is this product used for?
It's used to replace a faulty power management IC on Huawei motherboards during dead phone and no-power repairs.
Which devices are compatible with this product?
It's compatible with Huawei phones that use this IC in the power management section; confirm exact model fitment against your board's schematic or the original IC marking.
Who should use this product?
Mobile repair technicians, GSM software and hardware technicians, and repair shops handling Huawei board-level work.
Does the UMP510G IC fix a dead phone with no power at all?
Yes, when the fault is isolated to the power IC through continuity testing rather than the charging port, battery connector, or PMIC feed lines.
Can the UMP510G be replaced without a full BGA rework station?
It's designed for standard BGA rework equipment — hot air station, stencil, and flux — so a proper rework setup is needed for a clean reflow and reliable joint.

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