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WCN3950 004 Wifi iC

WCN3950 004 Wifi iC

Regular price Rs.250.00 PKR
Regular price Sale price Rs.250.00 PKR
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The WCN3950-004 is a Qualcomm-designed single-die WiFi, Bluetooth, and FM combo IC built for select Xiaomi Redmi motherboards. It handles dual-band 802.11 a/b/g/n/ac WiFi and Bluetooth 5.0 signal processing on one chip. Technicians reach for this IC when a phone shows a dead WiFi toggle, weak signal, auto-disconnect issue, or hardware-missing error on the network settings screen. Fitted mainly on Redmi Note 8, Redmi Note 4, Redmi 6 Pro, and Mi A1 boards, it restores wireless function without needing a full motherboard swap. A reliable, budget-friendly fix for any repair bench handling WiFi complaints on these models.

⚖️ Weight: 0.01 kg

SKU:MST-IC-185

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Description

Every GSM technician eventually gets a phone where WiFi refuses to turn on, or turns on and drops the connection within seconds. Before blaming software, check the board — on Redmi Note 8, Redmi Note 4, Redmi 6 Pro, and Mi A1 units, the WCN3950-004 is usually the part responsible for that exact symptom.This chip is a single-die combo IC from Qualcomm's WCN39xx family. It packs WLAN, Bluetooth, and FM support into one 58-pin WLPSP package, which is why a single failed solder joint or a moisture-damaged pad can wipe out WiFi, Bluetooth, and FM tuner function together. If you're troubleshooting a board where all three symptoms show up at once — no WiFi networks detected, Bluetooth pairing fails, FM radio app crashes — that pattern points straight at this IC rather than three separate faults.On the wireless side, it covers 802.11 a/b/g/n/ac standards across both 2.4GHz and 5GHz bands, so a working chip gives the phone dual-band capability rather than 2.4GHz-only performance. On the Bluetooth side, it supports BT5.0 qualification, covering both classic Bluetooth and BLE profiles used by earbuds, smartwatches, and file transfer.Power draw sits low, in the roughly 0.5W dissipation range, running off a 1.5V–5V input rail depending on board design. That low draw matters on the bench too — if you're seeing abnormal current spikes near this IC's footprint during a short-circuit test, that's a strong sign the chip itself has shorted internally rather than a fault elsewhere on the board.Reballing this chip needs the same discipline as any fine-pitch BGA/WLPSP job. Cover the surrounding area with heat-insulation tape, hold the board steady in a catcher, apply flux evenly, and keep hot air under 350°C to avoid lifting neighboring pads or warping the PCB. After removal, clean the footprint thoroughly before reballing and reflow — a rushed cleaning job is the most common reason a "new" IC still shows a dead WiFi toggle after replacement.Where this IC sits in the repair workflow: it's a board-level component replacement, not a software fix. If a customer's phone shows "WiFi not turning on" but the toggle itself responds and just won't scan, run a software reset first — reflash and clear network settings before assuming hardware fault. If the toggle is greyed out entirely, doesn't respond, or the phone shows no WiFi hardware detected in engineering mode, that's your confirmation to move to IC-level diagnosis and reballing.Buy genuine, tested stock rather than pulled or reused chips for this job. A WCN3950-004 with hairline internal damage can pass a visual check and still fail intermittently after reflow, sending the phone back to your bench within days. For a repair shop working through a steady stream of Redmi WiFi complaints, keeping verified WCN3950-004 stock on hand cuts diagnosis-to-delivery time significantly, since this single IC accounts for a large share of WiFi hardware faults on these specific models.Pair this IC with a quality hot air station, fine-tip tweezers, flux paste, and a stencil matched to the 58-pin WLPSP footprint for a clean, repeatable reballing job every time.

Key Features

Single-die combo IC covering WiFi, Bluetooth, and FM in one package

Dual-band 802.11 a/b/g/n/ac support for 2.4GHz and 5GHz networks

Bluetooth 5.0 qualification with BLE support

Low power dissipation for stable daily battery performance

Direct board-level replacement, no motherboard swap needed

Fits verified footprint on Redmi Note 8, Redmi Note 4, Redmi 6 Pro, Mi A1

Resolves combined WiFi, Bluetooth, and FM faults from one root cause

Suitable for professional reballing on standard hot air rework stations

Specifications

Brand Entity Qualcomm
Product Entity WCN3950-004 WiFi IC
Technology Entity 802.11ac WLAN, Bluetooth 5.0, WLPSP packaging
Compatible Device Entities Xiaomi Redmi Note 8, Redmi Note 4, Redmi 6 Pro, Mi A1
Repair Process Entity BGA reballing, IC replacement, hot air rework
Industry Entity Mobile Phone Repair, PCB Repair, GSM Technician Workflow

Compatible Devices

Xiaomi Redmi Note 8, Redmi Note 4, Redmi 6 Pro, and Mi A1 (verified board-level compatibility; confirm exact PCB revision before reballing)

Common Repair Uses

WiFi not turning on, weak or dropping WiFi signal, WiFi hardware not detected, auto-disconnect issues, Bluetooth pairing failure, FM radio malfunction, board-level IC reballing and replacement

FAQ

What is the product name?
The product name is WCN3950-004 WiFi IC.
What is the brand of this product?
The brand of this product is Qualcomm.
What is the model of this product?
The model of this product is WCN3950-004.
What is this product used for?
This product is used to repair WiFi, Bluetooth, and FM hardware faults on supported Xiaomi motherboards.
Which devices are compatible with this product?
This product is compatible with Xiaomi Redmi Note 8, Redmi Note 4, Redmi 6 Pro, and Mi A1.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this IC support both WiFi and Bluetooth together?
Yes, the WCN3950-004 is a single-die combo chip that handles WiFi, Bluetooth, and FM functions on one IC.
What package type does this IC use, and does it affect reballing?
It uses a 58-pin WLPSP package, which requires precise stencil alignment and controlled heat under 350°C during reballing to avoid pad damage.

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