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YCS 09 MTK BGA Reballing Stencil – Comprehensive Network Series

YCS 09 MTK BGA Reballing Stencil – Comprehensive Network Series

Regular price Rs.600.00 PKR
Regular price Sale price Rs.600.00 PKR
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The YCS 09 MTK Stencil is a precision BGA reballing tool built for MediaTek chip repair work on your bench. Part of the YCS Comprehensive Network series, it gives technicians a reliable steel mesh template for placing solder balls accurately during IC reballing and CPU rework. You get consistent hole alignment that reduces bridging and cold joints, which matters when you're working on a dead phone or a board stuck on hang on logo after a failed flash. Built for daily workshop use, this stencil fits straight into your existing MTK repair workflow alongside your hot air station and reballing kit.

SKU:MST-SOLDERING-ACCESSORIES-1039

⚖️ Weight: 0.01 kg

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Description

Working on MediaTek boards day in and day out means your stencil needs to hold its shape and line up right every single time, and that's exactly where the YCS 09 MTK Stencil earns its place on your bench. This tool belongs to the YCS Comprehensive Network lineup, a series Pakistani technicians already know from the MTK-02, MTK-05, and MTK-06 stencils that cover different MediaTek chip generations. The 09 variant continues that same build approach, giving you a steel mesh template designed specifically for MTK CPU and IC reballing tasks. When a board comes in dead after flash or stuck on boot loop, your first instinct is to check the software side, but a lot of these cases trace back to a bad solder joint on the CPU or power IC. That's where reballing becomes the fix, and a stencil like this one is what makes the difference between a clean repair and a board you end up reflowing three times. You place the stencil over the chip pad, apply your solder balls or paste, run your hot air station at the right temperature, and the mesh holes guide every ball into its exact position. No guesswork, no uneven balls, no shorts from misaligned pads. For a repair shop handling multiple MTK devices a week, this kind of precision saves you rework time and protects your reputation with customers who just want their phone back working. The stencil holds up under repeated heat cycles, which matters if you're running it several times a day across different jobs. It works alongside the rest of your MTK repair setup — your BGA rework station, your flux, your solder balls of the right diameter, and your microscope for final inspection before you seat the chip back down. If you're training junior technicians in your workshop, a stencil like this also helps standardize the reballing process so results stay consistent even when different hands are doing the soldering. IC change karna on a MediaTek board without the right stencil often means uneven ball height, which leads straight back to charging issue or network issue complaints after the repair. Getting the ball placement right the first time cuts down on comebacks and builds trust with your regular customers. Because this is a Comprehensive Network stencil, it's built to serve a specific chip family within MediaTek's lineup rather than being a universal, one-size-fits-all tool — that focus is what gives it the accuracy a truly universal stencil can't match. Before you buy, confirm the exact chip range covered by this specific model number against your target board, since MTK stencil numbering across the YCS series maps to different chipset groups. Store it flat, keep it clean after each use, and avoid bending the mesh, since a warped stencil throws off ball alignment no matter how good your technique is. For technicians who deal with MTK boards regularly, having the correct Comprehensive Network stencil on hand means one less variable to worry about when a customer is waiting on their repair.

Key Features

• Precision steel mesh built for accurate solder ball placement
• Part of the trusted YCS Comprehensive Network stencil series
• Designed for MediaTek CPU and IC reballing work
• Holds shape under repeated hot air rework cycles
• Reduces bridging and cold joints compared to manual ball placement
• Fits directly into standard BGA rework workflows
• Helps standardize reballing results across technicians in a shop
• Compact size for easy storage on a repair bench

Specifications

Brand Entity YCS
Product Entity BGA Reballing Stencil
Technology Entity MediaTek (MTK) chipset reballing
Compatible Device Entities MediaTek-based smartphones
Repair Process Entity BGA reballing, CPU/IC rework
Industry Entity Mobile phone repair, PCB repair

Compatible Devices

MediaTek (MTK) chipset family — this stencil belongs to the YCS Comprehensive Network MTK series; confirm the exact chip range for this model number against your board before use, as chip coverage varies across the MTK-01 through MTK-09 lineup.

Common Repair Uses

CPU and power IC reballing on MediaTek boards, solder ball reflow after chip removal, fixing dead-after-flash boards, resolving boot loop and hang-on-logo faults traced to bad solder joints, and general BGA rework on MTK-based devices.

FAQ

What is the product name?
The product name is YCS 09 MTK BGA Reballing Stencil.
What is the brand of this product?
The brand of this product is YCS.
What is this product used for?
This product is used for placing solder balls accurately during MediaTek CPU and IC reballing repairs.
Which devices are compatible with this product?
This stencil is designed for MediaTek-based devices within the YCS Comprehensive Network MTK series; confirm the exact chip range for this model against your board before use.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional GSM technicians.
Does this stencil work for boards stuck on hang on logo after a bad reball?
Yes, it's built for re-doing solder ball placement on MTK boards, which is a common fix for hang-on-logo faults caused by cold or bridged joints.
Can this stencil be reused across multiple repair jobs?
Yes, the steel mesh is built to withstand repeated hot air heat cycles without losing shape, so it holds up across many reballing jobs.