YCS 138° 50g BGA Solder Reballing Paste

When a CPU or memory chip needs reballing on a board that already took heat once, every extra degree works against you. The YCS 138° 50g BGA Solder Reballing Paste gives you a low-temperature option that melts at 138°C, well below the 183°C of a standard medium-temperature paste, so you can plant fresh balls and reflow chips without cooking the parts around them. YCS offers this paste in five temperature grades: 138°C and 150°C for low-temperature work, 183°C for medium temperature, and 199°C and 215°C for high-temperature jobs. The 138° grade sits at the gentlest end of that range, and that is exactly why technicians keep a jar of it next to the hot air station.
Modern phones pack underfill, plastic FPC connectors, camera modules and stacked board layers into a very small space. Heat at 183°C and above can lift small capacitors, warp connector housings, or soften the adhesive that holds shields and layers together. A 138°C melting point lets you run your hot air at a lower setting and finish the reflow faster, which protects everything you never planned to touch. That difference shows on real jobs: a dead phone with a suspected CPU joint fault, a hang on logo case caused by a cracked BGA joint, a boot loop issue traced to a weak memory chip connection, or a charging issue where the PMIC or charging IC needs a clean reflow.
On the bench, the paste behaves the way a reballing job demands. YCS balances flow and stability in this formula, so the paste spreads evenly across the stencil, fills each hole, and stays there when you lift the stencil away. The viscosity stays steady through the heating cycle, so balls form round and chips do not drift off their pads during reflow. The paste wets the pads strongly and resists oxidation, which gives you bright, full joints instead of dull, grainy ones. You get fewer false joints, fewer comebacks, and more confidence when you hand the phone back to the customer.
A typical workflow looks like this. You lift the chip with your hot air station, clean the old solder from the chip and the board pads with a soldering iron and wick, then align the chip on its reballing stencil. You spread a thin layer of the YCS 138° 50g BGA Solder Reballing Paste across the stencil with a spatula, scrape off the excess, and heat until the paste melts and pulls into uniform balls. After a quick inspection under the microscope, you apply flux to the board, place the chip, and reflow it into position. A multimeter check on the relevant lines confirms the job before you power the phone up.
Low-temperature paste also helps when you work close to heat-sensitive areas, such as chips sitting next to connectors or modules that you cannot remove first. Keep in mind that joints which face high operating heat or mechanical stress often suit a medium-temperature grade better, so many technicians keep both a 138°C and a 183°C paste on the bench and choose by job.
This paste works best as part of a complete BGA setup. Pair it with the right stencils from our Reballing Kits category, a stable Hot Air Station for controlled reflow, a Soldering Station for pad cleaning, and a PCB Holder that keeps the board flat and steady while you work. A Microscope lets you inspect every ball before placement, and a Multimeter helps you confirm the repair on the board. When your workload grows, a digital hot air station with precise airflow and temperature control is the natural upgrade, because low-temperature paste rewards accurate heat.
The 50g jar size keeps the paste easy to handle and quick to store. Take only the amount you need on your spatula and close the lid right away to keep the rest fresh for the next job. Order the YCS 138° 50g BGA Solder Reballing Paste from KB GSM Store at a practical price in Pakistan and keep a reliable low-temperature paste ready for your repair bench.