YCS 150°50g Soldering Pasta Black Bottle

When a CPU or BGA IC on a mobile board needs fresh balls, the paste you choose decides whether the joint holds or the phone comes back as a dead phone a week later. The YCS 150°50g Soldering Pasta Black Bottle gives you a low-temperature tin paste rated at 150°C, packed in a 50g bottle that sits comfortably on any repair bench. YCS, the repair brand from Yang Changshun repair home, builds this paste for precision BGA, IC, CPU and PCB work, so it targets exactly the jobs Pakistani technicians handle every day on smartphone motherboards.
A 150°C melting point sits well below the mid-temperature 183°C class and the high-temperature 199°C and 215°C grades in the same YCS lineup. That gap gives you real control at the rework station. You reflow the paste with less heat on the board, so nearby capacitors, shielded RF sections and plastic connectors face less thermal stress. On boards where heat damage already triggered a hang on logo or boot loop issue, every degree you save protects the components you do not want to touch. You also reduce the risk of lifting pads on heat-tired motherboards that have already gone through earlier repairs.
YCS designs this range for ball planting, the core step in IC and CPU reballing. You spread the paste across your stencil, scrape it level, and heat it until the tin pulls into round, even balls. The paste keeps a smooth, viscous body that resists collapse and offset, so the balls stay where the stencil puts them and do not bridge into neighboring pads. For eMMC, UFS, PMIC and CPU reballing, that consistency saves you a second attempt and spares the chip from repeated heat cycles. Pair it with a quality reballing kit and a PCB holder, and your stencil work becomes repeatable job after job.
On the daily bench, the paste offers good anti-oxidation behavior and strong wettability, so it flows onto clean pads and forms bright joints. Its fine, uniform texture makes it easy to pick up small amounts on a tweezer tip or spatula for tinning individual pads during charging issue repairs, display connector jobs or network issue IC replacement. The 50g black bottle holds enough paste for a busy shop to work through a large volume of jobs, and the compact size fits beside your hot air station without cluttering the bench. Close the lid tightly after every job and keep the bottle in a cool place, because air and heat change the working consistency of any solder paste. After cold storage, let it return to room temperature before opening so moisture does not condense inside.
This paste belongs to the soldering and rework stage of your repair workflow. It works alongside your hot air station for reflow, your soldering station for spot tinning, a microscope for inspecting ball shape, and a multimeter for checking shorts after the chip goes down. Shops that also handle high-heat jobs can keep a 183°C or higher-grade YCS paste nearby, then pick the 150°C grade for heat-sensitive boards and step soldering where the first joint must not melt again. For the upgrade path, a reballing kit with brand-specific stencils and a magnetic BGA platform turns this paste into a complete reballing setup.
If you run a repair shop in Lahore, Karachi, Islamabad or anywhere across Pakistan and handle CPU, IC and BGA jobs regularly, the YCS 150°50g Soldering Pasta Black Bottle earns its place on your bench. Order it from KB GSM Store at a fair price in Pakistan and keep a low-temperature paste ready for the jobs where heat control decides the outcome.